The objective of this study is to analyze the single-phase fluid flow and heat transfer through a microchannel electronics cooler with a hydraulic diameter of about 300 microns. For this purpose, commercial computational fluid dynamics software was used to first characterize the existing design that uses purified water as coolant fluid. The flow parameters of the cooler were then adjusted in order to optimize the design. Geometry modifications were used next to enhance heat transfer, and to reduce pressure drop and erosion from possible impurities in the working fluid. Different working fluids were also considered to investigate possible reductions in corrosion and further increases in heat transfer. Alternative combinations of boundary and operating conditions were explored during optimization. The results of this study showed the microchannel cooler had capacity in rejecting more thermal energy with less pressure drop through flow optimization and geometry modification.
Computational Modeling for a Microchannel Electronics Cooler
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Dix, J, Jokar, A, & Martinsen, R. "Computational Modeling for a Microchannel Electronics Cooler." Proceedings of the ASME 2007 International Mechanical Engineering Congress and Exposition. Volume 5: Electronics and Photonics. Seattle, Washington, USA. November 11–15, 2007. pp. 87-94. ASME. https://doi.org/10.1115/IMECE2007-42971
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