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Proceedings Papers

A Review of Changes and Trends Affecting Military Electronics Manufacturing

Anthony J. Rafanelli

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 447-451, November 16–21, 1997

Paper No: IMECE1997-1122

DOI: https://doi.org/10.1115/IMECE1997-1122

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Topics: Electronics, Manufacturing, Military systems, Defense industry, Aerospace industry, Coatings, Design, Proton exchange membranes, US Department of Defense

Proceedings Papers

Active Structural Control of Vertical Turning Lathe Vibrations

John E. Miesner, Reza Ghanadan, Stephen D. O’Regan

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 105-112, November 16–21, 1997

Paper No: IMECE1997-1082

DOI: https://doi.org/10.1115/IMECE1997-1082

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Topics: Turning, Vibration, Control equipment, Signals, Accelerometers, Actuators, Capacitors, Chatter, Control systems, Electronic components

Proceedings Papers

Video Based Manufacturing Courses for Electronics

John A. Fillo, Chittaranjan Sahay, Krishnaswami Srihari

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 471-477, November 16–21, 1997

Paper No: IMECE1997-1126

DOI: https://doi.org/10.1115/IMECE1997-1126

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Topics: Electronics, Manufacturing, Defense industry, Packaging, Students, Wire

Proceedings Papers

Low Cost Plastic Packaging of the Network Interface Unit

M. A. Zimmerman

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 65-80, November 16–21, 1997

Paper No: IMECE1997-0815

DOI: https://doi.org/10.1115/IMECE1997-0815

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Topics: Packaging, Electronics, Snap fitting, Design, Fire resistance, Gaskets, Heat, Hinges, Injection molded plastics, Low temperature

Proceedings Papers

Computer Aided Modeling of Induced Strain Actuators and Other Piezoelectric Structures

Philippe Bouchilloux, R. Le Letty, N. Lhermet, F. Claeyssen

Proc. ASME. IMECE97, Dynamic Systems and Control, 307-312, November 16–21, 1997

Paper No: IMECE1997-0410

DOI: https://doi.org/10.1115/IMECE1997-0410

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Topics: Actuators, Computer-aided engineering, Modeling, Design, Finite element methods, Active damping, Design methodology, Electronics, Engineering simulation, Mechatronic devices

Proceedings Papers

6-DOF Desk-Top Voice-Coil Joystick

S. E. Salcudean, N. R. Parker

Proc. ASME. IMECE97, Dynamic Systems and Control, 131-137, November 16–21, 1997

Paper No: IMECE1997-0387

DOI: https://doi.org/10.1115/IMECE1997-0387

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Topics: Design, Electronics, Force feedback, Geometry, Haptics, Rotation, Sensors

Proceedings Papers

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

Shoji Kamiya, Hironori Takahashi, Masumi Saka, Hiroyuki Abé

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 169-174, November 16–21, 1997

Paper No: IMECE1997-0513

DOI: https://doi.org/10.1115/IMECE1997-0513

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Topics: Adhesives, Fracture (Materials), Fracture (Process), Particulate matter, Synthetic diamonds, Chemical vapor deposition, Diamond films, Nucleation (Physics), Stress, Electronics

Proceedings Papers

High Resolution Single Crystal Silicon Accelerometer Using Silicon Fusion Bonding and Deep Reactive Ion Etching

B. P. van Drieënhuizen, N. I. Maluf

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 9-12, November 16–21, 1997

Paper No: IMECE1997-0931

DOI: https://doi.org/10.1115/IMECE1997-0931

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Topics: Accelerometers, Bonding, Crystals, Reactive-ion etching, Resolution (Optics), Silicon, Noise (Sound), Complementary metal oxide semiconductors, Brownian motion, Electronics

Proceedings Papers

Nanoscale Thermometry Using Scanning Joule Expansion Microscopy

Arun Majumdar, John Varesi

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 171-179, November 16–21, 1997

Paper No: IMECE1997-0955

DOI: https://doi.org/10.1115/IMECE1997-0955

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Topics: Joules, Microscopy, Nanoscale phenomena, Temperature measurement, Atomic force microscopy, Imaging, Metals, Resolution (Optics), Signals, Temperature distribution

Proceedings Papers

Manufacturability of Underfill Processing for Low Cost Flip Chip

Daniel F. Baldwin, Nathan W. Pascarella

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 21-31, November 16–21, 1997

Paper No: IMECE1997-0812

DOI: https://doi.org/10.1115/IMECE1997-0812

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Topics: Flip-chip, Flip-chip devices, Flow (Dynamics), Compression, Electronics, Manufacturing, Printed circuit boards, Reliability, Semiconductor devices, Surface mount packaging

Proceedings Papers

Integrated Electromechanical Devices for Active Control of Vibration and Sound

Eric H. Anderson, Mark D. Holcomb, Donald J. Leo, Adam X. Bogue, Farla R. Russo

Proc. ASME. IMECE97, Adaptive Structures and Material Systems, 67-80, November 16–21, 1997

Paper No: IMECE1997-0179

DOI: https://doi.org/10.1115/IMECE1997-0179

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Topics: Electromechanical devices, Vibration, Design, Electronics, Transducers, Actuators, Flexible electronics, Noise control, Piezoelectric ceramics, Piezoelectric materials

Proceedings Papers

Power Flow Analysis of an Electrostrictive Actuator Driven by a PWM Amplifier

Gregory A. Zvonar, Douglas K. Lindner

Proc. ASME. IMECE97, Adaptive Structures and Material Systems, 155-162, November 16–21, 1997

