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Proceedings Papers

Effects of Field Plate on the Maximum Temperature and Temperature Distribution for GaN HEMT Devices

Dogacan Kara, Nazli Donmezer, Talha Furkan Canan, Ozlem Sen, Ekmel Ozbay
Proc. ASME. HT2016, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems, V001T04A003, July 10–14, 2016
Paper No: HT2016-7367
DOI: https://doi.org/10.1115/HT2016-7367
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Topics: Gallium nitride, Temperature, Temperature distribution, Electric fields, Electron mobility, Heating, Plates (structures), Transistors, Engineering simulation, Finite element analysis
Proceedings Papers

A Roadmap for Building Thermal Models for AlGaN/GaN HEMTs: Simplifications and Beyond

Mohammad Azarifar, Nazli Donmezer
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T11A006, July 10–14, 2016
Paper No: HT2016-7383
DOI: https://doi.org/10.1115/HT2016-7383
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Topics: Gallium nitride, Heat, Heat transfer, Engineering simulation, Simulation, Boundary-value problems, Design, Electron mobility, Heating, High temperature
Proceedings Papers

2-D Simulation of Hot Electron-Phonon Interactions in a Submicron Gallium Nitride Device Using Hydrodynamic Transport Approach

Angie Fan, Calin Tarau, Richard Bonner, Tomas Palacios, Massoud Kaviany
Proc. ASME. HT2012, Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer, 685-693, July 8–12, 2012
Paper No: HT2012-58322
DOI: https://doi.org/10.1115/HT2012-58322
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Topics: Electron-phonon interactions, Gallium nitride, Simulation, Electrons, Density, Electric fields, Gallium arsenide, Heat, Phonons, Acoustics
Proceedings Papers

Construction of a Broad-Based Experimental and Computational Test Capability for High Power Wide Bandgap Semiconductor Devices

Jason A. Carter, Matthew D. Roth, Michael W. Horgan, Lisa Shellenberger, Daniel P. Hoffmann, Mark D. Stitt
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 365-372, July 8–12, 2007
Paper No: HT2007-32127
DOI: https://doi.org/10.1115/HT2007-32127
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Topics: Construction, Wide band gap semiconductors, Gallium nitride, Temperature, Electron mobility, Gates (Closures), Numerical analysis, Operating temperature, Silicon, Stress