Accelerated Thermal Cycling (ATC) is traditionally used for assessing solder joint reliability. ATC typically takes as long as three to four months to complete. This paper proposes a new method to determine the fatigue life of solder joints using laser moire´ technique. The developed method takes about a week to complete and gives us the detailed deformation behavior of each solder ball in the package at various temperatures. The developed method has been demonstrated for a high I/O organic BGA package. To illustrate the efficacy of the method, the results have been validated using experimental thermal cycling data.
Volume Subject Area:
Electronic and Photonic Packaging
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Modi, M., C. McCormick, and N. Armendariz, New insights in critical solder joint location. ECTC 2005, 2005. 1: p. 977–982.
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