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Proceedings Papers

Analysis and Management of Thermal Energy Release During Quench in a Superconducting Magnet

Nusair Hasan, Venkatarao Ganni, Peter Knudsen

Proc. ASME. IMECE2022, Volume 8: Fluids Engineering; Heat Transfer and Thermal Engineering, V008T10A012, October 30–November 3, 2022

Paper No: IMECE2022-95762

DOI: https://doi.org/10.1115/IMECE2022-95762

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Topics: Magnets, Superconducting magnets, Thermal energy, Fluids, Helium, Polishing equipment, Absorption, Boiling, Coolants, Cryogenics

Proceedings Papers

Low Cost Plastic Packaging of the Network Interface Unit

M. A. Zimmerman

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 65-80, November 16–21, 1997

Paper No: IMECE1997-0815

DOI: https://doi.org/10.1115/IMECE1997-0815

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Topics: Packaging, Electronics, Snap fitting, Design, Fire resistance, Gaskets, Heat, Hinges, Injection molded plastics, Low temperature

Proceedings Papers

Molecular Dynamics Simulation of Ice Crystal Growth From a Surface Containing Adsorbed Antifreeze Protein

Svein Grandum, Yasunori Kobayashi, Akira Yabe, Sohei Matsumoto, Fumio Takemura, Kazuya Nakagomi, Per-Erling Frivik

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 191-197, November 16–21, 1997

Paper No: IMECE1997-0957

DOI: https://doi.org/10.1115/IMECE1997-0957

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Topics: Crystal growth, Ice, Molecular dynamics simulation, Proteins, Crystal lattices, Hydrogen bonds, Low temperature, Recrystallization, Scanning tunneling microscopy, Slurries

Proceedings Papers

Microgasketing and Room Temperature Wafer Joining for Liquid-Filled MEMS Devices

Jonathan Simon, Long-Sun Huang, Balaji Sridharan, Chang-Jin Kim

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 29-34, November 16–21, 1997

Paper No: IMECE1997-0935

DOI: https://doi.org/10.1115/IMECE1997-0935

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Topics: Joining, Microelectromechanical systems, Semiconductor wafers, Temperature, Adhesives, Low temperature, Reservoirs, Sealing (Process), Epoxy adhesives, Hardening (Curing)

Proceedings Papers

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

Tien-Yu Tom Lee, Ravi Sharma, André Peyre-Lavigne

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 339-345, November 16–21, 1997

Paper No: IMECE1997-1108

DOI: https://doi.org/10.1115/IMECE1997-1108

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Topics: Carbon monoxide, Computational fluid dynamics, Design, Sensors, Steady state, Transients (Dynamics), Cooling, Cycles, Electrical measurement, Energy consumption

Proceedings Papers

Numerical and Experimental Study on Thermal Performance of Low Temperature Heat Pipe With Two Heaters

Jong Heung Park, Seong Pal Lee

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 231-238, November 16–21, 1997

Paper No: IMECE1997-0962

DOI: https://doi.org/10.1115/IMECE1997-0962

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Topics: Heat pipes, Low temperature, Heat, Computer simulation, Exterior walls, Temperature, Temperature profiles, Copper, Heat conduction, Heat transfer

Proceedings Papers

Getting the Most Out of Geothermal Energy: Economics of Power Generation, Heating, and Cooling

Mehmet Kanoglu, Yunus A. Çengel

Proc. ASME. IMECE97, Advanced Energy Systems, 173-179, November 16–21, 1997

Paper No: IMECE1997-0987

DOI: https://doi.org/10.1115/IMECE1997-0987

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Topics: Geothermal power, Heating and cooling, Power generation economics, Geothermal engineering, Heat, Energy generation, Geothermal power stations, Heating, Cooling, High temperature

Proceedings Papers

Using an Exergy Analysis to Design a Heat Exchanger for Low Temperature Waste Heat Recovery

Fatouh Abdul Aziz Al-Ragom, Michael Daly, Gregory J. Kowalski, Mansour Zenouzi

Proc. ASME. IMECE97, Advanced Energy Systems, 211-218, November 16–21, 1997

Paper No: IMECE1997-0990

DOI: https://doi.org/10.1115/IMECE1997-0990

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Topics: Design, Exergy analysis, Heat exchangers, Heat recovery, Low temperature, Flow (Dynamics), Heat pipes, Computer simulation, Numerical analysis, Pressure

