1-20 of 96
Ball-Grid-Array packaging
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Assessment of an Axisymmetric Analytical Model of a Square Areal Array Assembly

S. Shakya, S. M. Heinrich, J. Liang, P. S. Lee
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 55-63, November 16–21, 1997
Paper No: IMECE1997-0814
DOI: https://doi.org/10.1115/IMECE1997-0814
View Paper titled, Assessment of an Axisymmetric Analytical Model of a Square Areal Array Assembly
Click here to open pdf in another window PDF for Assessment of an Axisymmetric Analytical Model of a Square Areal Array Assembly
Topics: Ball-Grid-Array packaging, Ceramics, Computer simulation, Die cutting, Disks, Displacement, Finite element analysis, Finite element methods, Flip-chip packages, Geometry
Proceedings Papers

CBGA Solder Fillet Shape Prediction and Design Optimization

Y. Li, R. L. Mahajan
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 431-438, November 16–21, 1997
Paper No: IMECE1997-1120
DOI: https://doi.org/10.1115/IMECE1997-1120
View Paper titled, CBGA Solder Fillet Shape Prediction and Design Optimization
Click here to open pdf in another window PDF for CBGA Solder Fillet Shape Prediction and Design Optimization
Topics: Design, Optimization, Shapes, Solders, Mathematical analysis, Reliability, Ball-Grid-Array packaging, Ceramics, Composite materials, Experimental design
Proceedings Papers

On the Equivalent Finite Element Beam Model for Ball Grid Array Analysis

Hsien-Chie Cheng, Kuo-Ning Chiang, Ming-Hsiao Lee
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 353-360, November 16–21, 1997
Paper No: IMECE1997-1110
DOI: https://doi.org/10.1115/IMECE1997-1110
View Paper titled, On the Equivalent Finite Element Beam Model for Ball Grid Array Analysis
Click here to open pdf in another window PDF for On the Equivalent Finite Element Beam Model for Ball Grid Array Analysis
Topics: Ball-Grid-Array packaging, Finite element analysis, Optimization, Packaging, Pipes, Plastics, Solder joints
Proceedings Papers

Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications

K. Ramakrishna, J. R. Trent
Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 13-21, November 16–21, 1997
Paper No: IMECE1997-1210
DOI: https://doi.org/10.1115/IMECE1997-1210
View Paper titled, Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications
Click here to open pdf in another window PDF for Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications
Topics: Automotive industry, Ball-Grid-Array packaging, Temperature, Junctions, Printed circuit boards, Computational fluid dynamics, Thermal conductivity, Heat transfer, Transients (Dynamics), Energy dissipation
Proceedings Papers

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

William T. Chen, David Questad, David Read, Bahgat Sammakia
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 183-192, November 16–21, 1997
Paper No: IMECE1997-0515
DOI: https://doi.org/10.1115/IMECE1997-0515
View Paper titled, Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry
Click here to open pdf in another window PDF for Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry
Topics: Fracture mechanics, Microelectronic packaging, Packaging, Ball-Grid-Array packaging, Electronic packaging, Design, Electronic packages, Electronic products, Low temperature, Manufacturing
Proceedings Papers

Stress Analysis of High Density Bare Chip Packaging Technologies

Yutaka Tsukada, Shogo Mizumoto, Yasuyuki Kodama, Hideo Nishimura
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 49-50, November 16–21, 1997
Paper No: IMECE1997-0499
DOI: https://doi.org/10.1115/IMECE1997-0499
View Paper titled, Stress Analysis of High Density Bare Chip Packaging Technologies
Click here to open pdf in another window PDF for Stress Analysis of High Density Bare Chip Packaging Technologies
Topics: Density, Packaging, Stress analysis (Engineering), Epoxy adhesives, Epoxy resins, Ceramics, Ball-Grid-Array packages, Ball-Grid-Array packaging, Electronic packaging, Flip-chip
Proceedings Papers

Parametric Analysis of Thermally Enhanced BGA Reliability Using a Finite-Volume-Weighted Averaging Technique

Hsien-Chie Cheng, Kuo-Ning Chiang, Chao-Kuang Chen
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 13-20, November 15–20, 1998
Paper No: IMECE1998-0423
DOI: https://doi.org/10.1115/IMECE1998-0423
View Paper titled, Parametric Analysis of Thermally Enhanced BGA Reliability Using a Finite-Volume-Weighted Averaging Technique
Click here to open pdf in another window PDF for Parametric Analysis of Thermally Enhanced BGA Reliability Using a Finite-Volume-Weighted Averaging Technique
Topics: Ball-Grid-Array packaging, Reliability, Solder joints, Ball-Grid-Array packages, Design, Fatigue, Geometry, Corners (Structural elements), Finite element analysis, Manufacturing
Proceedings Papers

