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Proceedings Papers

Numerical Heat Transfer Simulations and Parametric Investigations Using Crossed Array Design of Experiments Approach During RFA of Breast Tumor

Sandeep Sulake, Satish Kumar Dubey, Arshad Javed
Proc. ASME. HT2019, ASME 2019 Heat Transfer Summer Conference, V001T02A002, July 14–17, 2019
Paper No: HT2019-3469
DOI: https://doi.org/10.1115/HT2019-3469
View Paper titled, Numerical Heat Transfer Simulations and Parametric Investigations Using Crossed Array Design of Experiments Approach During RFA of Breast Tumor
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Topics: Engineering simulation, Experimental design, Heat transfer, Radiofrequency ablation, Simulation, Tumors, Ablation (Vaporization technology), Biological tissues, Temperature, Bioheat transfer
Proceedings Papers

Study of Nanoimprinting Process and its Application for Infrared Detection

Je Kyun Lee, Sangyup Song, Puminun Vasinajindakaw, Michael McGinley, CheFu Su, Junwei Su, ByungWook Son, Plamen Atanassov, Hongwei Sun
Proc. ASME. HT2012, Volume 1: Heat Transfer in Energy Systems; Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat and Mass Transfer in Biotechnology; Environmental Heat Transfer; Visualization of Heat Transfer; Education and Future Directions in Heat Transfer, 947-953, July 8–12, 2012
Paper No: HT2012-58367
DOI: https://doi.org/10.1115/HT2012-58367
View Paper titled, Study of Nanoimprinting Process and its Application for Infrared Detection
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Topics: Coating processes, Coatings, Experimental design, Infrared radiation, Lithography, Microscale devices, Nanocrystals, Nanofabrication, Nanolithography, Nanomanufacturing
Proceedings Papers

Thin Film Evaporation Using Nanoporous Membranes for Enhanced Heat Transfer

Rong Xiao, Shalabh C. Maroo, Evelyn N. Wang
Proc. ASME. HT2012, Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer, 103-107, July 8–12, 2012
Paper No: HT2012-58352
DOI: https://doi.org/10.1115/HT2012-58352
View Paper titled, Thin Film Evaporation Using Nanoporous Membranes for Enhanced Heat Transfer
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Topics: Evaporation, Heat transfer, Membranes, Thin films, Heat transfer coefficients, Coolants, Flux (Metallurgy), Heat, Thermal management, Design
Proceedings Papers

Effect of Hole Shape on Flow Resistance of Perforated Plates for Natural Air Cooled Electronic Equipment

Katsuhiro Koizumi, Masaru Ishizuka, Shinji Nakagawa
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 713-718, July 8–12, 2007
Paper No: HT2007-32100
DOI: https://doi.org/10.1115/HT2007-32100
View Paper titled, Effect of Hole Shape on Flow Resistance of Perforated Plates for Natural Air Cooled Electronic Equipment
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Topics: Electronic equipment, Flow (Dynamics), Plates (structures), Shapes, Experimental design, Reynolds number, Natural convection
Proceedings Papers

Thermal Management of Heat Generating Devices in Close Proximity on Printed Circuit Boards

Jared Harvest, Amy S. Fleischer, Randy D. Weinstein
Proc. ASME. HT2005, Heat Transfer: Volume 4, 599-605, July 17–22, 2005
Paper No: HT2005-72254
DOI: https://doi.org/10.1115/HT2005-72254
View Paper titled, Thermal Management of Heat Generating Devices in Close Proximity on Printed Circuit Boards
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Topics: Heat, Printed circuit boards, Thermal management, Separation (Technology), Computational fluid dynamics, Density, Experimental design, Geometry, Maintenance, Natural convection
Proceedings Papers

Thermal Stress Reduction and Optimization for Orthotropic Composite Boards

Amir Khalilollahi, Russell L. Warley
Proc. ASME. HT2005, Heat Transfer: Volume 4, 267-272, July 17–22, 2005
Paper No: HT2005-72570
DOI: https://doi.org/10.1115/HT2005-72570
View Paper titled, Thermal Stress Reduction and Optimization for Orthotropic Composite Boards
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Topics: Composite materials, Lumber, Optimization, Thermal stresses, Fibers, Stress, Finite element model, Heat transfer coefficients, Temperature gradient, Computational fluid dynamics
Proceedings Papers

Development of Thermal Flow Simulation Method for Electronic Equipment Integrated With Electric Circuit Design: Application to the Thermal Design of a Natural Convection Air Cooling SMPS

Katsuhiro Koizumi, Masaru Ishizuka
Proc. ASME. HT-FED2004, Volume 4, 265-272, July 11–15, 2004
Paper No: HT-FED2004-56062
DOI: https://doi.org/10.1115/HT-FED2004-56062
View Paper titled, Development of Thermal Flow Simulation Method for Electronic Equipment Integrated With Electric Circuit Design: Application to the Thermal Design of a Natural Convection Air Cooling SMPS
Click here to open pdf in another window PDF for Development of Thermal Flow Simulation Method for Electronic Equipment Integrated With Electric Circuit Design: Application to the Thermal Design of a Natural Convection Air Cooling SMPS
Topics: Circuit design, Cooling, Design, Electronic equipment, Flow simulation, Natural convection, Power semiconductor devices, Computational fluid dynamics, Heat, Circuits
Proceedings Papers

VAT Based Optimization of Heat Transfer in a Flat Channel Filled With a Porous Media

Ivan Catton, Kunzhong Hu
Proc. ASME. HT2003, Heat Transfer: Volume 1, 645-653, July 21–23, 2003
Paper No: HT2003-47120
DOI: https://doi.org/10.1115/HT2003-47120
View Paper titled, VAT Based Optimization of Heat Transfer in a Flat Channel Filled With a Porous Media
Click here to open pdf in another window PDF for VAT Based Optimization of Heat Transfer in a Flat Channel Filled With a Porous Media
Topics: Heat transfer, Optimization, Porous materials, Energy dissipation, Computer simulation, Experimental design, Friction, Heat, Heat exchangers, Heat sinks