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Proceedings Papers

A Transient Three-Dimensional Model of Micro Heat Pipes Used As an Integral Part of Semiconductor Devices

X. Y. Huang, C. Y. Liu, K. C. Toh
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 37-47, November 17–22, 1996
Paper No: IMECE1996-1334
https://doi.org/10.1115/IMECE1996-1334
View Paper titled, A Transient Three-Dimensional Model of Micro Heat Pipes Used As an Integral Part of Semiconductor Devices
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Topics: Heat pipes, Semiconductor devices, Three-dimensional models, Transients (Dynamics), Heat, Semiconductor wafers, Switches, Temperature, Thermal conductivity
Proceedings Papers

A Domain Specific Language Applied to Phonon Boltzmann Transport for Heat Conduction

Eric Heisler, Siddharth Saurav, Aadesh Deshmukh, Sandip Mazumder, Ponnuswamy Sadayappan, Hari Sundar
Proc. ASME. IMECE2022, Volume 8: Fluids Engineering; Heat Transfer and Thermal Engineering, V008T11A012, October 30–November 3, 2022
Paper No: IMECE2022-95034
https://doi.org/10.1115/IMECE2022-95034
View Paper titled, A Domain Specific Language Applied to Phonon Boltzmann Transport for Heat Conduction
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Topics: Heat conduction, Phonons, Complex systems, Computer software, Heat transfer, Nanoscale phenomena, Numerical analysis, Optimization, Physics, Semiconductor devices
Proceedings Papers

A Study on Reliability of Pb40/Sn60 Solder Joints Under Dynamic Loading

Cemal Basaran, Rumpa Chandaroy
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 227-242, November 16–21, 1997
Paper No: IMECE1997-0822
https://doi.org/10.1115/IMECE1997-0822
View Paper titled, A Study on Reliability of Pb40/Sn60 Solder Joints Under Dynamic Loading
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Topics: Dynamic testing (Materials), Reliability, Solder joints, Dynamic analysis, Failure mechanisms, Solders, Constitutive equations, Cycles, Defense industry, Failure
Proceedings Papers

Manufacturability of Underfill Processing for Low Cost Flip Chip

Daniel F. Baldwin, Nathan W. Pascarella
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 21-31, November 16–21, 1997
Paper No: IMECE1997-0812
https://doi.org/10.1115/IMECE1997-0812
View Paper titled, Manufacturability of Underfill Processing for Low Cost Flip Chip
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Topics: Flip-chip, Flip-chip devices, Flow (Dynamics), Compression, Electronics, Manufacturing, Printed circuit boards, Reliability, Semiconductor devices, Surface mount packaging
Proceedings Papers

Sub-Continuum Simulations of Heat Conduction in Silicon-on-Insulator Transistors

Per G. Sverdrup, Y. Sungtaek Ju, Kenneth E. Goodson
Proc. ASME. IMECE99, Heat Transfer: Volume 3, 41-49, November 14–19, 1999
Paper No: IMECE1999-1061
https://doi.org/10.1115/IMECE1999-1061
View Paper titled, Sub-Continuum Simulations of Heat Conduction in Silicon-on-Insulator Transistors
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Topics: Engineering simulation, Heat conduction, Silicon-on-insulator, Simulation, Transistors, Phonons, Silicon, Temperature, Thermal diffusion, Mean free path
Proceedings Papers

Through-Wafer Electrical Interconnects for MEMS Sensors

Venkataraman Chandrasekaran, Eugene M. Chow, Thomas W. Kenny, Toshikazu Nishida, Mark Sheplak
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 319-324, November 11–16, 2001
Paper No: IMECE2001/MEMS-23846
https://doi.org/10.1115/IMECE2001/MEMS-23846
View Paper titled, Through-Wafer Electrical Interconnects for MEMS Sensors
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Topics: Microelectromechanical systems, Semiconductor wafers, Sensors, Capacitance, Manufacturing, Noise (Sound), Polysilicon, Silicon, Boron, Heat conduction
Proceedings Papers

A Parametric Study of Phonon Energy Transport in Semiconductor Devices

D. Greg Walker, Tim S. Fisher, Jeremy Ralston-Good, Ron D. Schrimpf
Proc. ASME. IMECE2000, Heat Transfer: Volume 2, 373-379, November 5–10, 2000
Paper No: IMECE2000-1449
https://doi.org/10.1115/IMECE2000-1449
View Paper titled, A Parametric Study of Phonon Energy Transport in Semiconductor Devices
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Topics: Phonons, Semiconductor devices, Equilibrium (Physics), Engineering simulation, Gallium arsenide, Microscale devices, Particle physics, Physics, Simulation
Proceedings Papers