Proceedings Papers

Hat Cycle Exergetic Analysis and Thermoeconomic Evaluation of Fuel Costs

Waldyr L. R. Gallo, Jorge Llagostera, Arnaldo C. S. Walter

Proc. ASME. IMECE97, Advanced Energy Systems, 231-238, November 16–21, 1997

Paper No: IMECE1997-0993

DOI: https://doi.org/10.1115/IMECE1997-0993

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Topics: Cycles, Fuels, Thermoeconomics, Water, Compressors, Pressure, Alloys, Blades, Cooling, Economic analysis

Proceedings Papers

Thermodynamics of Insulated Pressure Vessels for Vehicular Hydrogen Storage

Salvador M. Aceves, Gene D. Berry

Proc. ASME. IMECE97, Advanced Energy Systems, 155-163, November 16–21, 1997

Paper No: IMECE1997-0985

DOI: https://doi.org/10.1115/IMECE1997-0985

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Topics: Hydrogen storage, Pressure vessels, Thermodynamics, Hydrogen, Temperature, Vessels, Automobiles, Fuels, Low temperature, Pressure

Proceedings Papers

Experimental Investigation of the Thermal Plumes in a Thick Layer Cooled From Above

Ralph J. Volino, Geoffrey B. Smith

Proc. ASME. IMECE97, Ocean Engineering, 89-97, November 16–21, 1997

Paper No: IMECE1997-1248

DOI: https://doi.org/10.1115/IMECE1997-1248

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Topics: Plumes (Fluid dynamics), Temperature, Fluids, Water, Convection, Hydrodynamics, Low temperature, Particulate matter, Velocity measurement

Proceedings Papers

Design Optimization of a Composite Splint Material for Strength and Thermoformability

Stephen D. Ainsworth, Robert A. Latour, Jr.

Proc. ASME. IMECE97, Advances in Bioengineering, 269-270, November 16–21, 1997

Paper No: IMECE1997-0332

DOI: https://doi.org/10.1115/IMECE1997-0332

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Topics: Composite materials, Design, Optimization, Fibers, Low temperature, Bending strength, Casting, Elastic moduli, Glass, Musculoskeletal system

Proceedings Papers

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

William T. Chen, David Questad, David Read, Bahgat Sammakia

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 183-192, November 16–21, 1997

Paper No: IMECE1997-0515

DOI: https://doi.org/10.1115/IMECE1997-0515

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Topics: Fracture mechanics, Microelectronic packaging, Packaging, Ball-Grid-Array packaging, Electronic packaging, Design, Electronic packages, Electronic products, Low temperature, Manufacturing

Proceedings Papers

Raman Investigation and Mechanical Behavior of Zirconia

George G. Gogotsi

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 433-440, November 16–21, 1997

Paper No: IMECE1997-0697

DOI: https://doi.org/10.1115/IMECE1997-0697

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Topics: Ceramics, Crystals, Fracture (Materials), Fracture (Process), Fracture toughness, Low temperature, Mechanical behavior, Micromechanical devices, Microprobe analysis, Phase transitions

Proceedings Papers

Ceramic Tape-Based Meso Systems Technology

Haim H. Bau, Suresh G. K. Ananthasuresh, Jorge J. Santiago-Avilés, Jihua Zhong, Moon Kim, Mingqiang Yi, Patricio Espinoza-Vallejos, Luis Sola-Laguna

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 491-498, November 15–20, 1998

Paper No: IMECE1998-1290

DOI: https://doi.org/10.1115/IMECE1998-1290

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Topics: Ceramics, Glass, Manufacturing, Silicon, Binders (Materials), Firing, Flow (Dynamics), Lamination, Low temperature, Microelectromechanical systems

Proceedings Papers

Effects of Surface Patterning in Thin Film Structures on the Thermal Radiative Properties During Rapid Thermal Processing

Haruna Tada, Alexis R. Abramson, Ioannis N. Miaoulis, Peter Y. Wong, Patricia Nieva, Paul Zavracky

Proc. ASME. IMECE98, Heat Transfer: Volume 2 — Combustion and Radiation Heat Transfer, 93-98, November 15–20, 1998