Automatic Warpage Measurement of Advanced Packages by Optical Method

Xiaoyuan He, Jiabin Dai, Sheng Liu
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 65-70, November 15–20, 1998
Paper No: IMECE1998-0430
DOI: https://doi.org/10.1115/IMECE1998-0430
View Paper titled, Automatic Warpage Measurement of Advanced Packages by Optical Method
Click here to open pdf in another window PDF for Automatic Warpage Measurement of Advanced Packages by Optical Method
Topics: Warping, Deformation, Ball-Grid-Array packaging, Shapes, Computer software, Diffraction gratings, Imaging, Manufacturing, Modeling, Packaging
Proceedings Papers

On Enhancing Eutectic Solder Joint Reliability Using a 2 nd -Reflow-Process Approach

Kuo-Ning Chiang, Hsien-Chie Cheng
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 21-25, November 15–20, 1998
Paper No: IMECE1998-0424
DOI: https://doi.org/10.1115/IMECE1998-0424
View Paper titled, On Enhancing Eutectic Solder Joint Reliability Using a 2 nd -Reflow-Process Approach
Click here to open pdf in another window PDF for On Enhancing Eutectic Solder Joint Reliability Using a 2 nd -Reflow-Process Approach
Topics: Reliability, Solder joints, Solders, Ball-Grid-Array packaging, Geometry, Fatigue life, Flip-chip, Flip-chip devices, Materials properties
Proceedings Papers

Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

Sanjeev B. Sathe, Bahgat G. Sammakia
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 747-756, November 15–20, 1998
Paper No: IMECE1998-1089
DOI: https://doi.org/10.1115/IMECE1998-1089
View Paper titled, Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package
Click here to open pdf in another window PDF for Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package
Topics: Accounting, Adhesives, Ball-Grid-Array packaging, Construction, Convection, Design, Flat heat pipes, Geometry, Heat conduction, Heat sinks
Proceedings Papers

A Study of the Aperture Filling Process in Solder Paste Stencil Printing

Jianbiao Pan, Gregory L. Tonkay
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 75-82, November 14–19, 1999
Paper No: IMECE1999-0920
DOI: https://doi.org/10.1115/IMECE1999-0920
View Paper titled, A Study of the Aperture Filling Process in Solder Paste Stencil Printing
Click here to open pdf in another window PDF for A Study of the Aperture Filling Process in Solder Paste Stencil Printing
Topics: Printing, Solders, Ball-Grid-Array packaging, Surface mount assemblies, Flip-chip, Flip-chip devices, Packaging
Proceedings Papers

Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages

V. H. Adams, K. Ramakrishna
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 99-106, November 14–19, 1999
Paper No: IMECE1999-0922
DOI: https://doi.org/10.1115/IMECE1999-0922
View Paper titled, Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages
Click here to open pdf in another window PDF for Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages
Topics: Electronic packages, Heating, Performance characterization, Silicon, Heat, Temperature, Thermal characterization, Ball-Grid-Array packaging, Engineering simulation, Junctions
Proceedings Papers

Integrated Transient Thermal and Mechanical Analysis of Molded PBGA Packages During Thermal Shock

Lei L. Mercado, Tien-Yu Tom Lee, Jeff Cook
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 111-119, November 14–19, 1999
Paper No: IMECE1999-0924
DOI: https://doi.org/10.1115/IMECE1999-0924
View Paper titled, Integrated Transient Thermal and Mechanical Analysis of Molded PBGA Packages During Thermal Shock
Click here to open pdf in another window PDF for Integrated Transient Thermal and Mechanical Analysis of Molded PBGA Packages During Thermal Shock
Topics: Thermal shock, Transients (Dynamics), Computational fluid dynamics, Stress, Boundary-value problems, Ball-Grid-Array packaging, Flip-chip, Heat transfer, Heat transfer coefficients, Molded plastics
Proceedings Papers

Thermal Issues That Arise due to Manufacturing Processes: Evaluation and Measurement Techniques

Bahgat Sammakia, Sanjeev Sathe
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 121-138, November 14–19, 1999
Paper No: IMECE1999-0925
DOI: https://doi.org/10.1115/IMECE1999-0925
View Paper titled, Thermal Issues That Arise due to Manufacturing Processes: Evaluation and Measurement Techniques
Click here to open pdf in another window PDF for Thermal Issues That Arise due to Manufacturing Processes: Evaluation and Measurement Techniques
Topics: Manufacturing, Heat sinks, Adhesives, Delamination, Design, Lamination, Signals, Stress, Accounting, Ball-Grid-Array packaging
Proceedings Papers

A Constriction Resistance Model in Thermal Analysis of Solder Ball Joints in Ball Grid Array Packages

