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Proceedings Papers

Control of Distributed Actuators Without Electrodes

John A. Main

Proc. ASME. IMECE97, Adaptive Structures and Material Systems, 61-66, November 16–21, 1997

Paper No: IMECE1997-0178

DOI: https://doi.org/10.1115/IMECE1997-0178

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Topics: Actuators, Electrodes, Cathode ray oscilloscopes, Electron beams, Electrons, Piezoelectric materials, Advanced materials, Design, Smart materials, Wire

Proceedings Papers

In-Situ Warpage Measurement During Thermal Cycling of Dielectric Coated SS Substrate for Large Area MCM-D Packaging

Anh X. H. Dang, I. Charles Ume, Swapan K. Bhattacharya

Proc. ASME. IMECE99, Electronics Manufacturing Issues, 169-179, November 14–19, 1999

Paper No: IMECE1999-0930

DOI: https://doi.org/10.1115/IMECE1999-0930

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Topics: Packaging, Warping, Dielectric materials, Lasers, Stainless steel, Temperature, Thin films, Vehicles

Proceedings Papers

Experimental Investigation on Chemical-Mechanical Polishing of Wafers With Low-Conductivity Dielectrics

Jhy-Cherng Tsai, Charls Liu, Ming-Hsih Tsai, Bao-Tong Dai

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 135-141, November 11–16, 2001

Paper No: IMECE2001/EPP-24717

DOI: https://doi.org/10.1115/IMECE2001/EPP-24717

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Topics: Dielectric materials, Electrical conductivity, Polishing, Pressure, Semiconductor wafers, Thermal conductivity

Proceedings Papers

Numerical Simulation of a Dielectric Material Exposed to Short Pulsed Laser Radiation

Richard A. Whalen, Gregory J. Kowalski

Proc. ASME. IMECE2001, Heat Transfer: Volume 6 — Heat Transfer in Materials Processing, 147-155, November 11–16, 2001

Paper No: IMECE2001/HTD-24346

DOI: https://doi.org/10.1115/IMECE2001/HTD-24346

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Topics: Computer simulation, Dielectric materials, Laser beams, Heat conduction, Temperature, Absorption, Manufacturing, Radiation (Physics), Refractive index, Simulation

Proceedings Papers

Localized Electron Evolution Induced by Femtosecond Laser Pulses in Water

C. H. Fan, J. Sun, J. P. Longtin

Proc. ASME. IMECE2001, Heat Transfer: Volume 6 — Heat Transfer in Materials Processing, 181-188, November 11–16, 2001

Paper No: IMECE2001/HTD-24349

DOI: https://doi.org/10.1115/IMECE2001/HTD-24349

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Topics: Electrons, Lasers, Plasmas (Ionized gases), Water, Density, Absorption, Ultrashort laser pulses, Dielectric materials, Laser materials, Transparency

Proceedings Papers

Nano-Micro Scale Characterization of Dielectric Materials

Paul A. Kohl, Sue Ann Bidstrup Allen

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 63-68, November 11–16, 2001

Paper No: IMECE2001/EPP-24707

DOI: https://doi.org/10.1115/IMECE2001/EPP-24707

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Topics: Dielectric materials, Glass, Particle spin, Rotation, Spin (Aerodynamics), Thin films, Coatings, Elastic moduli, Electrical properties, Fracture toughness

Proceedings Papers

Modeling of Moving Breakdown by Femtosecond Laser Pulses in Dielectrics

C. H. Fan, J. P. Longtin

Proc. ASME. IMECE2000, Heat Transfer: Volume 3, 187-194, November 5–10, 2000

Paper No: IMECE2000-1476

DOI: https://doi.org/10.1115/IMECE2000-1476

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Topics: Dielectric materials, Lasers, Modeling, Density, Electrons, Laser ablation, Solids, Ablation (Vaporization technology), Bioengineering, Temperature

Proceedings Papers

Parametric Study of the Ablation Characteristics of Absorbing Dielectrics by Short Pulse Laser

Samuel George, Kunal Mitra

Proc. ASME. IMECE2000, Heat Transfer: Volume 3, 179-186, November 5–10, 2000

Paper No: IMECE2000-1475

DOI: https://doi.org/10.1115/IMECE2000-1475

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Topics: Ablation (Vaporization technology), Dielectric materials, Lasers, Transients (Dynamics), Absorption, Computer simulation, Delays, Diffusion (Physics), Electron configuration, Excimer lasers

