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Keywords: Thermal ManagementClose
Proc. ASME. HT2022, ASME 2022 Heat Transfer Summer Conference, V001T16A002, July 11–13, 2022
Paper No: HT2022-85400
... Prashant Singh Mechanical Engineering Dept. Mississippi State University Mississippi State, MS Roop L. Mahajan Mechanical Engineering Dept. Virginia Tech Blacksburg, VA USA ABSTRACT With increasing thermal footprint in electronic packages, metal lattices offer avenues for better thermal management...
Proc. ASME. HT2020, ASME 2020 Heat Transfer Summer Conference, V001T12A009, July 13–15, 2020
Paper No: HT2020-8998
...COPPER-CARBON NANOTUBE MICROPILLARS FOR PASSIVE THERMAL MANAGEMENT OF HIGH HEAT FLUX ELECTRONIC DEVICES Gerardo Rojo and Jeff Darabi1 Department of Mechanical Engineering Southern Illinois University Edwardsville Edwardsville, IL 62026, USA ABSTRACT Miniaturization of electronic products...
Proc. ASME. HT2019, ASME 2019 Heat Transfer Summer Conference, V001T10A008, July 14–17, 2019
Paper No: HT2019-3651
... to increasing power densities and decreasing device footprints, thermal management has become an important design requirement in modern electronic devices. Loop heat pipes are phase change-based devices that can absorb and transport large heat fluxes via the latent heat of evaporation of a working fluid...
Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 113-127, July 19–23, 2009
Paper No: HT2009-88133
.... It is also shown that the dependence of water transport on the CPSRs can be significantly influenced by the use of a hydrophobic air filter layer at the cathode. fuel cell passive DMFC two-phase mass transport model capillary pressure water transport thermal management 1 Copyright © 2009...
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 3, 267-274, July 8–12, 2007
Paper No: HT2007-32537
... consumed was formulated, thus facilitating the selection of a cold plate for a practical application. KEYWORDS Electronics Cooling, Thermal Management, Liquid Cooling, Primary Heat Exchangers, Cold Plates NOMENCLATURE A Surface Area [m2] pC Heat Capacity [J/kgK] C Constant [oC/W] h Heat Transfer...
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 3, 313-320, July 8–12, 2007
Paper No: HT2007-32623
... to axial conduction through the adiabatic section of the prototype VCHP. However, excluding these low ambient temperatures, the VCHP provides a significant reduction in power consumption compared to a TEM. Thermal Management Precision Temperature Control Variable Conductance Heat Pipe...
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 893-900, July 8–12, 2007
Paper No: HT2007-32519
... 07 04 2009 Thermal management has become a key point in the development of contemporary electronics systems. It is evident that heat fluxes are currently approaching the limits of conventional forced air cooling, and that liquid cooling technologies are now under consideration. Most...
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 817-823, July 8–12, 2007
Paper No: HT2007-32596
... to the conduction of current. Thermal impedance measurements showed a strong dependency of contact resistance with percentage loading. Finally, the feasibility of deploying carbon nanotube-polymer composites as practical thermal interface materials for electronics thermal management is discussed. Thermal...
Proc. ASME. HT2005, Heat Transfer: Volume 3, 355-360, July 17–22, 2005
Paper No: HT2005-72425
... 03 04 2009 It is well known that drilling is one of the most difficult metalwork cutting operations, not only from the viewpoint of manufacturing process, but also from the thermal management point of view of the drill. For the drilling process, due to its long time continuous metal...
Proc. ASME. HT-FED2004, Volume 1, 965-971, July 11–15, 2004
Paper No: HT-FED2004-56528
... 03 03 2009 The recent miniaturization of electronic devices and compaction of computer systems will soon lead to data centers with power densities of the order of 300 W/ft 2 . At these levels, traditional thermal management techniques are unlikely to suffice. To enable the dynamic...
Proc. ASME. HT-FED2004, Volume 3, 661-666, July 11–15, 2004
Paper No: HT-FED2004-56410
...-state lasers become more erful, improved thermal management techniques are uired. Minimizing thermal gradients in the laser increases ormance and reduces thermal stress, which can cause ure by fracturing. Two-phase sprays provide an isothermal ling method capable of dissipating high heat fluxes duced...