A probe test is proposed to quantify the adhesion of thin films and coatings. Using a micromanipulator, a tungsten probe is advanced into the edge of a polymeric coating. Debonds initiate at the loading point and propagate into semicircular cracks at the interface as the probe slides under the coating. The size of the debond is related to the interfacial fracture energy; poorer adhesion results in larger debonds for a given probe displacement. Approximate closed-form and finite element analyses of the geometry have been conducted, along with a significant number of experiments on as-produced and environmentally-conditioned specimens. The technique is showing considerable promise for characterizing coating adhesion, and has certain advantages over existing techniques for certain application.
- Electronic and Photonic Packaging Division
Experimental Evaluation of the Probe Test for Measuring Thin Film Adhesion
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Dillard, DA, Scott, C, Mount, K, Xu, D, Wan, K, West, R, & Dillard, JG. "Experimental Evaluation of the Probe Test for Measuring Thin Film Adhesion." Proceedings of the ASME 2003 International Mechanical Engineering Congress and Exposition. Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology. Washington, DC, USA. November 15–21, 2003. pp. 51-56. ASME. https://doi.org/10.1115/IMECE2003-43910
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