Search Results | IMECE | ASME Digital Collection

1-20 of 150

2 3 4 5

Sort by

Sort Order Select

Proceedings Papers

Assembly Automation Using an Industrial Robot

Timofey Dragun, Seth Mascaro, Jonathan Blanchard, Vedang Chauhan

Proc. ASME. IMECE2022, Volume 2B: Advanced Manufacturing, V02BT02A056, October 30–November 3, 2022

Paper No: IMECE2022-94986

DOI: https://doi.org/10.1115/IMECE2022-94986

View Paper

Topics: Manufacturing, Robotics, Robots, Simulation, Computer software, Additive manufacturing, Mechatronics, Printed circuit boards

Proceedings Papers

Design of Low-Level Hardware for a Multi-Layered Control Architecture

Madeline Kogelis, Zachary J. Fuge, Connor W. Herron, Bhaben Kalita, Alexander Leonessa

Proc. ASME. IMECE2022, Volume 5: Dynamics, Vibration, and Control, V005T07A015, October 30–November 3, 2022

Paper No: IMECE2022-94614

DOI: https://doi.org/10.1115/IMECE2022-94614

View Paper

Topics: Actuators, Design, Hardware, Motors, Sensors, Control equipment, Filters, Robotics, Circuits, Computer software

Proceedings Papers

Low Cost Plastic Packaging of the Network Interface Unit

M. A. Zimmerman

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 65-80, November 16–21, 1997

Paper No: IMECE1997-0815

DOI: https://doi.org/10.1115/IMECE1997-0815

View Paper

Topics: Packaging, Electronics, Snap fitting, Design, Fire resistance, Gaskets, Heat, Hinges, Injection molded plastics, Low temperature

Proceedings Papers

Improving the Snap-Off Process in Solder Paste Stencil Printing via the Enhancement of Wall Slip

Toshinori Mimura, Sheng Liu, Haruhiko Asada

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 219-225, November 16–21, 1997

Paper No: IMECE1997-0821

DOI: https://doi.org/10.1115/IMECE1997-0821

View Paper

Topics: Printing, Solders, Flow (Dynamics), Printed circuit boards, Temperature, Visualization

Proceedings Papers

Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs

D. R. Liu

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 249-259, November 16–21, 1997

Paper No: IMECE1997-0824

DOI: https://doi.org/10.1115/IMECE1997-0824

View Paper

Topics: Creep, Fatigue, Fracture (Materials), Fracture (Process), Solder joints, Temperature, Printed circuit boards, Damage, Melting, Separation (Technology)

Proceedings Papers

Manufacturability of Underfill Processing for Low Cost Flip Chip

Daniel F. Baldwin, Nathan W. Pascarella

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 21-31, November 16–21, 1997

Paper No: IMECE1997-0812

DOI: https://doi.org/10.1115/IMECE1997-0812

View Paper

Topics: Flip-chip, Flip-chip devices, Flow (Dynamics), Compression, Electronics, Manufacturing, Printed circuit boards, Reliability, Semiconductor devices, Surface mount packaging

Proceedings Papers

Guidelines for Preliminary Thermal Design of Convectively Cooled Printed Circuit Boards

Hyunjae Park, Nicholas Nigro, Abdel Elkouh, Neil Gollhardt, Ping Lee

Proc. ASME. IMECE97, Heat Transfer: Volume 1, 315-324, November 16–21, 1997

Paper No: IMECE1997-0857

DOI: https://doi.org/10.1115/IMECE1997-0857

View Paper

Topics: Design, Printed circuit boards, Air flow, Heat, Dimensions, Electronic components, Energy dissipation, Engineers, Temperature, Temperature distribution

Proceedings Papers

Analysis of Mixed Convective Cross Flow Near Protruding Heat Sources on a Vertical Circuit Board

Jagannath Raghavan, Muhammad M. Rahman

Proc. ASME. IMECE97, Heat Transfer: Volume 1, 337-346, November 16–21, 1997

Paper No: IMECE1997-0859

DOI: https://doi.org/10.1115/IMECE1997-0859

View Paper

Topics: Cross-flow, Heat, Printed circuit boards, Computer simulation, Flow (Dynamics), Fluids, Boundary layers, Convection, Forced convection, Heat conduction

Proceedings Papers

Batch Fabrication of Pneumatic Valve Arrays by Combining MEMS With Printed Circuit Board Technology

Patrick Cheung, Andrew A. Berlin, David K. Biegelsen, Warren B. Jackson

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 39-46, November 16–21, 1997

Paper No: IMECE1997-0937

DOI: https://doi.org/10.1115/IMECE1997-0937

View Paper

Topics: Manufacturing, Microelectromechanical systems, Pneumatic valves, Printed circuit boards, Valves, Actuators, Air flow, Air jets, Design, Flow (Dynamics)

Proceedings Papers

Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies

Xiantao Yan, Rakesh K. Agarwal

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 383-390, November 16–21, 1997

Paper No: IMECE1997-1114

DOI: https://doi.org/10.1115/IMECE1997-1114

View Paper

Topics: Flip-chip assemblies, Fracture toughness, Printed circuit boards, Stress, Fracture (Materials), Silicon chips, Solder masks

Proceedings Papers

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Prema Palaniappan, Daniel F. Baldwin

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997

Paper No: IMECE1997-1221

DOI: https://doi.org/10.1115/IMECE1997-1221

View Paper

Topics: Density, Electronics, Flip-chip, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture (Process), Glass transition, Manufacturing, Printed circuit boards

Proceedings Papers

Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications

K. Ramakrishna, J. R. Trent

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 13-21, November 16–21, 1997