Degradation of the Strength of a Grain and a Grain Boundary due to the Accumulation of the Structural Defects of Crystal

Guoxiong Zheng, Yifan Luo, Hideo Miura
Proc. ASME. IMECE2018, Volume 12: Materials: Genetics to Structures, V012T11A004, November 9–15, 2018
Paper No: IMECE2018-87264
https://doi.org/10.1115/IMECE2018-87264
View Paper titled, Degradation of the Strength of a Grain and a Grain Boundary due to the Accumulation of the Structural Defects of Crystal
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Topics: Crystals, Grain boundaries, Fracture (Materials), Fracture (Process), Electron backscatter diffraction, Atoms, Dislocations, Semiconductor devices, Thin films, Bonding
Proceedings Papers

Optimization of Biporous Micropillar Array for Enhanced Heat Transfer Performance

Mengyao Wei, Sivanand Somasundaram, Bin He, Qian Liang, Rishi Raj, Chuan Seng Tan, Evelyn N. Wang
Proc. ASME. IMECE2015, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A002, November 13–19, 2015
Paper No: IMECE2015-52651
https://doi.org/10.1115/IMECE2015-52651
View Paper titled, Optimization of Biporous Micropillar Array for Enhanced Heat Transfer Performance
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Topics: Heat transfer, Optimization, Design, Heat flux, Microchannels, Pressure, Columns (Structural), Drag (Fluid dynamics), Energy conservation, Heat pipes
Proceedings Papers

Prediction of Non-Equilibrium Heat Conduction Using Parallel Computation of the Phonon Boltzmann Transport Equation

Syed A. Ali, Gautham Kollu, Sandip Mazumder, P. Sadayappan
Proc. ASME. IMECE2014, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A039, November 14–20, 2014
Paper No: IMECE2014-36084
https://doi.org/10.1115/IMECE2014-36084
View Paper titled, Prediction of Non-Equilibrium Heat Conduction Using Parallel Computation of the Phonon Boltzmann Transport Equation
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Topics: Computation, Equilibrium (Physics), Heat conduction, Phonons, Silicon, Algorithms, Approximation, Electromagnetic scattering, Engineering simulation, Finite volume methods
Proceedings Papers

Micro-Scale Thermal Sensor Manufacturing for Semiconductor Furnace Chamber

Hongcheon Yang, Jun Young Kim, Kwang-Sun Kim
Proc. ASME. IMECE2012, Volume 5: Education and Globalization; General Topics, 557-563, November 9–15, 2012
Paper No: IMECE2012-87223
https://doi.org/10.1115/IMECE2012-87223
View Paper titled, Micro-Scale Thermal Sensor Manufacturing for Semiconductor Furnace Chamber
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Topics: Furnaces, Manufacturing, Microscale devices, Semiconductors (Materials), Sensors, Semiconductor wafers, Temperature, Thermocouples, Semiconductor devices, Wire
Proceedings Papers

Effect of Deposition Temperature on I-V Characteristics of Vanadium Oxide Film

X. Y. Wei, M. Hu, F. Wang, J. Wei, K. L. Zhang
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 419-422, November 9–15, 2012
Paper No: IMECE2012-87232
https://doi.org/10.1115/IMECE2012-87232
View Paper titled, Effect of Deposition Temperature on I-V Characteristics of Vanadium Oxide Film
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Topics: Temperature, Thin films, Electrical resistivity, Photoelectron spectroscopy, Semiconductor devices, Sputtering (Irradiation), X-rays
Proceedings Papers

Evaluation of Two-Phase Cold Plate for Cooling Electric Vehicle Power Electronics

Peng Wang, Patrick McCluskey, Avram Bar-Cohen
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 823-835, November 11–17, 2011
Paper No: IMECE2011-64330
https://doi.org/10.1115/IMECE2011-64330
View Paper titled, Evaluation of Two-Phase Cold Plate for Cooling Electric Vehicle Power Electronics
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Topics: Cooling, Electric vehicles, Electronics, Temperature, Thermal management, Engines, Flow (Dynamics), Geometry, Heat flux, Motors
Proceedings Papers

