Electronics cooling is becoming increasingly difficult due to increasing power consumption and decreasing size of processor chips. Heat fluxes in processors and power electronics are quickly approaching levels that cannot be easily addressed by forced air convection over finned heat sinks. Jet impingement cooling offers high heat transfer coefficients and has been used effectively in conventional-scale applications such as turbine blade cooling and the quenching of metals. However, literature in the area of microjet arrays is scarce and has not studied arrays of large area ratios. Hence, the objective of this study is to experimentally assess the heat transfer performance of arrays of microjets. The microjet arrays were fabricated using MEMS processes in a clean room environment. The heat transfer performance of several arrays using deionized water as the working fluid was investigated. Inline and staggered array arrangements were investigated, and the area ratio (total area of the jets divided by the surface area) was varied between 0.036 and 0.35. Reynolds numbers defined by the jet diameter were in the range of 50 to 3,500. Heat fluxes greater than 1,000 W/cm2 were obtained at fluid inlet-to-surface temperature differences of less than 30 °C. Heat transfer performance improved as the area ratio was increased.
Experimental Investigation of Area Ratio on Microjet Array Heat Transfer
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Michna, GJ, Browne, EA, Peles, Y, & Jensen, MK. "Experimental Investigation of Area Ratio on Microjet Array Heat Transfer." Proceedings of the ASME 2009 International Mechanical Engineering Congress and Exposition. Volume 9: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B and C. Lake Buena Vista, Florida, USA. November 13–19, 2009. pp. 1407-1414. ASME. https://doi.org/10.1115/IMECE2009-12454
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