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Proceedings Papers

Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board

John H. Lau, Stephen H. Pan, Chris Chang
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 79-89, November 5–10, 2000
Paper No: IMECE2000-2249
DOI: https://doi.org/10.1115/IMECE2000-2249
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Topics: Creep, Lead-free solders, Printed circuit boards, Semiconductor wafers, Alloys, Shear (Mechanics), Shear stress, Solder joints, Solders, Constitutive equations
Proceedings Papers

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

John H. Lau, S. W. Ricky Lee, Stephen H. Pan, Chris Chang
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 135-144, November 5–10, 2000
Paper No: IMECE2000-2255
DOI: https://doi.org/10.1115/IMECE2000-2255
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Topics: Flip-chip, Flip-chip devices, Solders, Creep, Solder joints, Cross section (Physics), Design, Printed circuit board assemblies, Printed circuit boards, Reliability
Proceedings Papers

Influence of the Microstructure on the Creep Behaviour of Tin-Silver-Copper Solder

Pedro E. Ribeiro, Delfim F. Soares, Maria F. Cerqueira, Senhorinha F. Teixeira, Daniel A. Barros, José C. Teixeira, Pauline Capela, Francisco Macedo
Proc. ASME. IMECE2018, Volume 12: Materials: Genetics to Structures, V012T11A023, November 9–15, 2018
Paper No: IMECE2018-87789
DOI: https://doi.org/10.1115/IMECE2018-87789
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Topics: Copper, Creep, Silver, Solders, Cooling, Temperature, Solder joints, Stress, Fatigue life, Clamps (Tools)
Proceedings Papers

Evaluation of a Novel Anisotropic Conductive Adhesive Shear Under Multiple Tin-Lead and Lead-Free Reflow Cycles for Package-on-Package (POP) Assembly

Dustin D’Angelo, S. Manian Ramkumar, Luke Wentlent, Peter Borgesen
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 475-483, November 9–15, 2012
Paper No: IMECE2012-89655
DOI: https://doi.org/10.1115/IMECE2012-89655
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Topics: Adhesives, Anisotropy, Cycles, Manufacturing, Package on package, Shear (Mechanics), Solders, Reliability, Hardening (Curing), Particulate matter
Proceedings Papers

Failure Mode Clustering is Electronic Assemblies Using Sammon’s Mapping With Supervised Training of Perceptrons

Pradeep Lall, Prashant Gupta, Kai Goebel
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 911-925, November 11–17, 2011
Paper No: IMECE2011-65833
DOI: https://doi.org/10.1115/IMECE2011-65833
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Topics: Failure mechanisms, Failure, Artificial neural networks, Damage, Fracture (Process), Shock (Mechanics), Solders, Vibration, Cross section (Physics), Errors
Proceedings Papers

Physics of Failure Based Virtual Testing of Communications Hardware

Elviz George, Diganta Das, Michael Osterman, Michael Pecht, Christopher Otte
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 191-197, November 13–19, 2009
Paper No: IMECE2009-12181
DOI: https://doi.org/10.1115/IMECE2009-12181
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Topics: Failure, Hardware, Physics, Testing, Design, Simulation, Computer software, Cycles, Reliability, Vibration
Proceedings Papers

Models for Component Selection and Thermo-Mechanical Reliability Trade-Offs to Address Component Obsolescence in Military Electronics

Pradeep Lall, Aniket Shirgaokar, Jeffrey Suhling
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 245-261, October 31–November 6, 2008
Paper No: IMECE2008-68274
DOI: https://doi.org/10.1115/IMECE2008-68274
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Topics: Electronics, Military systems, Reliability, Thermomechanics, Tradeoffs, Ball-Grid-Array packages, Alloys, Architecture, Regression models, Ceramics
Proceedings Papers

Reducing Material Waste Using Six Sigma in Printed Circuit Board Assembly

Naji E. Gebara, Badih Jawad
Proc. ASME. IMECE2007, Volume 3: Design and Manufacturing, 187-195, November 11–15, 2007
Paper No: IMECE2007-42680
DOI: https://doi.org/10.1115/IMECE2007-42680
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Topics: Printed circuit board assemblies, Manufacturing, Profitability
Proceedings Papers

A Virtual Prototyping Framework for Electronics Manufacturing

J. Cecil, A. Kanchanapiboon
Proc. ASME. IMECE2002, Manufacturing, 23-29, November 17–22, 2002
Paper No: IMECE2002-32398
DOI: https://doi.org/10.1115/IMECE2002-32398
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Topics: Electronics, Manufacturing, Surface mount technology, Testing, Concurrent engineering, Cycles, Engineers, Printed circuit board assemblies, Printed circuit boards, Teams
Proceedings Papers

Strain-Based Flexure Assessment for the Printed Circuit Board Assembly Environment

W. Carter Ralph, Frank W. Joyce
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 147-153, November 5–11, 2005
Paper No: IMECE2005-82565
DOI: https://doi.org/10.1115/IMECE2005-82565
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Topics: Bending (Stress), Printed circuit board assemblies, Reliability