Proceedings Papers

Thermal and Thermomechanical Phenomena During Ultrafast Laser Interaction With Tissue

Xinwei Wang, Xianfan Xu, Lisa X. Xu

Proc. ASME. IMECE2000, Advances in Heat and Mass Transfer in Biotechnology, 9-11, November 5–10, 2000

Paper No: IMECE2000-2215

DOI: https://doi.org/10.1115/IMECE2000-2215

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Topics: Biological tissues, Lasers, Thermomechanics, Absorption, Laser ablation, Damage, Dielectric materials, Evaporation, High temperature, Irradiation (Radiation exposure)

Proceedings Papers

Interfacial Delamination Propagation in Multi-Layered High-Density Wiring Electronic Packaging Structures

Hurang Hu, Weidong Xie, Suresh Sitaraman

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 103-111, November 5–10, 2000

Paper No: IMECE2000-2251

DOI: https://doi.org/10.1115/IMECE2000-2251

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Topics: Delamination, Density, Electrical wires, Electronic packaging, Copper, Materials properties, Temperature, Thermoelasticity, Design, Dielectric materials

Proceedings Papers

Validation of an Atomistic Field Theory for Contact Electrification Using a MEMS Load Cell

Tyler J. Hieber, Mohamad Ibrahim Cheikh, James M. Chen, Zayd C. Leseman

Proc. ASME. IMECE2019, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T12A006, November 11–14, 2019

Paper No: IMECE2019-11349

DOI: https://doi.org/10.1115/IMECE2019-11349

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Topics: Field theories (Physics), Microelectromechanical systems, Stress, Engineering simulation, Resolution (Optics), Simulation, Adhesion, Crystal lattices, Crystals, Dielectric materials

Proceedings Papers

Experimental Analysis of Alternative Dielectric Materials for DBD Plasma Actuators

F. F. Rodrigues, J. C. Pascoa, M. Trancossi

Proc. ASME. IMECE2018, Volume 1: Advances in Aerospace Technology, V001T03A005, November 9–15, 2018

Paper No: IMECE2018-87455

DOI: https://doi.org/10.1115/IMECE2018-87455

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Topics: Actuators, Dielectric materials, Experimental analysis, Plasmas (Ionized gases), Ceramics, Construction, Durability, Electrical properties, Flow (Dynamics), Flow control

Proceedings Papers

Experimental Thermal Characterization of DBD Plasma Actuators

F. F. Rodrigues, J. C. Pascoa, M. Trancossi

Proc. ASME. IMECE2017, Volume 1: Advances in Aerospace Technology, V001T03A004, November 3–9, 2017

Paper No: IMECE2017-70541

DOI: https://doi.org/10.1115/IMECE2017-70541

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Topics: Actuators, Plasmas (Ionized gases), Thermal characterization, Aircraft, Boundary layers, Construction, Dielectric materials, Electric fields, Energy consumption, Film cooling

Proceedings Papers

3D Printed Porous Dielectric Substrates for RF Applications

Vana Snigdha Tummala, Ahsan Mian, Nowrin H. Chamok, Mohammod Ali, Jallisa Clifford, Prasun Majumdar

Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A031, November 11–17, 2016

Paper No: IMECE2016-65880

DOI: https://doi.org/10.1115/IMECE2016-65880

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Topics: Additive manufacturing, Resonance, Computerized tomography, Density, Dielectric materials, Dimensions, Machinery, Manufacturing, Microscopes, Microscopy

Proceedings Papers

Highly Sensitive Pressure Sensor Using Two-Dimensionally Aligned Carbon Nanotube Bundles

Takuya Nozaki, Ken Suzuki, Hideo Miura

Proc. ASME. IMECE2015, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A030, November 13–19, 2015

Paper No: IMECE2015-53059

DOI: https://doi.org/10.1115/IMECE2015-53059

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Topics: Buckling, Carbon, Carbon nanotubes, Deformation, Dielectric materials, Elastic constants, Gages, Manganese (Metal), Multi-walled carbon nanotubes, Nanotubes

Proceedings Papers

Evolutionary Electromechanical Stability in Stressed Viscoelastic Dielectrics

Bo Li, Xuejing Liu, Hualing Chen

Proc. ASME. IMECE2015, Volume 9: Mechanics of Solids, Structures and Fluids, V009T12A080, November 13–19, 2015

