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Proceedings Papers

Driving PWA Thermomechanical Analysis From Step AP210 Product Models

Diego R. Tamburini, Russell S. Peak, Robert E. Fulton

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 33-45, November 16–21, 1997

Paper No: IMECE1997-1212

DOI: https://doi.org/10.1115/IMECE1997-1212

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Topics: Thermomechanics, Design, Arches, Computer programming, Electrical wires, Geometry, Manufacturing, Mentoring, Product design, Thrust

Proceedings Papers

Damage Initiation and Progression in Multidirectional Laminates With a Hole

J. R. Schaff, R. Y. Kim

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 261, November 15–20, 1998

Paper No: IMECE1998-1197

DOI: https://doi.org/10.1115/IMECE1998-1197

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Topics: Damage, Laminates, Composite materials, Acoustic emissions, Aerospace industry, Bearings, Databases, Electrical wires, Fasteners, Graphite fibers

Proceedings Papers

Piezoceramic Active Vibration Suppression System B-1B Flight Demonstration

Charles R. Larson, Eric Falangas, Melvin Weiss, Ratnakar R. Neurgoankar, Jeffrey G. Nelson, Joseph S. Rosenthal, Demetrious G. Zaferis, Stephen F. McGrath

Proc. ASME. IMECE98, Adaptive Structures and Material Systems, 157-166, November 15–20, 1998

Paper No: IMECE1998-0949

DOI: https://doi.org/10.1115/IMECE1998-0949

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Topics: Flight, Piezoelectric ceramics, Vibration suppression, Aircraft, Actuators, Vibration, Design, Skin, Electrical wires, Hardware

Proceedings Papers

In Vitro Quasi-Static and Cyclic Biomechanics of a Cervical Spine Posterior Plate Versus Facet Wiring in a Laminectomy Model

Jeffrey L. Scifert, Vijay K. Goel, Darin W. Smith, Vincent C. Traynelis

Proc. ASME. IMECE98, Advances in Bioengineering, 209-210, November 15–20, 1998

Paper No: IMECE1998-0104

DOI: https://doi.org/10.1115/IMECE1998-0104

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Topics: Biomechanics, Cervical spine, Electrical wires, Plates (structures), Stability, Fatigue, Plating, Screws, Torque, Wire

Proceedings Papers

Experimental and Computational Investigations of a Cylinder in Crossflow

Nathan J. Patterson, Prabhakar Venkateswaran

Proc. ASME. IMECE2021, Volume 9: Engineering Education, V009T09A050, November 1–5, 2021

Paper No: IMECE2021-70342

DOI: https://doi.org/10.1115/IMECE2021-70342

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Topics: Cylinders, Students, Flow (Dynamics), Fluid dynamics, Computer programming, Pressure sensors, Transients (Dynamics), Analytical methods, Boundary-value problems, Computational fluid dynamics

Proceedings Papers

Development of Thin Metal Film Deposition Process for the Intravascular Catheter

Seok Chung, Jun Keun Chang, Dong Chul Han

Proc. ASME. IMECE99, Advances in Bioengineering, 65-66, November 14–19, 1999

Paper No: IMECE1999-0379

DOI: https://doi.org/10.1115/IMECE1999-0379

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Topics: Catheters, Metallic films, Actuators, Copper, Sensors, Biomedicine, Evaporation, Microelectromechanical systems, Signals, Biocompatibility

Proceedings Papers

In Vitro Testing of Posterior Cervical Lateral Mass Plating Systems: Comparison of Constrained Versus Semi-Constrained Screw-Slot Connections

Denis J. DiAngelo, Bobby J. McVay, Kristine M. Olney, Kevin T. Foley

Proc. ASME. IMECE2000, Advances in Bioengineering, 133-134, November 5–10, 2000

Paper No: IMECE2000-2551

DOI: https://doi.org/10.1115/IMECE2000-2551

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Topics: Plating, Screws, Testing, Stability, Cervical spine, Plates (structures), Biomechanics, Electrical wires, Wire

Proceedings Papers

HDD Tracking Microactuator and Its Integration Issues

Toshiki Hirano, Long-Sheng Fan, Dan Kercher, Surya Pattanaik, Tzong-Shii Pan

Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 449-452, November 5–10, 2000

