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Proceedings Papers

Thermal Mechanical Properties of Two Solder Alloys

Wei Ren, Zhengfang Qian, Minfu Lu, Sheng Liu, Dongkai Shangguan

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 125-130, November 16–21, 1997

Paper No: IMECE1997-1237

DOI: https://doi.org/10.1115/IMECE1997-1237

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Topics: Alloys, Mechanical properties, Solders, Fatigue, Lead-free solders, Computers, Creep, Electronic packaging, Strips, Testing

Proceedings Papers

Creep Behavior of PB-Free Solders

F. Hua, C. M. Garner, H. G. Song, J. W. Morris

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 219-229, November 11–16, 2001

Paper No: IMECE2001/EPP-24728

DOI: https://doi.org/10.1115/IMECE2001/EPP-24728

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Topics: Creep, Lead-free solders, Tin, Cooling, Solder joints, Stress, Diffusion (Physics), Solders, Furnaces, Intermetallic compounds

Proceedings Papers

Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board

John H. Lau, Stephen H. Pan, Chris Chang

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 79-89, November 5–10, 2000

Paper No: IMECE2000-2249

DOI: https://doi.org/10.1115/IMECE2000-2249

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Topics: Creep, Lead-free solders, Printed circuit boards, Semiconductor wafers, Alloys, Shear (Mechanics), Shear stress, Solder joints, Solders, Constitutive equations

Proceedings Papers

Thermal Aging Effect on the Ball Shear Strength of Pb-Free Solders on a Ceramic Substrate With Pd/Ag Surface Metallization

Xing Jia Huang, Shi-Wei Ricky Lee, Wan Sze Tse

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 167-171, November 5–10, 2000

Paper No: IMECE2000-2259

DOI: https://doi.org/10.1115/IMECE2000-2259

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Topics: Ceramics, Lead-free solders, Shear strength

Proceedings Papers

Atomistic Investigation on Mechanical Properties of Sn-Ag-Cu Based Nanocrystalline Solder Material

Mohammad Motalab, Rafsan A. S. I. Subad, Ayesha Ahmed, Pritom Bose, Ratul Paul, Jeffrey C. Suhling

Proc. ASME. IMECE2019, Volume 12: Advanced Materials: Design, Processing, Characterization, and Applications, V012T10A035, November 11–14, 2019

Paper No: IMECE2019-12109

DOI: https://doi.org/10.1115/IMECE2019-12109

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Topics: Mechanical properties, Solders, Tin, Tensile strength, Simulation, Temperature, Atoms, Crystals, Ductility, Electrical components

Proceedings Papers

Anand Viscoplasticity Model for the Effect of Aging on Mechanical Behavior of SAC305 Operating at High Strain Rate and High Temperature

Pradeep Lall, Di Zhang, Jeff Suhling, David Locker

Proc. ASME. IMECE2015, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A023, November 13–19, 2015

Paper No: IMECE2015-53751

DOI: https://doi.org/10.1115/IMECE2015-53751

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Topics: High temperature, Mechanical behavior, Viscoplasticity, Solders, Temperature, Deformation, Operating temperature, Storage, Electronics, Constitutive equations

Proceedings Papers

High Strain-Rate Constitutive Behavior of SAC305 Solder During Operation at High Temperature

Pradeep Lall, Di Zhang, Vikas Yadav

Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A069, November 14–20, 2014

Paper No: IMECE2014-39518

DOI: https://doi.org/10.1115/IMECE2014-39518

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Topics: High temperature, Solders, Temperature, Deformation, Lead-free solders, Alloys, Chemical properties, Constitutive equations, Electronic components, Electronic packaging

Proceedings Papers

Characterization of Creep Behavior of Actual Lead-Free Solder Joint for Modeling

Hohyung Lee, Ruiyang Liu, Seungbae Park, Jae Kwak

Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A071, November 14–20, 2014

Paper No: IMECE2014-38661

DOI: https://doi.org/10.1115/IMECE2014-38661

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Topics: Creep, Lead-free solders, Modeling, Solders, Displacement, Ball-Grid-Array packaging, Finite element analysis, Electronic packages, Mechanical behavior, Mechanical properties

Proceedings Papers

High Cycle Fatigue Life-Prediction for Lead-Free Interconnects Under Simultaneous High Temperature and Vibration