Paper No: IMECE2015-50590

DOI: https://doi.org/10.1115/IMECE2015-50590

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Topics: Dielectric materials, Stability, Elastomers, Stress, Viscoelasticity, Deformation, Thermodynamics

Proceedings Papers

Cohesive Zone Models to Predict Multiple White Bumps in Flip-Chip Assemblies

Sathyanarayanan Raghavan, Ilko Schmadlak, George Leal, Suresh K. Sitaraman

Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A080, November 14–20, 2014

Paper No: IMECE2014-40199

DOI: https://doi.org/10.1115/IMECE2014-40199

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Topics: Flip-chip assemblies, Failure, Finite element model, Fracture (Process), Fracture mechanics, Microelectronic devices, Stress, Adhesives, Delamination, Dielectric materials

Proceedings Papers

Vibration Control of a Cantilever Beam by Metal-Core Flexoelectric and Piezoelectric Fibers

X. F. Zhang, H. Li, H. S. Tzou

Proc. ASME. IMECE2014, Volume 4B: Dynamics, Vibration, and Control, V04BT04A063, November 14–20, 2014

Paper No: IMECE2014-37772

DOI: https://doi.org/10.1115/IMECE2014-37772

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Topics: Cantilever beams, Fibers, Metals, Vibration control, Stress, Electric fields, Actuators, Crystals, Dielectric materials, Diluents

Proceedings Papers

A Study of a New Cooling Device Based on the Electrocaloric Effect

Wataru Sato

Proc. ASME. IMECE2013, Volume 8B: Heat Transfer and Thermal Engineering, V08BT09A002, November 15–21, 2013

Paper No: IMECE2013-62258

DOI: https://doi.org/10.1115/IMECE2013-62258

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Topics: Cooling, Pyroelectricity, Temperature, Heat pipes, Anisotropy, Capacitors, Ceramics, Dielectric materials, Electric fields, Fluids

Proceedings Papers

Dissociation of Carbon Dioxide Using a Microdischarge Plasma Reactor

Onur Taylan, Halil Berberoglu

Proc. ASME. IMECE2013, Volume 6A: Energy, V06AT07A087, November 15–21, 2013

Paper No: IMECE2013-64632

DOI: https://doi.org/10.1115/IMECE2013-64632

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Topics: Carbon dioxide, Plasmas (Ionized gases), Energy conversion, Flow (Dynamics), Dielectric materials, Electrodes, Temperature, Catalysts, Emissions, Gas chromatography

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NARROW

Control of Distributed Actuators Without Electrodes

In-Situ Warpage Measurement During Thermal Cycling of Dielectric Coated SS Substrate for Large Area MCM-D Packaging

Experimental Investigation on Chemical-Mechanical Polishing of Wafers With Low-Conductivity Dielectrics

Numerical Simulation of a Dielectric Material Exposed to Short Pulsed Laser Radiation

Localized Electron Evolution Induced by Femtosecond Laser Pulses in Water

Nano-Micro Scale Characterization of Dielectric Materials

Modeling of Moving Breakdown by Femtosecond Laser Pulses in Dielectrics

Parametric Study of the Ablation Characteristics of Absorbing Dielectrics by Short Pulse Laser

Thermal and Thermomechanical Phenomena During Ultrafast Laser Interaction With Tissue

Interfacial Delamination Propagation in Multi-Layered High-Density Wiring Electronic Packaging Structures

Validation of an Atomistic Field Theory for Contact Electrification Using a MEMS Load Cell

Experimental Analysis of Alternative Dielectric Materials for DBD Plasma Actuators

Experimental Thermal Characterization of DBD Plasma Actuators

3D Printed Porous Dielectric Substrates for RF Applications

Highly Sensitive Pressure Sensor Using Two-Dimensionally Aligned Carbon Nanotube Bundles

Evolutionary Electromechanical Stability in Stressed Viscoelastic Dielectrics

Cohesive Zone Models to Predict Multiple White Bumps in Flip-Chip Assemblies

Vibration Control of a Cantilever Beam by Metal-Core Flexoelectric and Piezoelectric Fibers

A Study of a New Cooling Device Based on the Electrocaloric Effect

Dissociation of Carbon Dioxide Using a Microdischarge Plasma Reactor

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