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Proceedings Papers

Nondestructive Elastic Property Characterization of IC Encapsulants

Sridhar Canumalla, Michael G. Oravecz

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 25-32, November 16–21, 1997

Paper No: IMECE1997-0496

DOI: https://doi.org/10.1115/IMECE1997-0496

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Topics: Delamination, Elasticity, Fillers (Materials), Flip-chip packages, Integrated circuit packaging, Molding, Process control, Reliability, Resins, Young's modulus

Proceedings Papers

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

E. Madenci, S. Shkarayev, R. Mahajan

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 61-71, November 16–21, 1997

Paper No: IMECE1997-0501

DOI: https://doi.org/10.1115/IMECE1997-0501

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Topics: Failure, Flip-chip packages, Stress, Design, Electronic packages, Thermomechanics, Adhesive joints, Cracking (Materials), Fillers (Materials), Finite element analysis

Proceedings Papers

Passive Control of Multi-Jointed Structures

Mohammed M. Ettouney, Raymond P. Daddazio, Najib N. Abboud

Proc. ASME. IMECE97, Active/Passive Vibration Control and Nonlinear Dynamics of Structures, 69-78, November 16–21, 1997

Paper No: IMECE1997-0561

DOI: https://doi.org/10.1115/IMECE1997-0561

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Topics: Passive control, Noise (Sound), Energy dissipation, Waves, Design, Engineers, Equilibrium (Physics), Fillers (Materials), Filters, Machinery

Proceedings Papers

Well-Dispersed Suspension Formation for Infiltration of Ceramic Fiber Preforms With SiC-Filled Polysiloxane Resins

Merve Erdal, Marianne Boschelli, Selçuk Güçeri

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 409-410, November 16–21, 1997

Paper No: IMECE1997-0693

DOI: https://doi.org/10.1115/IMECE1997-0693

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Topics: Ceramic fibers, Preforms, Resins, Polymers, Ceramics, Composite materials, Cycles, Ceramic composites, Fiber reinforced ceramics, Fillers (Materials)

Proceedings Papers

Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles

M. Uschitsky, E. Suhir

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 141-170, November 16–21, 1997

Paper No: IMECE1997-0818

DOI: https://doi.org/10.1115/IMECE1997-0818

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Topics: Diffusion (Physics), Epoxy adhesives, Epoxy resins, Molding, Particulate matter, Fillers (Materials), Stress, Weight (Mass), Electronic packaging, Indium compounds

Proceedings Papers

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

M. Uschitsky, E. Suhir, G. W. Kammlott

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 171-206, November 16–21, 1997

Paper No: IMECE1997-0819

DOI: https://doi.org/10.1115/IMECE1997-0819

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Topics: Composite materials, Molding, Thermoelasticity, Fillers (Materials), Thermal stresses, Epoxy adhesives, Epoxy resins, Design, Integrated circuits, Reliability

Proceedings Papers

Preform-Particle-Flow Interactions in Impregnation of Fibrous Preforms With Particle-Filled Resin

Merve Erdal, Selçuk Güçeri

Proc. ASME. IMECE98, Rheology and Fluid Mechanics of Nonlinear Materials, 189-196, November 15–20, 1998

Paper No: IMECE1998-0464

DOI: https://doi.org/10.1115/IMECE1998-0464

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Topics: Flow (Dynamics), Particulate matter, Preforms, Resins, Filtration, Fibers, Fillers (Materials), Permeability, Anisotropy, Ceramic composites

Proceedings Papers

Mechanical Properties of Cellular Polyurethanes Filled With Polyurethane Disperse Filler

Karena L. Swisher, Fyodor A. Shutov

Proc. ASME. IMECE98, Porous, Cellular and Microcellular Materials, 53-60, November 15–20, 1998

Paper No: IMECE1998-0924

DOI: https://doi.org/10.1115/IMECE1998-0924

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Topics: Fillers (Materials), Mechanical properties, Urethane elastomers, Foams (Chemistry), Compression, Extruding, Mechanical behavior, Pressure, Shear (Mechanics), Shear stress

