Accelerated Thermal Cycling (ATC) is traditionally used for assessing solder joint reliability. ATC typically takes as long as three to four months to complete. This paper proposes a new method to determine the fatigue life of solder joints using laser moire´ technique. The developed method takes about a week to complete and gives us the detailed deformation behavior of each solder ball in the package at various temperatures. The developed method has been demonstrated for a high I/O organic BGA package. To illustrate the efficacy of the method, the results have been validated using experimental thermal cycling data.

1.
Han
B.
and
Guo
Y.
,
Thermal Deformation Analysis of Various Electronic Packaging Products by Moire and Microscopic Moire Interferometry
.
Journal of Electronic Packaging
,
1995
.
117
: p.
185
189
.
2.
Dai
F.
,
McKelvie
J.
, and
Post
D.
,
An Interpolation of Moire Interferometry from Wavefront Interference Theory
.
Optics and Lasers in Engineering
,
1990
.
12
: p.
101
118
.
3.
Engelmaier
W.
,
Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling
.
IEEE Transactions on Components, Packaging, and Manufacturing Technology
, IEEE, vol. CHMT-6, No.3, pp. 52–57,
1983
.
3
: p.
52
57
.
4.
Modi, M., C. McCormick, and N. Armendariz, New insights in critical solder joint location. ECTC 2005, 2005. 1: p. 977–982.
This content is only available via PDF.
You do not currently have access to this content.