Paper No: IMECE1997-1210

DOI: https://doi.org/10.1115/IMECE1997-1210

View Paper

Topics: Automotive industry, Ball-Grid-Array packaging, Temperature, Junctions, Printed circuit boards, Computational fluid dynamics, Thermal conductivity, Heat transfer, Transients (Dynamics), Energy dissipation

Proceedings Papers

Improving Electronic Packaging Manufacturing Through Product and Process-Driven Analysis: A PWB Case Study

Andrew J. Scholand, Russell S. Peak, Robert E. Fulton

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 23-31, November 16–21, 1997

Paper No: IMECE1997-1211

DOI: https://doi.org/10.1115/IMECE1997-1211

View Paper

Topics: Electronic packaging, Manufacturing, Printed circuit boards, Product quality, Warping, Ovens, Economics , Materials properties, Temperature, Thermomechanics

Proceedings Papers

Investigation of Underfill Adhesion in Plastic Flip-Chip Packages

Xiang Dai, Mark V. Brillhart, Paul S. Ho

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 115-124, November 16–21, 1997

Paper No: IMECE1997-0506

DOI: https://doi.org/10.1115/IMECE1997-0506

View Paper

Topics: Adhesion, Flip-chip packages, Delamination, Failure, Flip-chip, Flip-chip assemblies, Fracture mechanics, Junctions, Manufacturing, Polymers

Proceedings Papers

Underfill Selection and its Impact on the Reliability of Flip-Chip Assemblies

Xiantao Yan

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 735-745, November 15–20, 1998

Paper No: IMECE1998-1088

DOI: https://doi.org/10.1115/IMECE1998-1088

View Paper

Topics: Flip-chip assemblies, Reliability, Solders, Fracture toughness, Printed circuit boards, Stress, Cracking (Materials), Experimental methods, Fatigue, Flow (Dynamics)

Proceedings Papers

Comparison of First-Order Shear and Plane Strain Assumptions in Warpage of Simply Supported Printed Wiring Boards

Yarom Polsky, I. Charles Ume

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 789-794, November 15–20, 1998

Paper No: IMECE1998-1093

DOI: https://doi.org/10.1115/IMECE1998-1093

View Paper

Topics: Plane strain, Printed circuit boards, Shear (Mechanics), Warping, Deflection, Temperature, Lamination, Materials properties, Mechanical properties, Modeling

Proceedings Papers

Three-Dimensional Finite Element Modeling of Flip Chip Packages Under Thermal Loading

Qizhou Yao, Jianmin Qu

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 779-787, November 15–20, 1998

Paper No: IMECE1998-1092

DOI: https://doi.org/10.1115/IMECE1998-1092

View Paper

Topics: Finite element analysis, Flip-chip packages, Modeling, Deflection, Flip-chip assemblies, Printed circuit boards, Stress, Design, Multi-chip modules, Size effect

Proceedings Papers

The Effects of Channel Height on Flow Boiling of Liquid Nitrogen

W. Lu, L. C. Chow

Proc. ASME. IMECE98, Advanced Energy Systems, 495-502, November 15–20, 1998

Paper No: IMECE1998-0878

DOI: https://doi.org/10.1115/IMECE1998-0878

View Paper

Topics: Boiling, Flow (Dynamics), Nitrogen, Critical heat flux, Heat transfer, Cooling, Heat, Lumber, Printed circuit boards, Design

Proceedings Papers

Reliability Analysis of Flexible PCBs

Amogh Shejwal, Ashutosh Srivastava, Sandeep Medikonda, S. Babu Aminjikarai

Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T12A054, November 1–5, 2021

Paper No: IMECE2021-71540

DOI: https://doi.org/10.1115/IMECE2021-71540

View Paper

Topics: Cables, Computer simulation, Computer-aided design, Construction, Copper, Event history analysis, Fatigue, Fatigue life, Geometry, Laptop computers

Proceedings Papers

Transport Processes for a Row of Confined Jets Impinging on a Moving Surface

Constantin A. Dinu, Donald E. Beasley

Proc. ASME. IMECE99, Heat Transfer: Volume 3, 273-281, November 14–19, 1999

Paper No: IMECE1999-1084

DOI: https://doi.org/10.1115/IMECE1999-1084

View Paper

Topics: Jets, Transport processes, Flow (Dynamics), Rollers, Printed circuit boards, Computational fluid dynamics, Fluids, Plates (structures), Computer simulation, Engineering simulation

2 3 4 5

NARROW

Assembly Automation Using an Industrial Robot

Design of Low-Level Hardware for a Multi-Layered Control Architecture

Low Cost Plastic Packaging of the Network Interface Unit

Improving the Snap-Off Process in Solder Paste Stencil Printing via the Enhancement of Wall Slip

Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs

Manufacturability of Underfill Processing for Low Cost Flip Chip

Guidelines for Preliminary Thermal Design of Convectively Cooled Printed Circuit Boards

Analysis of Mixed Convective Cross Flow Near Protruding Heat Sources on a Vertical Circuit Board

Batch Fabrication of Pneumatic Valve Arrays by Combining MEMS With Printed Circuit Board Technology

Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications

Improving Electronic Packaging Manufacturing Through Product and Process-Driven Analysis: A PWB Case Study

Investigation of Underfill Adhesion in Plastic Flip-Chip Packages

Underfill Selection and its Impact on the Reliability of Flip-Chip Assemblies

Comparison of First-Order Shear and Plane Strain Assumptions in Warpage of Simply Supported Printed Wiring Boards

Three-Dimensional Finite Element Modeling of Flip Chip Packages Under Thermal Loading

The Effects of Channel Height on Flow Boiling of Liquid Nitrogen

Reliability Analysis of Flexible PCBs

Transport Processes for a Row of Confined Jets Impinging on a Moving Surface

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only