T. M. Ying, K. C. Toh
Proc. ASME. IMECE99, Heat Transfer: Volume 1, 29-36, November 14–19, 1999
Paper No: IMECE1999-0967
DOI: https://doi.org/10.1115/IMECE1999-0967
View Paper titled, A Constriction Resistance Model in Thermal Analysis of Solder Ball Joints in Ball Grid Array Packages
Click here to open pdf in another window PDF for A Constriction Resistance Model in Thermal Analysis of Solder Ball Joints in Ball Grid Array Packages
Topics: Ball-Grid-Array packages, Solders, Thermal analysis, Ball-Grid-Array packaging, Solder joints, Energy dissipation, Finite element methods, Finite element model, Heat, Boundary-value problems
Proceedings Papers

Prediction of Thermal Performance of Flip-Chip-Plastic Ball Grid Array (FC-PBGA) Packages: Effect of Die Size

K. Ramakrishna, T.-Y. Lee
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 139-148, November 11–16, 2001
Paper No: IMECE2001/HTD-24387
DOI: https://doi.org/10.1115/IMECE2001/HTD-24387
View Paper titled, Prediction of Thermal Performance of Flip-Chip-Plastic Ball Grid Array (FC-PBGA) Packages: Effect of Die Size
Click here to open pdf in another window PDF for Prediction of Thermal Performance of Flip-Chip-Plastic Ball Grid Array (FC-PBGA) Packages: Effect of Die Size
Topics: Ball-Grid-Array packaging, Junctions, Mixed convection, Computation, Computational fluid dynamics, Databases, Flip-chip, Heat transfer, Thermal resistance
Proceedings Papers

Experimentally Validated Vibration Fatigue Life Prediction Model for Ball Grid Array Solder Joint

T. E. Wong, F. W. Palmieri, L. A. Kachatorian
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 113-119, November 5–10, 2000
Paper No: IMECE2000-2252
DOI: https://doi.org/10.1115/IMECE2000-2252
View Paper titled, Experimentally Validated Vibration Fatigue Life Prediction Model for Ball Grid Array Solder Joint
Click here to open pdf in another window PDF for Experimentally Validated Vibration Fatigue Life Prediction Model for Ball Grid Array Solder Joint
Topics: Ball-Grid-Array packaging, Fatigue life, Solder joints, Vibration, Random vibration, Solders, Ball-Grid-Array packages, Ceramics, Computation, Computers
Proceedings Papers

Application of a Novel Flip Chip Solder Joint Inspection System to Chips on an FR-4 Substrate

Dathan S. Erdahl, Sheng Liu, I. Charles Ume
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 189-195, November 5–10, 2000
Paper No: IMECE2000-2262
DOI: https://doi.org/10.1115/IMECE2000-2262
View Paper titled, Application of a Novel Flip Chip Solder Joint Inspection System to Chips on an FR-4 Substrate
Click here to open pdf in another window PDF for Application of a Novel Flip Chip Solder Joint Inspection System to Chips on an FR-4 Substrate
Topics: Flip-chip devices, Inspection, Solder joints, Solders, Vibration, Ball-Grid-Array packaging, Lasers, Ultrasound, Displacement, Interferometers
Proceedings Papers

Thermomechanical Durability of High I/O BGA Packages

Pavan Davuluri, Abhijit Dasgupta, Steven Young
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 121-127, November 5–10, 2000
Paper No: IMECE2000-2253
DOI: https://doi.org/10.1115/IMECE2000-2253
View Paper titled, Thermomechanical Durability of High I/O BGA Packages
Click here to open pdf in another window PDF for Thermomechanical Durability of High I/O BGA Packages
Topics: Ball-Grid-Array packages, Durability, Thermomechanics, Ball-Grid-Array packaging, Solder joints, Failure, Solders, Cycles, Damage, Failure data
Proceedings Papers

Thermal Assessment and Enhancement of Molded Array (MAP) PBGA Packages for Handheld Telecommunication Applications

V. H. Adams, V. A. Chiriac, T.-Y. Tom Lee
Proc. ASME. IMECE2000, Manufacturing Engineering, 433-442, November 5–10, 2000
Paper No: IMECE2000-1838
DOI: https://doi.org/10.1115/IMECE2000-1838
View Paper titled, Thermal Assessment and Enhancement of Molded Array (MAP) PBGA Packages for Handheld Telecommunication Applications
Click here to open pdf in another window PDF for Thermal Assessment and Enhancement of Molded Array (MAP) PBGA Packages for Handheld Telecommunication Applications
Topics: Ball-Grid-Array packaging, Computational fluid dynamics, Cooling, Copper, Design, Energy dissipation, Engineering simulation, Flat heat pipes, Heat, Heat conduction