Paper No: IMECE2000-1130

DOI: https://doi.org/10.1115/IMECE2000-1130

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Topics: Horizontal directional drilling, Microactuators, Solders, Bonding, Circuits, Dynamics (Mechanics), Electrical wires, Electronics, Grinding, Lasers

Proceedings Papers

Interfacial Delamination Propagation in Multi-Layered High-Density Wiring Electronic Packaging Structures

Hurang Hu, Weidong Xie, Suresh Sitaraman

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 103-111, November 5–10, 2000

Paper No: IMECE2000-2251

DOI: https://doi.org/10.1115/IMECE2000-2251

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Topics: Delamination, Density, Electrical wires, Electronic packaging, Copper, Materials properties, Temperature, Thermoelasticity, Design, Dielectric materials

Proceedings Papers

Flexible Valveless Pump for Bio Applications

Masoud Naghdi, Farhad Farzbod, Paul M. Goggans

Proc. ASME. IMECE2019, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T12A017, November 11–14, 2019

Paper No: IMECE2019-12270

DOI: https://doi.org/10.1115/IMECE2019-12270

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Topics: Pumps, Design, Liquid metals, Wire, Actuators, Electromechanical actuators, Valves, Alloys, Biological cells, Diffusers

Proceedings Papers

Investigation of Shock Waves Generated by Electrical Wire Explosion

Ben Liu, Deguo Wang, Yanbao Guo

Proc. ASME. IMECE2016, Volume 9: Mechanics of Solids, Structures and Fluids; NDE, Diagnosis, and Prognosis, V009T12A052, November 11–17, 2016

Paper No: IMECE2016-65491

DOI: https://doi.org/10.1115/IMECE2016-65491

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Topics: Electrical wires, Explosions, Shock waves, Wire, Pipes, Capacitors, Electrodes, Frequency-domain analysis, Metals, Petroleum

Proceedings Papers

Foam Insulation Behavior in Void Space Under Fire Conditions

Andrew Kurzawski, Ofodike A. Ezekoye

Proc. ASME. IMECE2014, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A030, November 14–20, 2014

Paper No: IMECE2014-38849

DOI: https://doi.org/10.1115/IMECE2014-38849

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Topics: Fire, Insulation, Space, Construction, Skin, Wallboard, Wood products, Building materials, Ceilings, Electrical wires

Proceedings Papers

Some Issues in Passive Impact Location Detection Triangulation in Composite Materials Using Embedded Piezoelectric Sensors

Bruno Zamorano-Senderos, Niell Elvin, Samuel Shin

Proc. ASME. IMECE2012, Volume 3: Design, Materials and Manufacturing, Parts A, B, and C, 1321-1328, November 9–15, 2012

Paper No: IMECE2012-88896

DOI: https://doi.org/10.1115/IMECE2012-88896

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Topics: Composite materials, Sensors, Computation, Damage, Electrical wires, Evaluation methods

Proceedings Papers

A Study on the Fluid Flow for Effective Polishing Process in CMP Equipment

Kang-Woo Joo, Suyeon Lee, Jiyoung Hwang, Kwang-Sun Kim

Proc. ASME. IMECE2012, Volume 5: Education and Globalization; General Topics, 551-555, November 9–15, 2012

Paper No: IMECE2012-87213

DOI: https://doi.org/10.1115/IMECE2012-87213

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Topics: Fluid dynamics, Polishing, Slurries, Nozzles, Semiconductor wafers, Density, Electrical wires, Flow (Dynamics), Integrated circuit fabrication, Metals

Proceedings Papers

Conversion of a Dune Buggy to a Hybrid Vehicle as a Systems Design Course Project

Emin Yilmaz

Proc. ASME. IMECE2011, Volume 5: Engineering Education and Professional Development, 141-150, November 11–17, 2011

Paper No: IMECE2011-65392

DOI: https://doi.org/10.1115/IMECE2011-65392

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Topics: Design education, Hybrid electric vehicles, Students, Design, Vehicles, Electrical wires, Engines, Homework, Mechanical engineering, Springs

Proceedings Papers

A Formal Approach on Specification Modeling to Support Industrial PLC Program Verification