Isothermalization of an IGBT Power Electronic Chip

Peng Wang, F. Patrick McCluskey, Avram Bar-Cohen
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 5-15, November 12–18, 2010
Paper No: IMECE2010-41019
https://doi.org/10.1115/IMECE2010-41019
View Paper titled, Isothermalization of an IGBT Power Electronic Chip
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Topics: Cooling, Cooling systems, Design, Electronics, Flux (Metallurgy), Heat, Heat flux, Heat sinks, Hybrid electric vehicles, Microchannels
Proceedings Papers

Heat Transfer Performance of Superhydrophilic Nanostructured Cu Micropost Wicks for Micro Heat Pipes

Youngsuk Nam, Stephen Sharratt, Y. Sungtaek Ju
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 55-60, November 12–18, 2010
Paper No: IMECE2010-40242
https://doi.org/10.1115/IMECE2010-40242
View Paper titled, Heat Transfer Performance of Superhydrophilic Nanostructured Cu Micropost Wicks for Micro Heat Pipes
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Topics: Heat pipes, Heat transfer, Critical heat flux, Heat transfer coefficients, Thermal management, Copper, Density, Design, Electronics, Experimental methods
Proceedings Papers

Considerations on the Numerical Implementation of the Lattice Boltzmann Method for Phonon Transport Modelling

Aydin Nabovati, Daniel P. Sellan, Cristina H. Amon
Proc. ASME. IMECE2010, Volume 10: Micro and Nano Systems, 131-135, November 12–18, 2010
Paper No: IMECE2010-40750
https://doi.org/10.1115/IMECE2010-40750
View Paper titled, Considerations on the Numerical Implementation of the Lattice Boltzmann Method for Phonon Transport Modelling
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Topics: Lattice Boltzmann methods, Modeling, Phonons, Engineering systems and industry applications, Heat transfer, Semiconductor devices
Proceedings Papers

Revisiting Boundary Scattering in Thermal Transport at the Nanometer Scale

Sanjiv Sinha
Proc. ASME. IMECE2009, Volume 13: New Developments in Simulation Methods and Software for Engineering Applications; Safety Engineering, Risk Analysis and Reliability Methods; Transportation Systems, 135-140, November 13–19, 2009
Paper No: IMECE2009-13281
https://doi.org/10.1115/IMECE2009-13281
View Paper titled, Revisiting Boundary Scattering in Thermal Transport at the Nanometer Scale
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Topics: Electromagnetic scattering, Nanoscale phenomena, Radiation scattering, Scattering (Physics), Energy conversion, Modeling, Nanoelectromechanical systems, Nanostructures , Phonons, Semiconductor devices
Proceedings Papers

Test Methodologies for Power Cycling Experiment

K. Sinha, M. Al-Bassyiouni, P. Hansen, A. Dasgupta, P. McCluskey, R. Beaupre, J. Jacobsen
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 35-44, November 13–19, 2009
Paper No: IMECE2009-11074
https://doi.org/10.1115/IMECE2009-11074
View Paper titled, Test Methodologies for Power Cycling Experiment
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Topics: Computer software, Cooling systems, Cycles, Durability, Electronics, Hardware, Heat, Junctions, Semiconductor devices, Stress
Proceedings Papers

Complete Modeling of a Light-Pipe Radiation Thermometer in a Rapid Thermal Processing System

Hakan Erturk, John R. Howell
Proc. ASME. IMECE2008, Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C, 1683-1690, October 31–November 6, 2008
Paper No: IMECE2008-67341
https://doi.org/10.1115/IMECE2008-67341
View Paper titled, Complete Modeling of a Light-Pipe Radiation Thermometer in a Rapid Thermal Processing System
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Topics: Modeling, Pipes, Radiation (Physics), Rapid thermal processing, Thermometers, Errors, Quartz, Signals, Temperature, Manufacturing
Proceedings Papers

Mechanical Strength of Copper-Silicon Interface of Planar Metallization Power Modules

K. Sinha, A. Dasgupta, R. Beaupre, A. Gowda
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 87-93, October 31–November 6, 2008
Paper No: IMECE2008-67367
https://doi.org/10.1115/IMECE2008-67367
View Paper titled, Mechanical Strength of Copper-Silicon Interface of Planar Metallization Power Modules
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Topics: Copper, Silicon, Strength (Materials), Stress, Delamination, Risk, Thermomechanics, Adhesion, Degrees of freedom, Failure mechanisms