1-14 of 14
Accelerated life testing
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Accelerated Reliability Testing Method for Sensors With a Pulsing Membrane Structure

Yifan Guo, Vijay Sarihan, Tom Lee
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 23-27, November 16–21, 1997
Paper No: IMECE1997-1223
DOI: https://doi.org/10.1115/IMECE1997-1223
View Paper
PDF
Topics: Accelerated life testing, Membranes, Sensors, Reliability, Testing, Failure, High temperature, Stress, Cycles, Deformation
Proceedings Papers

Preliminary in Process Stress Analysis of Flip Chip Assemblies During Thermal Cycling

Prema Palaniappan, Daniel F. Baldwin
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 101-106, November 15–20, 1998
Paper No: IMECE1998-0435
DOI: https://doi.org/10.1115/IMECE1998-0435
View Paper
PDF
Topics: Flip-chip assemblies, Stress analysis (Engineering), Stress, Reliability, Cycles, Accelerated life testing, Electronic packages, Failure, Manufacturing, Simulation models
Proceedings Papers

Design Features of Compliant Packages and Their Impact on Reliability

Ilyas Mohammed, Young-Gon Kim
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 43-52, November 11–16, 2001
Paper No: IMECE2001/EPP-24705
DOI: https://doi.org/10.1115/IMECE2001/EPP-24705
View Paper
PDF
Topics: Design, Reliability, Silicon, Packaging, Accelerated life testing, Electronic packages, Epoxy adhesives, Epoxy resins, Event history analysis, Failure
Proceedings Papers

High Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

Santosh Sankarasubramanian, Jaime Cruz, Kyle Yazzie, Vaasavi Sundar, Vijay Subramanian, Edvin Cetegen, David McCoy, Pramod Malatkar
Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A047, November 11–17, 2016
Paper No: IMECE2016-67007
DOI: https://doi.org/10.1115/IMECE2016-67007
View Paper
PDF
Topics: Adhesion, Cantilever beams, Electronic packaging, High temperature, Temperature, Adhesives, Testing, Manufacturing, Accelerated life testing, Failure mechanisms
Proceedings Papers

Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit

Kenji Hirohata, Yousuke Hisakuni, Takahiro Omori, Tomoko Monda, Minoru Mukai
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A082, November 15–21, 2013
Paper No: IMECE2013-65317
DOI: https://doi.org/10.1115/IMECE2013-65317
View Paper
PDF
Topics: Circuits, Fatigue failure, Printed circuit boards, Solder joints, Ball-Grid-Array packaging, Stress, Density, Failure, Packaging, Probability
Proceedings Papers

Sodium Nickel Chloride Battery Design and Testing

Kris Frutschy, Troy Chatwin, Leng Mao, Chris R. Smith, Roger Bull
Proc. ASME. IMECE2012, Volume 6: Energy, Parts A and B, 429-438, November 9–15, 2012
Paper No: IMECE2012-86379
DOI: https://doi.org/10.1115/IMECE2012-86379
View Paper
PDF
Topics: Batteries, Design, Nickel, Sodium, Testing, Accelerated life testing, Chemistry, Cooling, High temperature, Insulation
Proceedings Papers

Thermal Conductivity Performance Modeling and Characterization of a Novel Anisotropic Conductive Adhesive Used in Lead-Free Electronics Packaging

Matthew J. Combs, S. Manian Ramkumar, Satish Kandlikar
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 1161-1166, November 9–15, 2012
Paper No: IMECE2012-89672
DOI: https://doi.org/10.1115/IMECE2012-89672
View Paper
PDF
Topics: Adhesives, Anisotropy, Electronic packaging, Modeling, Thermal conductivity, Particulate matter, Hardening (Curing), Manufacturing, Solders, Accelerated life testing
Proceedings Papers

Evaluation of a Novel Anisotropic Conductive Adhesive Shear Under Multiple Tin-Lead and Lead-Free Reflow Cycles for Package-on-Package (POP) Assembly

Dustin D’Angelo, S. Manian Ramkumar, Luke Wentlent, Peter Borgesen
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 475-483, November 9–15, 2012
Paper No: IMECE2012-89655
DOI: https://doi.org/10.1115/IMECE2012-89655
View Paper
PDF
Topics: Adhesives, Anisotropy, Cycles, Manufacturing, Package on package, Shear (Mechanics), Solders, Reliability, Hardening (Curing), Particulate matter
Proceedings Papers

Stresses in Area Array Assemblies Subjected to Thermal Cycling

Jordan Roberts, M. Kaysar Rahim, Safina Hussain, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 267-278, November 13–19, 2009
Paper No: IMECE2009-11925
DOI: https://doi.org/10.1115/IMECE2009-11925
View Paper
PDF
Topics: Stress, Temperature, Ball-Grid-Array packaging, Cycles, Sensors, Constitutive equations, Finite element analysis, Flip-chip, Flip-chip devices, Packaging
Proceedings Papers

A New Approach for the Study of Reliability for MEMS Magnetic Actuator

E. Berkcan, S. Chandrasekaran
Proc. ASME. IMECE2007, Volume 11: Micro and Nano Systems, Parts A and B, 363-366, November 11–15, 2007
Paper No: IMECE2007-43569
DOI: https://doi.org/10.1115/IMECE2007-43569
View Paper
PDF
Topics: Actuators, Microelectromechanical systems, Reliability, Design, Manufacturing, Accelerated life testing, Failure, Packaging, Probability, Testing
Proceedings Papers

Simulation-Based Parametric Reliability Modeling Using Covariate Theory

Jon M. Wallace, Dimitri N. Mavris
Proc. ASME. IMECE2003, Engineering/Technology Management: Safety Engineering and Risk Analysis, Technology and Society, Engineering Business Management, and Homeland Security, 87-95, November 15–21, 2003
Paper No: IMECE2003-43945
DOI: https://doi.org/10.1115/IMECE2003-43945
View Paper
PDF
Topics: Accelerated life testing, Failure, Modeling, Reliability, Simulation
Proceedings Papers

Integrating SOI and Poly-Si Surface Structures Using a Monolithic Process

Mingching Wu, Shiunafang Shy, Weileun Fang
Proc. ASME. IMECE2003, Microelectromechanical Systems, 63-68, November 15–21, 2003
Paper No: IMECE2003-41182
DOI: https://doi.org/10.1115/IMECE2003-41182
View Paper
PDF
Topics: Crystals, Self-assembly, Silicon-on-insulator, Semiconductor wafers, Thin films, Accelerated life testing, Microactuators, Microelectromechanical systems, Mirrors, Optical instruments
Proceedings Papers

Thermal Stress Modeling in Micro- and Opto-Electronics: Review and Extension

E. Suhir
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 753-776, November 15–21, 2003
Paper No: IMECE2003-43777
DOI: https://doi.org/10.1115/IMECE2003-43777
View Paper
PDF
Topics: Modeling, Optoelectronic devices, Thermal stresses, Design, Accelerated life testing, Computer-aided engineering, Experimental methods, Finite element analysis, Geometry, Materials properties
Proceedings Papers

Integrated Reliability Solutions: A Software Tool for Mechanical Reliability of Electronic Components

Yinyan Wang, Chuntao Zhang, Xiaohua Wu, Guoshu Song, Zhengfang Qian
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 409-418, November 5–10, 2006
Paper No: IMECE2006-15542
DOI: https://doi.org/10.1115/IMECE2006-15542
View Paper
PDF
Topics: Computer software, Electronic components, Reliability, Design, Accelerated life testing, Cycles, Innovation, Manufacturing, Modeling