Pradeep Lall, Geeta Limaye

Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A075, November 15–21, 2013

Paper No: IMECE2013-66820

DOI: https://doi.org/10.1115/IMECE2013-66820

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Topics: High cycle fatigue, High temperature, Vibration, Temperature, Solders, Stress, Alloys, Electronics, Failure, Failure mechanisms

Proceedings Papers

Inverse Derivation of Constants for the Constitutive Equation and Fatigue Model of Pb-Free Solder Joints Based on Experiment Results, Finite Element Simulation and Virtual Optimization Methodology

Weidong Xie, Mudasir Ahmad

Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 1011-1021, November 9–15, 2012

Paper No: IMECE2012-87734

DOI: https://doi.org/10.1115/IMECE2012-87734

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Topics: Fatigue, Finite element analysis, Lead-free solders, Optimization, Simulation, Solders, Ball-Grid-Array packaging, Creep, Fatigue life, Reliability

Proceedings Papers

Cohesive Fracture Mechanics Based Finite Element Analysis to the Performance of Lead Free Solders in BGA Packaging Under Drop Impact

Yao Yao

Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 757-765, November 9–15, 2012

Paper No: IMECE2012-88629

DOI: https://doi.org/10.1115/IMECE2012-88629

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Topics: Ball-Grid-Array packaging, Finite element analysis, Fracture mechanics, Lead-free solders, Solders, Alloys, Packaging, Electronic packaging, Failure, Fracture (Materials)

Proceedings Papers

Evaluation of a Novel Anisotropic Conductive Adhesive Shear Under Multiple Tin-Lead and Lead-Free Reflow Cycles for Package-on-Package (POP) Assembly

Dustin D’Angelo, S. Manian Ramkumar, Luke Wentlent, Peter Borgesen

Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 475-483, November 9–15, 2012

Paper No: IMECE2012-89655

DOI: https://doi.org/10.1115/IMECE2012-89655

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Topics: Adhesives, Anisotropy, Cycles, Manufacturing, Package on package, Shear (Mechanics), Solders, Reliability, Hardening (Curing), Particulate matter

Proceedings Papers

Creep Strain Measurement of an Actual Leadfree Solder Interconnect Using Digital Image Correlation

Hohyung Lee, Seungbae Park

Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 485-490, November 9–15, 2012

Paper No: IMECE2012-89799

DOI: https://doi.org/10.1115/IMECE2012-89799

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Topics: Creep, Lead-free solders, Strain measurement, Solders, Solder joints, Ball-Grid-Array packaging, Displacement, Temperature, Alloys, Ball-Grid-Array packages

Proceedings Papers

Printed Circuit Board Pad Crater Test Methods and Sample Design

Todd Embree, Deassy Novita, Gary Long, Satish Parupalli

Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 989-993, November 9–15, 2012

Paper No: IMECE2012-85562

DOI: https://doi.org/10.1115/IMECE2012-85562

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Topics: Design, Printed circuit boards, Damage, Dimensions, Lead-free solders, Manufacturing, Temperature

Proceedings Papers

Mechanical Behavior of Sn1Ag0.5Cu and Sn3Ag0.5Cu Alloys at High Strain Rates

Pradeep Lall, Sandeep Shantaram, Jeff Suhling, David Locker

Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 491-505, November 9–15, 2012

Paper No: IMECE2012-93059

DOI: https://doi.org/10.1115/IMECE2012-93059

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Topics: Alloys, Mechanical behavior, Shock (Mechanics), Vibration, Electronics, Solders, Failure, Stress, Damage, High temperature

Proceedings Papers

Numerical Analysis to Lead Free Solder/Intermetallic Interconnect With Application of Wiedemann-Franz-Lorenz Relation

Yao Yao, Jared Fry, Morris Fine, Leon Keer

Proc. ASME. IMECE2012, Volume 3: Design, Materials and Manufacturing, Parts A, B, and C, 1275-1284, November 9–15, 2012

Paper No: IMECE2012-88634

DOI: https://doi.org/10.1115/IMECE2012-88634

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Topics: Intermetallic compounds, Lead-free solders, Numerical analysis, Solders, Fracture (Materials), Thermal conductivity, Tin, Electric current, Electrical conductivity, Materials properties