Proceedings Papers

Fracture Behavior of Kaolin-Reinforced High Density Polyethylene

Robert C. Wetherhold, Dionysios E. Mouzakis

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 349-360, November 15–20, 1998

Paper No: IMECE1998-1215

DOI: https://doi.org/10.1115/IMECE1998-1215

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Topics: Density, Fracture (Materials), Fracture (Process), Kaolin, Fracture toughness, Composite materials, Heat treating (Metalworking), Fillers (Materials), Injection molding, Manufacturing

Proceedings Papers

Robotic-Based Repair of Concrete Structures: A Surface Crack Filler Robot

Melinda Stevens, Samuel Arellano, Diego Rodriguez, James Wilson, Zady Gutierrez, Noah Trudell, Hamed Momeni, Arvin Ebrahimkhanlou

Proc. ASME. IMECE2021, Volume 13: Safety Engineering, Risk, and Reliability Analysis; Research Posters, V013T15A014, November 1–5, 2021

Paper No: IMECE2021-72082

DOI: https://doi.org/10.1115/IMECE2021-72082

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Topics: Concretes, Fillers (Materials), Maintenance, Robotics, Robots, Surface cracks

Proceedings Papers

Experimental Analysis of Particle Filtration in Resin Transfer Molding of Preceramic Polymer Based Ceramic Composites

Merve Erdal, Letizia A. Ambrosoni

Proc. ASME. IMECE99, The Science, Automation, and Control of Material Processes Involving Coupled Transport and Rheology Changes, 25-32, November 14–19, 1999

Paper No: IMECE1999-1251

DOI: https://doi.org/10.1115/IMECE1999-1251

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Topics: Ceramic composites, Experimental analysis, Filtration, Particulate matter, Polymers, Resins, Transfer molding, Agglomeration (Materials), Composite materials, Fillers (Materials)

Proceedings Papers

Filler Dispersion Measurements Within Thermal Management Materials for Electronic Applications

Nancy E. Mathis

Proc. ASME. IMECE99, Heat Transfer: Volume 1, 37-41, November 14–19, 1999

Paper No: IMECE1999-0968

DOI: https://doi.org/10.1115/IMECE1999-0968

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Topics: Fillers (Materials), Thermal management, Electronic packaging, Fibers, Thermal conductivity

Proceedings Papers

Short Carbon Fibers Composites With High Filler Contents Rheology and Mechanical Properties

Y. Schmitt, C. Paulick, Y. Bour, F. X. Royer

Proc. ASME. IMECE99, Polymeric Systems, 17-24, November 14–19, 1999

Paper No: IMECE1999-1200

DOI: https://doi.org/10.1115/IMECE1999-1200

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Topics: Carbon fibers, Composite materials, Fillers (Materials), Mechanical properties, Rheology, Resins, Aluminum, Microbubbles, Molding, Polymers

Proceedings Papers

Effect of Thermal Residual Stresses on Polymer/Metal Interfacial Adhesion

Qizhou Yao, Jianmin Qu

Proc. ASME. IMECE99, Polymeric Systems, 25-28, November 14–19, 1999

Paper No: IMECE1999-1201

DOI: https://doi.org/10.1115/IMECE1999-1201

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Topics: Adhesion, Metals, Polymers, Residual stresses, Adhesives, Stress, Aluminum, Epoxy adhesives, Epoxy resins, Fracture (Materials)

Proceedings Papers

Experimental and Numerical Modeling of Gaseous Carbon Dioxide Injecting Into Aqueous Water in Bottle Filler System

Y. H. Zheng, R. S. Amano

Proc. ASME. IMECE2001, Heat Transfer: Volume 2 — Heat Transfer in Multiphase Systems, 249-257, November 11–16, 2001

Paper No: IMECE2001/HTD-24174

DOI: https://doi.org/10.1115/IMECE2001/HTD-24174

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Topics: Carbon dioxide, Computer simulation, Fillers (Materials), Water, Design, Computational fluid dynamics, Flow (Dynamics), Mass transfer, Modeling, Pressure

Proceedings Papers

Modeling and Measurement of Pressure-Dependent Junction-Spreader Thermal Resistance for Integrated Circuits

