The purpose of this paper is to develop a novel assembly information model, hierarchical assembly pair (HAP), as the basis of rapid assembly modeling, which aims to refine the current product-modeling paradigm and forms an advanced product-modeling framework. Apart from the geometry level, this model expresses the designer’s assembly design intent (ADI) at the feature level and part level, thus forming three sub models. Based on the model, some new technologies in the field of CAD can be integrated to promote the ADI’s automatic transformation at different levels and efficient transmission between structure-similar part models. Moreover, as the carrier of ADI, HAP can be embedded into the part models at part modeling stage and instantiated to assemble the parts at assembly modeling stage, thus reducing numerous tedious and error-prone operations such as picking up geometry elements and inputting constraint commands. The example of machine vice proves the validity of the model.
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ASME 2018 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
August 26–29, 2018
Quebec City, Quebec, Canada
Conference Sponsors:
- Design Engineering Division
- Computers and Information in Engineering Division
ISBN:
978-0-7918-5172-2
PROCEEDINGS PAPER
An Assembly Information Model for Rapid Assembly Modeling
Zhuo Lv,
Zhuo Lv
Beijing Institute of Technology, Beijing, China
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Xu Zhang,
Xu Zhang
Beijing Institute of Technology, Beijing, China
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Haoqi Wang,
Haoqi Wang
Beijing Institute of Technology, Beijing, China
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Wei Ming
Wei Ming
Beijing Institute of Technology, Beijing, China
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Zhuo Lv
Beijing Institute of Technology, Beijing, China
Xu Zhang
Beijing Institute of Technology, Beijing, China
Haoqi Wang
Beijing Institute of Technology, Beijing, China
Wei Ming
Beijing Institute of Technology, Beijing, China
Paper No:
DETC2018-85427, V01AT02A021; 7 pages
Published Online:
November 2, 2018
Citation
Lv, Z, Zhang, X, Wang, H, & Ming, W. "An Assembly Information Model for Rapid Assembly Modeling." Proceedings of the ASME 2018 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. Volume 1A: 38th Computers and Information in Engineering Conference. Quebec City, Quebec, Canada. August 26–29, 2018. V01AT02A021. ASME. https://doi.org/10.1115/DETC2018-85427
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