Paper No: IMECE1997-0189

DOI: https://doi.org/10.1115/IMECE1997-0189

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Topics: Actuators, Flow (Dynamics), Control equipment, Dynamic models, Design, Electricity (Physics), Electronics

Proceedings Papers

Mixture Flow Pattern Recognition Based Upon On-Line Analysis of Physical Parameters

Brian E. Williams, Alice B. Soulek

Proc. ASME. IMECE97, Advances in Bioengineering, 5, November 16–21, 1997

Paper No: IMECE1997-0200

DOI: https://doi.org/10.1115/IMECE1997-0200

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Topics: Flow (Dynamics), Pattern recognition, Fluids, Dynamics (Mechanics), Pressure, Bioengineering, Blood, Computer-aided engineering, Design, Electronics

Proceedings Papers

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Prema Palaniappan, Daniel F. Baldwin

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997

Paper No: IMECE1997-1221

DOI: https://doi.org/10.1115/IMECE1997-1221

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Topics: Density, Electronics, Flip-chip, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture (Process), Glass transition, Manufacturing, Printed circuit boards

Proceedings Papers

Testing and Measurement Techniques Applied to Electronic Packaging Development

Yifan Guo, Vijay Sarihan

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 85-90, November 16–21, 1997

Paper No: IMECE1997-1231

DOI: https://doi.org/10.1115/IMECE1997-1231

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Topics: Electronic packaging, Testing, Cycles, Design, Electronic packages, Electronics, Engineering disciplines, Event history analysis, Experimental methods, Packaging

Proceedings Papers

Utilization of Standard CMOS Layers for Microchannels

Angela Rasmussen, Laurie E. Locascio, Michael Gaitan, Mona E. Zaghloul

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 407-411, November 15–20, 1998

Paper No: IMECE1998-1277

DOI: https://doi.org/10.1115/IMECE1998-1277

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Topics: Complementary metal oxide semiconductors, Microchannels, Micromachining, Actuators, Electronics, Integrated circuits, Metals, Sensors

Proceedings Papers

A High Performance Hand-Held Gas Chromatograph

Conrad M. Yu, Matthew Lucas, Jackson C. Koo, Paul Stratton, Terri DeLima, Elaine Behymer

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 481-486, November 15–20, 1998

Paper No: IMECE1998-1288

DOI: https://doi.org/10.1115/IMECE1998-1288

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Topics: Gas chromatography, Microelectromechanical systems, Sensors, Ejectors, Separation (Technology), Batteries, Bridges (Structures), Computer software, Electrical measurement, Electricity (Physics)

Proceedings Papers

Stand Alone Micro Liquid Dosing System

R. Roßberg, H. Sandmaier, S. Büttgenbach

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 179-186, November 15–20, 1998

Paper No: IMECE1998-1240

DOI: https://doi.org/10.1115/IMECE1998-1240

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Topics: Actuators, Batteries, Control systems, Electronics, Flow (Dynamics), Micromachining, Polishing equipment, Pressure, Reservoirs, Resonance

Proceedings Papers

A Smart Shape Memory Alloy Actuated Microvalve With Feedback Control

Krishnan Nandakumar, Allen G. Parr, Geon Hahm, Michael A. Huff, Stephen M. Phillips

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 139-143, November 15–20, 1998

Paper No: IMECE1998-1234

DOI: https://doi.org/10.1115/IMECE1998-1234

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Topics: Feedback, Shape memory alloys, Valves, Flow (Dynamics), Flow sensors, Micromachining, Air flow, Control equipment, Electronics, Fluids

Proceedings Papers

Ceramic Tape-Based Meso Systems Technology

Haim H. Bau, Suresh G. K. Ananthasuresh, Jorge J. Santiago-Avilés, Jihua Zhong, Moon Kim, Mingqiang Yi, Patricio Espinoza-Vallejos, Luis Sola-Laguna

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 491-498, November 15–20, 1998

Paper No: IMECE1998-1290

DOI: https://doi.org/10.1115/IMECE1998-1290

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Topics: Ceramics, Glass, Manufacturing, Silicon, Binders (Materials), Firing, Flow (Dynamics), Lamination, Low temperature, Microelectromechanical systems

2 3 4 5

NARROW

A Review of Changes and Trends Affecting Military Electronics Manufacturing

Active Structural Control of Vertical Turning Lathe Vibrations

Video Based Manufacturing Courses for Electronics

Low Cost Plastic Packaging of the Network Interface Unit

Computer Aided Modeling of Induced Strain Actuators and Other Piezoelectric Structures

6-DOF Desk-Top Voice-Coil Joystick

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

High Resolution Single Crystal Silicon Accelerometer Using Silicon Fusion Bonding and Deep Reactive Ion Etching

Nanoscale Thermometry Using Scanning Joule Expansion Microscopy

Manufacturability of Underfill Processing for Low Cost Flip Chip

Integrated Electromechanical Devices for Active Control of Vibration and Sound

Power Flow Analysis of an Electrostrictive Actuator Driven by a PWM Amplifier

Mixture Flow Pattern Recognition Based Upon On-Line Analysis of Physical Parameters

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Testing and Measurement Techniques Applied to Electronic Packaging Development

Utilization of Standard CMOS Layers for Microchannels

A High Performance Hand-Held Gas Chromatograph

Stand Alone Micro Liquid Dosing System

A Smart Shape Memory Alloy Actuated Microvalve With Feedback Control

Ceramic Tape-Based Meso Systems Technology

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