Proceedings Papers

Void Inspection in Lead-Free Solder Bumps on Ball Grid Array (BGA) Packages Using Laser Ultrasound Technique

Jie Gong, I. Charles Ume

Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 941-948, November 11–17, 2011

Paper No: IMECE2011-63147

DOI: https://doi.org/10.1115/IMECE2011-63147

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Topics: Ball-Grid-Array packaging, Inspection, Lasers, Lead-free solders, Ultrasound, Solders, X-rays, Interferometers, Solder joints, Transients (Dynamics)

Proceedings Papers

Unified Creep Plasticity Damage (UCPD) Model for Solder

Michael Neilsen, Paul Vianco

Proc. ASME. IMECE2011, Volume 8: Mechanics of Solids, Structures and Fluids; Vibration, Acoustics and Wave Propagation, 497-504, November 11–17, 2011

Paper No: IMECE2011-65387

DOI: https://doi.org/10.1115/IMECE2011-65387

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Topics: Creep, Damage, Plasticity, Solders, Fracture (Materials), Cycles, Finite element analysis, Fatigue, Solder joints, Computer simulation

Proceedings Papers

Voiding and Thermal Resistance Modeling and Characterization for a QFN Assembly

Harish Gadepalli, Rangaraj Dhanasekaran, S. Manian Ramkumar, Tim Jensen, Ed Briggs

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 487-495, November 12–18, 2010

Paper No: IMECE2010-38391

DOI: https://doi.org/10.1115/IMECE2010-38391

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Topics: Manufacturing, Modeling, Thermal resistance, Solders, Electronic packaging, Energy dissipation, Experimental design, Heat, Lead-free solders, Soldering

Proceedings Papers

Evaluation of a Stacked Package Utilizing LGA Devices

G. Srinivasan, S. Iyer, R. Havens, K. Srihari

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 303-308, November 12–18, 2010

Paper No: IMECE2010-40899

DOI: https://doi.org/10.1115/IMECE2010-40899

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Topics: Ball-Grid-Array packages, Ball-Grid-Array packaging, Cycles, Density, Failure, Failure analysis, Lead-free solders, Manufacturing, Printed circuit boards, Reliability

2 3 4

NARROW

Thermal Mechanical Properties of Two Solder Alloys

Creep Behavior of PB-Free Solders

Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board

Thermal Aging Effect on the Ball Shear Strength of Pb-Free Solders on a Ceramic Substrate With Pd/Ag Surface Metallization

Atomistic Investigation on Mechanical Properties of Sn-Ag-Cu Based Nanocrystalline Solder Material

Anand Viscoplasticity Model for the Effect of Aging on Mechanical Behavior of SAC305 Operating at High Strain Rate and High Temperature

High Strain-Rate Constitutive Behavior of SAC305 Solder During Operation at High Temperature

Characterization of Creep Behavior of Actual Lead-Free Solder Joint for Modeling

High Cycle Fatigue Life-Prediction for Lead-Free Interconnects Under Simultaneous High Temperature and Vibration

Inverse Derivation of Constants for the Constitutive Equation and Fatigue Model of Pb-Free Solder Joints Based on Experiment Results, Finite Element Simulation and Virtual Optimization Methodology

Cohesive Fracture Mechanics Based Finite Element Analysis to the Performance of Lead Free Solders in BGA Packaging Under Drop Impact

Evaluation of a Novel Anisotropic Conductive Adhesive Shear Under Multiple Tin-Lead and Lead-Free Reflow Cycles for Package-on-Package (POP) Assembly

Creep Strain Measurement of an Actual Leadfree Solder Interconnect Using Digital Image Correlation

Printed Circuit Board Pad Crater Test Methods and Sample Design

Mechanical Behavior of Sn1Ag0.5Cu and Sn3Ag0.5Cu Alloys at High Strain Rates

Numerical Analysis to Lead Free Solder/Intermetallic Interconnect With Application of Wiedemann-Franz-Lorenz Relation

Void Inspection in Lead-Free Solder Bumps on Ball Grid Array (BGA) Packages Using Laser Ultrasound Technique

Unified Creep Plasticity Damage (UCPD) Model for Solder

Voiding and Thermal Resistance Modeling and Characterization for a QFN Assembly

Evaluation of a Stacked Package Utilizing LGA Devices

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