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Proceedings Papers

Fatigue Strength of Metal / FRP Adhesive Joints Under Low Temperature

Toshio Hattori, Masaaki Iwasa
Proc. ASME. DETC95, Volume 2: 11th Biennial Conference on Reliability, Stress Analysis, and Failure Prevention; 7th International Conference on Design Theory and Methodology; JSME Symposium on Design and Production; Mechanical Design Education and History; Computer-Integrated Concurrent Design Conference, 81-86, September 17–20, 1995
Paper No: DETC1995-0139
DOI: https://doi.org/10.1115/DETC1995-0139
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Topics: Adhesive joints, Fatigue strength, Fiber reinforced plastics, Low temperature, Metals, Evaluation methods, Stress singularity, Bonding, Magnets, Residual stresses
Proceedings Papers

Analysis of the Hex Cell Discretization for Topology Synthesis of Compliant Mechanisms

Nilesh D. Mankame, Anupam Saxena
Proc. ASME. IDETC-CIE2007, Volume 8: 31st Mechanisms and Robotics Conference, Parts A and B, 111-126, September 4–7, 2007
Paper No: DETC2007-35244
DOI: https://doi.org/10.1115/DETC2007-35244
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Topics: Compliant mechanisms, Topology, Design, Engineering simulation, Optimization, Simulation, Stress, Displacement, Filtration, Finite element analysis
Proceedings Papers

Axisymmetrical Stress Analysis and Strength of Epoxy-Steel Composite Cylinders Under Push-Off Loadings

Toshiyuki Sawa, Taro Hasegawa
Proc. ASME. IDETC-CIE2007, Volume 4: ASME/IEEE International Conference on Mechatronic and Embedded Systems and Applications and the 19th Reliability, Stress Analysis, and Failure Prevention Conference, 407-414, September 4–7, 2007
Paper No: DETC2007-34181
DOI: https://doi.org/10.1115/DETC2007-34181
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Topics: Composite materials, Cylinders, Epoxy adhesives, Epoxy resins, Steel, Stress analysis (Engineering), Stress, Young's modulus, Contact mechanics, Elasticity
Proceedings Papers

Probabilistic Analysis of Notched Micro Specimen Under Three-Point Loading

S. Ekwaro-Osire, M. P. H. Khandaker, K. Gautam
Proc. ASME. IDETC-CIE2005, Volume 4c: 18th Reliability, Stress Analysis, and Failure Prevention Conference, 717-725, September 24–28, 2005
Paper No: DETC2005-85493
DOI: https://doi.org/10.1115/DETC2005-85493
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Topics: Analytical methods, Failure, Finite element methods, Fracture (Materials), Fracture (Process), Fracture toughness, Geometry, Manufacturing, Microbeams, Microelectromechanical systems