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Proceedings Papers

Effect of Autoclave Cure Temperature, Pressure, and Time on the Glass Transition Temperature and the Degree of Cure of Epoxy Film Adhesive Joints

Sayed A. Nassar, Shraddha Jagatap, Nitesh Hirulkar

Proc. ASME. IMECE2022, Volume 2A: Advanced Manufacturing, V02AT02A031, October 30–November 3, 2022

Paper No: IMECE2022-94434

DOI: https://doi.org/10.1115/IMECE2022-94434

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Topics: Adhesive joints, Epoxy adhesives, Epoxy resins, Glass transition, Pressure, Temperature, Adhesives, Aluminum, Bond strength, Bonding

Proceedings Papers

Stereolithography Printing and Sintering of Silicon Carbide (SiC) Ceramics via Oxidation-Bonding

Padmalatha Kakanuru, Kishore Pochiraju

Proc. ASME. IMECE2022, Volume 2A: Advanced Manufacturing, V02AT02A023, October 30–November 3, 2022

Paper No: IMECE2022-96009

DOI: https://doi.org/10.1115/IMECE2022-96009

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Topics: Bonding, Ceramics, Oxidation, Printing, Silicon, Sintering, Stereolithography

Proceedings Papers

A Closed Loop Pressure Assisted Boiling Point (PABP) Control System for Thermal Fusion Bonding of Thermoplastics

Kavya Dathathreya, Daniel S. Park, Taehyun Park, Steven A. Soper, Michael C. Murphy

Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T13A017, October 30–November 3, 2022

Paper No: IMECE2022-96219

DOI: https://doi.org/10.1115/IMECE2022-96219

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Topics: Bonding, Control systems, Phase transition temperature, Pressure, Closed loop systems, Microchannels, Temperature, Rupture, Boiling, Boundary-value problems

Proceedings Papers

Thermomechanical Response of Laminated Flat Panels Featuring Interlaminar Bonding Imperfections

U. Icardi, L. Librescu, M. Di Sciuva

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 197-214, November 16–21, 1997

Paper No: IMECE1997-0723

DOI: https://doi.org/10.1115/IMECE1997-0723

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Topics: Bonding, Thermomechanics, Composite materials, Anisotropy, Stress, Temperature

Proceedings Papers

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Anthony J. Rafanelli

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 207-217, November 16–21, 1997

Paper No: IMECE1997-0820

DOI: https://doi.org/10.1115/IMECE1997-0820

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Topics: Epoxy adhesives, Epoxy resins, Fracture toughness, Reliability, Solders, Adhesives, Bonding, Creep, Fatigue, Fracture (Materials)

Proceedings Papers

Numerical Computation of the Heat Transfer to a Spherical-Tip Anode During an Electronic Flame Off Process

Srinivas S. Sripada, P. S. Ayyaswamy, I. M. Cohen

Proc. ASME. IMECE97, Heat Transfer: Volume 1, 55-61, November 16–21, 1997

Paper No: IMECE1997-0831

DOI: https://doi.org/10.1115/IMECE1997-0831

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Topics: Anodes, Computation, Flames, Heat transfer, Wire, Melting, Bonding, Computer simulation, Electric arcs, Heat

Proceedings Papers

High Resolution Single Crystal Silicon Accelerometer Using Silicon Fusion Bonding and Deep Reactive Ion Etching

B. P. van Drieënhuizen, N. I. Maluf

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 9-12, November 16–21, 1997

Paper No: IMECE1997-0931

DOI: https://doi.org/10.1115/IMECE1997-0931

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Topics: Accelerometers, Bonding, Crystals, Reactive-ion etching, Resolution (Optics), Silicon, Noise (Sound), Complementary metal oxide semiconductors, Brownian motion, Electronics

Proceedings Papers

Adaptive Health Monitoring Concepts for Spot-Welded and Weld-Bonded Structural Joints

Victor Giurgiutiu, Craig A. Rogers, Yuh Jin Chao, Michael A. Sutton, Xiaomin Deng

Proc. ASME. IMECE97, Adaptive Structures and Material Systems, 99-104, November 16–21, 1997

