Thermal management of microserver chips is of much interest to the semiconductor industry due to the significant performance benefits associated with heat spreading, resulting in very effective hot spot cooling in active cooling environments. This paper investigates thermal management of a multi-chip microserver module using two-phase heat transfer in a vapor chamber. A simulation model capturing two-phase flow of H2O in a vapor chamber was developed for understanding the effect of various parameters on thermal performance of the vapor chamber. The performance of a single high power chip is compared with a system of multiple lower power chips. Emphasis is on the impact of using multiple lower power chips instead of a single high power chip on the heat spreading capability of a flat, thin, vapor chamber. Also, it is shown that using a system of multiple low power chips, provides designers with the opportunity for designing vapor chamber with same functionality as single chip but reduced mass. Results highlight the challenges and opportunities involved in such an approach. The results shown in this paper will be useful for the design of two-phase cooling for microserver chips.

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