Peng Zhou, Kenneth E. Goodson

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 51-57, November 11–16, 2001

Paper No: IMECE2001/HTD-24377

DOI: https://doi.org/10.1115/IMECE2001/HTD-24377

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Topics: Integrated circuits, Junctions, Modeling, Pressure, Thermal resistance, Electronic packages, Transients (Dynamics), Electronic packaging, Experimental methods, Fillers (Materials)

Proceedings Papers

Effect of Particle Volume Fraction on the Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material

Ravi S. Prasher, Paul Koning, James Shipley, Amit Devpura

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 67-73, November 11–16, 2001

Paper No: IMECE2001/HTD-24379

DOI: https://doi.org/10.1115/IMECE2001/HTD-24379

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Topics: Particulate matter, Stiffness, Thermal conductivity, Percolation theory, Contact resistance, Fillers (Materials), Modeling, Polymers, Viscosity

Proceedings Papers

Vibration Analysis of Multifunctional Satellite Structure

H. Nayeb-Hashemi, A. Vaziri

Proc. ASME. IMECE2001, Vibration and Control of Mechanical Systems, 291-300, November 11–16, 2001

Paper No: IMECE2001/DE-23236

DOI: https://doi.org/10.1115/IMECE2001/DE-23236

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Topics: Cantilevers, Damping, Fillers (Materials), Fuels, Hammers, High pressure (Physics), Magnetic fields, Pipes, Pressure, Satellites

Proceedings Papers

Development of Biomechanical Cervical Spine Physical Models

Lisa M. Milkowski, Robert S. Crockett, Srirangam Kumaresan

Proc. ASME. IMECE2000, Advances in Bioengineering, 241-242, November 5–10, 2000

Paper No: IMECE2000-2600

DOI: https://doi.org/10.1115/IMECE2000-2600

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Topics: Biomechanics, Cervical spine, Composite materials, Fillers (Materials), Epoxy adhesives, Epoxy resins, Rapid prototyping

Proceedings Papers

Percolation Theory Applied to Study the Effect of Shape and Size of the Filler Particles in Thermal Interface Materials

Amit Devpura, Patrick E. Phelan, Ravi S. Prasher

Proc. ASME. IMECE2000, Heat Transfer: Volume 4, 365-371, November 5–10, 2000

Paper No: IMECE2000-1541

DOI: https://doi.org/10.1115/IMECE2000-1541

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Topics: Fillers (Materials), Particulate matter, Percolation theory, Shapes, Composite materials, Flip-chip, Heat, Thermal conductivity, Chain, Electrical engineering

2 3 4 5

NARROW

Nondestructive Elastic Property Characterization of IC Encapsulants

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

Passive Control of Multi-Jointed Structures

Well-Dispersed Suspension Formation for Infiltration of Ceramic Fiber Preforms With SiC-Filled Polysiloxane Resins

Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

Preform-Particle-Flow Interactions in Impregnation of Fibrous Preforms With Particle-Filled Resin

Mechanical Properties of Cellular Polyurethanes Filled With Polyurethane Disperse Filler

Fracture Behavior of Kaolin-Reinforced High Density Polyethylene

Robotic-Based Repair of Concrete Structures: A Surface Crack Filler Robot

Experimental Analysis of Particle Filtration in Resin Transfer Molding of Preceramic Polymer Based Ceramic Composites

Filler Dispersion Measurements Within Thermal Management Materials for Electronic Applications

Short Carbon Fibers Composites With High Filler Contents Rheology and Mechanical Properties

Effect of Thermal Residual Stresses on Polymer/Metal Interfacial Adhesion

Experimental and Numerical Modeling of Gaseous Carbon Dioxide Injecting Into Aqueous Water in Bottle Filler System

Modeling and Measurement of Pressure-Dependent Junction-Spreader Thermal Resistance for Integrated Circuits

Effect of Particle Volume Fraction on the Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material

Vibration Analysis of Multifunctional Satellite Structure

Development of Biomechanical Cervical Spine Physical Models

Percolation Theory Applied to Study the Effect of Shape and Size of the Filler Particles in Thermal Interface Materials

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