Paper No: IMECE1998-0623

DOI: https://doi.org/10.1115/IMECE1998-0623

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Topics: Rapid thermal processing, Thin films, Semiconductor wafers, Heating, Reflectance, Temperature, Absorption, Computer simulation, Energy gap, High temperature

Proceedings Papers

Molecular Tagging Velocimetry Applied to Buoyancy-Driven Convective Phenomena During Solidification

K. Wirtz, M. Koochesfahani, J. J. McGrath, A. Benard

Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 103-110, November 15–20, 1998

Paper No: IMECE1998-0695

DOI: https://doi.org/10.1115/IMECE1998-0695

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Topics: Buoyancy, Solidification, Plumes (Fluid dynamics), Fluids, Phosphorescence, Alloys, Low temperature, Particulate matter, Shapes, Transparency

Proceedings Papers

Modeling of Fluid Flow and Heat Transfer in a Hydrothermal Crystal Growth System: Use of Fluid-Superposed Porous Layer Theory

Q.-S. Chen, V. Prasad, A. Chatterjee

Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 119-129, November 15–20, 1998

Paper No: IMECE1998-0697

DOI: https://doi.org/10.1115/IMECE1998-0697

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Topics: Crystal growth, Fluid dynamics, Fluids, Heat transfer, Modeling, Flow (Dynamics), Temperature, Crystals, Algorithms, Buoyancy

Proceedings Papers

Filtration of Aircraft Cabin Air Odors in 100% Relative Humidity, Low Temperature Conditions

Samuel L. Penrod, Pete D. Unger, Ronald P. Rohrbach, Daniel E. Bause, Lixin Xue, Russ A. Dondero

Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 139-146, November 15–20, 1998

Paper No: IMECE1998-0646

DOI: https://doi.org/10.1115/IMECE1998-0646

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Topics: Aircraft, Filtration, Low temperature, Activated carbon, Filters, Carbon fibers, Odor control, Pressure, Water

Proceedings Papers

Latent Heat Release in Solute Laden Solutions: Cryobiological Effects

Ramachandra V. Devireddy, John C. Bischof

Proc. ASME. IMECE98, Advances in Heat and Mass Transfer in Biotechnology, 159-161, November 15–20, 1998

Paper No: IMECE1998-0812

DOI: https://doi.org/10.1115/IMECE1998-0812

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Topics: Biomedicine, Food products, Freezing, Heat, Heat of fusion, Latent heat, Low temperature, Membranes, Modeling, Muscle

NARROW

Analysis and Management of Thermal Energy Release During Quench in a Superconducting Magnet

Low Cost Plastic Packaging of the Network Interface Unit

Molecular Dynamics Simulation of Ice Crystal Growth From a Surface Containing Adsorbed Antifreeze Protein

Microgasketing and Room Temperature Wafer Joining for Liquid-Filled MEMS Devices

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

Numerical and Experimental Study on Thermal Performance of Low Temperature Heat Pipe With Two Heaters

Getting the Most Out of Geothermal Energy: Economics of Power Generation, Heating, and Cooling

Using an Exergy Analysis to Design a Heat Exchanger for Low Temperature Waste Heat Recovery

Hat Cycle Exergetic Analysis and Thermoeconomic Evaluation of Fuel Costs

Thermodynamics of Insulated Pressure Vessels for Vehicular Hydrogen Storage

Experimental Investigation of the Thermal Plumes in a Thick Layer Cooled From Above

Design Optimization of a Composite Splint Material for Strength and Thermoformability

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

Raman Investigation and Mechanical Behavior of Zirconia

Ceramic Tape-Based Meso Systems Technology

Effects of Surface Patterning in Thin Film Structures on the Thermal Radiative Properties During Rapid Thermal Processing

Molecular Tagging Velocimetry Applied to Buoyancy-Driven Convective Phenomena During Solidification

Modeling of Fluid Flow and Heat Transfer in a Hydrothermal Crystal Growth System: Use of Fluid-Superposed Porous Layer Theory

Filtration of Aircraft Cabin Air Odors in 100% Relative Humidity, Low Temperature Conditions

Latent Heat Release in Solute Laden Solutions: Cryobiological Effects

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