Paper No: IMECE1997-0182

DOI: https://doi.org/10.1115/IMECE1997-0182

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Topics: Joints, Bonding, Adhesives, Welding, Aluminum, Joining, Nondestructive evaluation, Actuators, Adaptive structures, Automotive industry

Proceedings Papers

Sequential Processing Mechanics Modeling for a Model IC Package

Jianjun Wang, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 401-410, November 16–21, 1997

Paper No: IMECE1997-1117

DOI: https://doi.org/10.1115/IMECE1997-1117

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Topics: Modeling, Stress, Manufacturing, Solders, Temperature, Finite element analysis, Finite element methods, Finite element model, Silicon chips, Bonding

Proceedings Papers

An Overload Failure of a Dental Prosthesis: A 3D Finite Element Nonlinear Contact Analysis

Ajit A. Prabhu, John B. Brunski

Proc. ASME. IMECE97, Advances in Bioengineering, 141-142, November 16–21, 1997

Paper No: IMECE1997-0268

DOI: https://doi.org/10.1115/IMECE1997-0268

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Topics: Failure, Finite element analysis, Prostheses, Bonding, Bone, Biomechanics, Screws, Stress

Proceedings Papers

A Fracture Toughness Test of Bone-Biomaterial Interfaces Under Mixed Mode Loading Conditions

X. D. Wang, C. M. Agrawal

Proc. ASME. IMECE97, Advances in Bioengineering, 323-324, November 16–21, 1997

Paper No: IMECE1997-0359

DOI: https://doi.org/10.1115/IMECE1997-0359

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Topics: Biomaterials, Bone, Fracture toughness, Orthopedics, Artificial limbs, Bonding, Cements (Adhesives), Dental materials, Fracture mechanics, Numerical analysis

Proceedings Papers

In Situ Observation and Modeling of Damage Modes in Cross-Ply Ceramic Matrix Composites

Ran Y. Kim, G. P. Tandon

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 447-454, November 16–21, 1997

Paper No: IMECE1997-0699

DOI: https://doi.org/10.1115/IMECE1997-0699

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Topics: Ceramic matrix composites, Damage, Modeling, Composite materials, Laminates, Stress, Ceramics, Failure, Fibers, Bonding

Proceedings Papers

Design and Strength Evaluation of an Anodically Bonded Pressurized Cavity Array for Wafer-Level MEMS Packaging

Jeung Sang Go, Young-Ho Cho

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 357-360, November 15–20, 1998

Paper No: IMECE1998-1268

DOI: https://doi.org/10.1115/IMECE1998-1268

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Topics: Cavities, Design, MEMS packaging, Semiconductor wafers, Bonding, Plates (structures), Pressure, Design methodology, Failure, Finite element analysis

Proceedings Papers

Microfluidics of a Planar Microfabricated Fluid Filter

Yit-shun Leung Ki, Didier Maillefer, Gilles Rey-Mermet, Peter A. Monkewitz, Philippe Renaud, Harald T. G. van Lintel

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 165-170, November 15–20, 1998

Paper No: IMECE1998-1238

DOI: https://doi.org/10.1115/IMECE1998-1238

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Topics: Filters, Fluids, Microfabrication, Microfluidics, Design, Filtration, Flow (Dynamics), Micromachining, Pumps, Silicon

Proceedings Papers

Self-Assembled Microslider for Microjoinery

L.-S. Huang, B. Sridharan, C.-J. Kim, S. D. Collins, C. González, R. L. Smith

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 499-504, November 15–20, 1998

Paper No: IMECE1998-1291

DOI: https://doi.org/10.1115/IMECE1998-1291

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Topics: Self-assembly, Manufacturing, Semiconductor wafers, Bonding, Etching, Anisotropy, Clearances (Engineering), Friction, Micromachining, Polishing

Proceedings Papers

Ceramic Tape-Based Meso Systems Technology

Haim H. Bau, Suresh G. K. Ananthasuresh, Jorge J. Santiago-Avilés, Jihua Zhong, Moon Kim, Mingqiang Yi, Patricio Espinoza-Vallejos, Luis Sola-Laguna

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 491-498, November 15–20, 1998

Paper No: IMECE1998-1290

DOI: https://doi.org/10.1115/IMECE1998-1290

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Topics: Ceramics, Glass, Manufacturing, Silicon, Binders (Materials), Firing, Flow (Dynamics), Lamination, Low temperature, Microelectromechanical systems

