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Proceedings Papers

Finite Element Analysis of a Dissimilar Mixed Mode Bimaterial Interfacial Fracture Specimen

Jinmiao Zhang, Gui-Ying Lu, Vernal H. Kenner, Wolé Soboyejo
Proc. ASME. IMECE96, Recent Advances in Solids/Structures and Application of Metallic Materials, 155-165, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0156
https://doi.org/10.1115/IMECE1996-0156
View Paper titled, Finite Element Analysis of a Dissimilar Mixed Mode Bimaterial Interfacial Fracture Specimen
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Topics: Finite element analysis, Fracture (Materials), Computer software, Copper, Finite element model, Fracture mechanics, Molding
Proceedings Papers

Study of the Apparent Viscosity of Fluidized Sand

Sayavur I. Bakhtiyarov, Ruel A. Overfelt, Shashikiran Reddy
Proc. ASME. IMECE96, Rheology and Fluid Mechanics of Nonlinear Materials, 243-249, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0248
https://doi.org/10.1115/IMECE1996-0248
View Paper titled, Study of the Apparent Viscosity of Fluidized Sand
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Topics: Sands, Viscosity, Air flow, Complex systems, Energy dissipation, Entrance region, Flow (Dynamics), Foundry sand, Molding, Particulate matter
Proceedings Papers

Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner

M. Uschitsky, E. Suhir
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 67-100, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0724
https://doi.org/10.1115/IMECE1996-0724
View Paper titled, Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner
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Topics: Corners (Structural elements), Epoxy adhesives, Epoxy resins, Molding, Stress, Delamination, Adhesion, Fracture (Materials), Reliability, Design
Proceedings Papers

Impact of Polymerization on Warpage Prediction of Molded Plastic Packages

Sue Y. Teng, Vijay Sarihan, Ron Thomas, Indira Adhihetty
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 127-131, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0726
https://doi.org/10.1115/IMECE1996-0726
View Paper titled, Impact of Polymerization on Warpage Prediction of Molded Plastic Packages
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Topics: Molded plastics, Polymerization, Warping, Heat sinks, Temperature, Cycles, Design, Energy dissipation, Finite element methods, Finite element model
Proceedings Papers

“Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: How Different Is Their Propensity to Moisture-Induced Failures?

E. Suhir, Q. S. M. Ilyas
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 101-125, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0725
https://doi.org/10.1115/IMECE1996-0725
View Paper titled, “Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: How Different Is Their Propensity to Moisture-Induced Failures?
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Topics: Failure, Membranes, Molding, Stress, Bending (Stress), Electronic packages, Structural analysis
Proceedings Papers

Development of a Tangential Tactor Using a LIGA/MEMS Linear Microactuator Technology

R. Ghodssi, D. J. Beebe, V. White, D. D. Denton
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 379-386, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1378
https://doi.org/10.1115/IMECE1996-1378
View Paper titled, Development of a Tangential Tactor Using a LIGA/MEMS Linear Microactuator Technology
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Topics: Microactuators, Microelectromechanical systems, Skin, Design, Electroplating, Lithography, Manganese (Metal), Microfabrication, Microscale devices, Molding
Proceedings Papers

Viscoelastic Analysis of IC Package Warpage

T. S. Yeung, M. M. F. Yuen
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 101-107, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0896
https://doi.org/10.1115/IMECE1996-0896
View Paper titled, Viscoelastic Analysis of IC Package Warpage
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Topics: Warping, Coordinate measuring machines, Finite element analysis, Mechanical properties, Temperature, Epoxy adhesives, Epoxy resins, Finite element model, Glass transition, Hardening (Curing)
Proceedings Papers

Experimental Investigation of the Robustness of Bulk Metallic Glass-Based Tooling for Microinjection Molding

Ahmed Almalki, Ali Rajhi, Hussam Noor, Animesh Kundu, John Coulter
Proc. ASME. IMECE2022, Volume 2B: Advanced Manufacturing, V02BT02A054, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-94888
https://doi.org/10.1115/IMECE2022-94888
View Paper titled, Experimental Investigation of the Robustness of Bulk Metallic Glass-Based Tooling for Microinjection Molding
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Topics: Coating processes, Coatings, Glass, Molding, Robustness, Tooling, Zirconium
Proceedings Papers

Numerical and Experimental Investigation of Rheodrop Technology

Khalid Alqosaibi, Mohammed Alemmrani, Ahmed Almalki, Alaauldeen Duhduh, John Coulter
Proc. ASME. IMECE2022, Volume 2B: Advanced Manufacturing, V02BT02A042, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-94952
https://doi.org/10.1115/IMECE2022-94952
View Paper titled, Numerical and Experimental Investigation of Rheodrop Technology
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Topics: Computer software, Cycles, Damage, Injection molding, Inventions, Molding, Polymer melts, Polymers, Rheology, Shear rate
Proceedings Papers

Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions

Jianjun Wang, Daqing Zou, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 411-421, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1118
https://doi.org/10.1115/IMECE1997-1118
View Paper titled, Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions
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Topics: Fracture toughness, Fracture (Materials), Temperature, Stress, Displacement, Finite element analysis, Interferometry, Molding, Silicon, Density
Proceedings Papers

Investigation of the Lead-On-Chip Package’s Reliability

P.-H. Tsao, L. C. Chang, T. C. Chen, Chender Haung, C. Z. Chen
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 347-351, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1109
https://doi.org/10.1115/IMECE1997-1109
View Paper titled, Investigation of the Lead-On-Chip Package’s Reliability
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Topics: Reliability, Epoxy adhesives, Epoxy resins, Silicon chips, Crack propagation, Failure mechanisms, Finite element analysis, Fracture (Materials), Manufacturing, Molding
Proceedings Papers

Creep Behavior Study of Plastic Power Package by Real Time Moiré Interferometry and FEM Modeling

Daqing Zou, Jianjun Wang, Minfu Lu, Sheng Liu
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 51-57, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1227
https://doi.org/10.1115/IMECE1997-1227
View Paper titled, Creep Behavior Study of Plastic Power Package by Real Time Moiré Interferometry and FEM Modeling
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Topics: Creep, Finite element methods, Finite element model, Interferometry, Modeling, Epoxy adhesives, Epoxy resins, Molding, Constitutive equations, Deformation
Proceedings Papers

3-D Numerical Simulation of Blow Moulding Technology Involving Sequential Coextrusion

Benoît Debbaut
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 389-398, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0643
https://doi.org/10.1115/IMECE1997-0643
View Paper titled, 3-D Numerical Simulation of Blow Moulding Technology Involving Sequential Coextrusion
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Topics: Computer simulation, Molding, Algorithms, Containers, Deformation, Fluids, Membranes, Simulation, Wall thickness
Proceedings Papers

An Implementation of Concurrent Engineering Concept to Injection Molding

K. K. Wang
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 1-14, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0616
https://doi.org/10.1115/IMECE1997-0616
View Paper titled, An Implementation of Concurrent Engineering Concept to Injection Molding
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Topics: Concurrent engineering, Injection molding, Design, Manufacturing, Molding, Optimization, Process control, Shapes
Proceedings Papers

Numerical Simulation of Injection/Compression Molding

T. James Wang
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 83-96, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0621
https://doi.org/10.1115/IMECE1997-0621
View Paper titled, Numerical Simulation of Injection/Compression Molding
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Topics: Compression molding, Computer simulation, Injection molding, Cavities, Molding, Packing (Shipments), Packings (Cushioning), Pressure, Stress, Compression
Proceedings Papers

Finite Element Prediction of Sink Marks in Injection Molded Plastic Parts

David J. Battey, Mahesh Gupta
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 335-350, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0639
https://doi.org/10.1115/IMECE1997-0639
View Paper titled, Finite Element Prediction of Sink Marks in Injection Molded Plastic Parts
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Topics: Finite element analysis, Injection molded plastics, Computer software, Molding
Proceedings Papers

Sensor/Model Fusion for Improved Process Understanding and Control in Injection Molding

Li-Jen Chien, Charles L. Thomas, Del R. Lawson
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 189-197, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0629
https://doi.org/10.1115/IMECE1997-0629
View Paper titled, Sensor/Model Fusion for Improved Process Understanding and Control in Injection Molding
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Topics: Injection molding, Sensors, Molding, Pressure sensors, Ultrasonic transducers, Cavities, Machinery, Polymers, Signals, Temperature
Proceedings Papers

Modeling Race Tracking Effects in Liquid Composite Molding

Albert W. Chan, Roger J. Morgan
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 361-367, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0641
https://doi.org/10.1115/IMECE1997-0641
View Paper titled, Modeling Race Tracking Effects in Liquid Composite Molding
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Topics: Composite materials, Modeling, Molding, Flow (Dynamics), Preforms, Resins, Clearances (Engineering), Manufacturing, Automotive industry, Cavities
Proceedings Papers

Integrated Simulations of Structural Performance, Molding Process and Warpage for Gas-Assisted Injection Molded Parts

Shia-Chung Chen, Nien-Tien Cheng, Sheng-Yan Hu
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 15-32, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0617
https://doi.org/10.1115/IMECE1997-0617
View Paper titled, Integrated Simulations of Structural Performance, Molding Process and Warpage for Gas-Assisted Injection Molded Parts
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Topics: Engineering simulation, Molding, Simulation, Warping, Geometry, Algorithms, Boundary element methods, Computer-aided engineering, Cooling, Cycles
Proceedings Papers

Smart Processing of Plastics Through Vibration Controlled Shear-Thinning and Orientation

J. P. Ibar
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 223-248, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0632
https://doi.org/10.1115/IMECE1997-0632
View Paper titled, Smart Processing of Plastics Through Vibration Controlled Shear-Thinning and Orientation
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Topics: Plastics, Shear (Mechanics), Vibration, Viscosity, Cooling, Extruding, Injection molding, Molding, Oscillating frequencies, Plastics molding