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Proceedings Papers

Degradation of Poly(L-Lactic Acid) Monofilaments for Experimental Intravascular Stent Designs

Kevin D. Nelson, Anagha R. Phansalkar, Andres A. Romero, Yun-Wei Ye, Robert C. Eberhart, Charles Landau, Robert S. Meidell
Proc. ASME. IMECE97, Advances in Bioengineering, 333-334, November 16–21, 1997
Paper No: IMECE1997-0364
DOI: https://doi.org/10.1115/IMECE1997-0364
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Topics: Stents, Metals, Stress, Biological tissues, Coronary arteries, Corrosion, Damage, Metal fatigue
Proceedings Papers

Life Assessment Based on Numerical Thermodynamic Entropy Estimation: Case Study of Metal Fatigue

Mehrdad Yousefi Faal, Hossein Salimi, Mohammad Pourgol-Mohammad, Rahim Khoshbakhti Saray
Proc. ASME. IMECE2017, Volume 14: Emerging Technologies; Materials: Genetics to Structures; Safety Engineering and Risk Analysis, V014T14A005, November 3–9, 2017
Paper No: IMECE2017-71739
DOI: https://doi.org/10.1115/IMECE2017-71739
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Topics: Entropy, Metal fatigue, Fracture (Materials), Energy dissipation, Simulation, Temperature, Aluminum, Computer simulation, Computer software, Cycles
Proceedings Papers

Molecular Dynamics Study of Metal Fatigue Process

Y. W. Kwon
Proc. ASME. IMECE2004, Pressure Vessels and Piping, 41-45, November 13–19, 2004
Paper No: IMECE2004-59399
DOI: https://doi.org/10.1115/IMECE2004-59399
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Topics: Metal fatigue, Molecular dynamics, Metals, Copper, Damage, Dislocations, Engineering simulation, Fatigue, Fatigue failure, Simulation
Proceedings Papers

Reliability Evaluation of BGA Solder Joints by Using Thermal Fatigue Models

Ouk Sub Lee, No Hoon Myoung, Dong Hyeok Kim
Proc. ASME. IMECE2005, Engineering/Technology Management, 63-69, November 5–11, 2005
Paper No: IMECE2005-80651
DOI: https://doi.org/10.1115/IMECE2005-80651
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Topics: Ball-Grid-Array packaging, Fatigue, Reliability, Solder joints, Failure, Probability, Stress, Circuits, Creep, Damage