Proceedings Papers

Substrate Melting and Resolidification After Contact With a Molten Layer of High Melting Point Material

S.-P. Wang, G.-X. Wang, E. F. Matthys

Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 131-136, November 15–20, 1998

Paper No: IMECE1998-0698

DOI: https://doi.org/10.1115/IMECE1998-0698

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Topics: Melting, Melting point, Coating processes, Coatings, Alloys, Bonding, Cooling, Drops, Heat transfer coefficients, Metals

Proceedings Papers

The Damping Characteristics of Machine Structures Assembled by Bonding: A Beam in Which Two Steel Strips Are Partially Joined by an Adhesive

Takashi Kobayashi, Yuichi Nakano

Proc. ASME. IMECE98, Reliability, Stress Analysis, and Failure Prevention Aspects of Adhesive and Bolted Joints, Rubber Components, Composite Springs, 85-89, November 15–20, 1998

Paper No: IMECE1998-1120

DOI: https://doi.org/10.1115/IMECE1998-1120

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Topics: Adhesives, Bonding, Damping, Machinery, Steel, Strips, Finite element analysis, Temperature

Proceedings Papers

Stress Analysis and Strength Evaluation of Single-Lap Band Adhesive Joints Subjected to External Bending Moments

Jiemin Liu, Toshiyuki Sawa

Proc. ASME. IMECE98, Reliability, Stress Analysis, and Failure Prevention Aspects of Adhesive and Bolted Joints, Rubber Components, Composite Springs, 67-75, November 15–20, 1998

Paper No: IMECE1998-1118

DOI: https://doi.org/10.1115/IMECE1998-1118

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Topics: Adhesive joints, Bonding, Contact mechanics, Elasticity, Stress analysis (Engineering)

Proceedings Papers

Fabrication, Testing and Analysis of Composite Sandwich Structures

Isaac M. Daniel, R. A. Jandro Abot

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 283, November 15–20, 1998

Paper No: IMECE1998-1206

DOI: https://doi.org/10.1115/IMECE1998-1206

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Topics: Composite materials, Manufacturing, Sandwich structures, Testing, Failure, Foundry coatings, Adhesives, Honeycomb structures, Aluminum, Bonding

NARROW

Effect of Autoclave Cure Temperature, Pressure, and Time on the Glass Transition Temperature and the Degree of Cure of Epoxy Film Adhesive Joints

Stereolithography Printing and Sintering of Silicon Carbide (SiC) Ceramics via Oxidation-Bonding

A Closed Loop Pressure Assisted Boiling Point (PABP) Control System for Thermal Fusion Bonding of Thermoplastics

Thermomechanical Response of Laminated Flat Panels Featuring Interlaminar Bonding Imperfections

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Numerical Computation of the Heat Transfer to a Spherical-Tip Anode During an Electronic Flame Off Process

High Resolution Single Crystal Silicon Accelerometer Using Silicon Fusion Bonding and Deep Reactive Ion Etching

Adaptive Health Monitoring Concepts for Spot-Welded and Weld-Bonded Structural Joints

Sequential Processing Mechanics Modeling for a Model IC Package

An Overload Failure of a Dental Prosthesis: A 3D Finite Element Nonlinear Contact Analysis

A Fracture Toughness Test of Bone-Biomaterial Interfaces Under Mixed Mode Loading Conditions

In Situ Observation and Modeling of Damage Modes in Cross-Ply Ceramic Matrix Composites

Design and Strength Evaluation of an Anodically Bonded Pressurized Cavity Array for Wafer-Level MEMS Packaging

Microfluidics of a Planar Microfabricated Fluid Filter

Self-Assembled Microslider for Microjoinery

Ceramic Tape-Based Meso Systems Technology

Substrate Melting and Resolidification After Contact With a Molten Layer of High Melting Point Material

The Damping Characteristics of Machine Structures Assembled by Bonding: A Beam in Which Two Steel Strips Are Partially Joined by an Adhesive

Stress Analysis and Strength Evaluation of Single-Lap Band Adhesive Joints Subjected to External Bending Moments

Fabrication, Testing and Analysis of Composite Sandwich Structures

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