Soumen De, Nagarajan Sethuraman, Chengyin Yuan

Proc. ASME. IMECE2008, Volume 7: Emerging Technologies; Recent Advances in Engineering, 59-67, October 31–November 6, 2008

Paper No: IMECE2008-67458

DOI: https://doi.org/10.1115/IMECE2008-67458

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Topics: Modeling, Testing, Electrical wires, Manufacturing automation, Automotive industry, Computer software, Design, Engineers, Errors, Formal methods

Proceedings Papers

Remotely Powered, Hermetic RF MEMS Pressure Sensor

E. Andarawis, E. Berkcan, B. Kashef

Proc. ASME. IMECE2008, Volume 2: Biomedical and Biotechnology Engineering, 259-263, October 31–November 6, 2008

Paper No: IMECE2008-68992

DOI: https://doi.org/10.1115/IMECE2008-68992

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Topics: Microelectromechanical systems, Pressure sensors, Sensors, Electrical wires, Errors, Pressure

Proceedings Papers

Analysis of the Piezoelectric Ceramics PLZT With ANSYS

L. Liang, S. P. Wang, F. Cao

Proc. ASME. IMECE2007, Volume 13: Processing and Engineering Applications of Novel Materials, 251-255, November 11–15, 2007

Paper No: IMECE2007-41551

DOI: https://doi.org/10.1115/IMECE2007-41551

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Topics: Piezoelectric ceramics, Ceramics, Computer software, Finite element analysis, Servomechanisms, Signals, Displacement, Dynamics (Mechanics), Electrical wires, Electromagnetic interference

Proceedings Papers

Preferred Vehicle Scaling

Michael L. Jonson

Proc. ASME. IMECE2007, Volume 1: Advances in Aerospace Technology, 63-69, November 11–15, 2007

Paper No: IMECE2007-41135

DOI: https://doi.org/10.1115/IMECE2007-41135

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Topics: Vehicles, Acoustics, Density, Electrical wires, Engineering disciplines, Fasteners, Fluids, Manufacturing, Permeability, Pipes

Proceedings Papers

Integrated Hierarchical Durability Design Tool for Electronic Packaging

Jung-Chuan Lee, David W. Twigg, Mostafa Rassaian

Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 313-317, November 11–15, 2007

Paper No: IMECE2007-41253

DOI: https://doi.org/10.1115/IMECE2007-41253

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Topics: Design, Durability, Electronic packaging, Solder joints, Fatigue analysis, Vibration, Acoustics, Construction, Electrical wires, Fatigue failure

NARROW

Driving PWA Thermomechanical Analysis From Step AP210 Product Models

Damage Initiation and Progression in Multidirectional Laminates With a Hole

Piezoceramic Active Vibration Suppression System B-1B Flight Demonstration

In Vitro Quasi-Static and Cyclic Biomechanics of a Cervical Spine Posterior Plate Versus Facet Wiring in a Laminectomy Model

Experimental and Computational Investigations of a Cylinder in Crossflow

Development of Thin Metal Film Deposition Process for the Intravascular Catheter

In Vitro Testing of Posterior Cervical Lateral Mass Plating Systems: Comparison of Constrained Versus Semi-Constrained Screw-Slot Connections

HDD Tracking Microactuator and Its Integration Issues

Interfacial Delamination Propagation in Multi-Layered High-Density Wiring Electronic Packaging Structures

Flexible Valveless Pump for Bio Applications

Investigation of Shock Waves Generated by Electrical Wire Explosion

Foam Insulation Behavior in Void Space Under Fire Conditions

Some Issues in Passive Impact Location Detection Triangulation in Composite Materials Using Embedded Piezoelectric Sensors

A Study on the Fluid Flow for Effective Polishing Process in CMP Equipment

Conversion of a Dune Buggy to a Hybrid Vehicle as a Systems Design Course Project

A Formal Approach on Specification Modeling to Support Industrial PLC Program Verification

Remotely Powered, Hermetic RF MEMS Pressure Sensor

Analysis of the Piezoelectric Ceramics PLZT With ANSYS

Preferred Vehicle Scaling

Integrated Hierarchical Durability Design Tool for Electronic Packaging

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