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Proceedings Papers

Multichannel Electromechanical Impedance Structural Diagnostics in Plate Specimens

Funmilola Nwokocha, Andrei Zagrai, David Hunter

Proc. ASME. IMECE2022, Volume 5: Dynamics, Vibration, and Control, V005T07A008, October 30–November 3, 2022

Paper No: IMECE2022-95937

DOI: https://doi.org/10.1115/IMECE2022-95937

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Topics: Actuators, Computer software, Damage, Electromagnetic spectrum, Finite element analysis, Modeling, Plates (structures), Safety, Semiconductor wafers, Sensors

Proceedings Papers

Effect of SF 6 and C 4 F 8 Flow Rate on Etched Surface Profile and Grass Formation in Deep Reactive Ion Etching Process

Pallavi Sharma, Matthias Pleil, Nathan Jackson

Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T13A012, October 30–November 3, 2022

Paper No: IMECE2022-92967

DOI: https://doi.org/10.1115/IMECE2022-92967

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Topics: Etching, Flow (Dynamics), Reactive-ion etching, Silicon, Cooling, Cycles, Corners (Structural elements), Energy dissipation, Gas flow, Heat

Proceedings Papers

Transient Temperature Measurements in a Simulated RTCVD Reactor

J. F. Horton, J. E. Peterson

Proc. ASME. IMECE97, Heat Transfer: Volume 3, 217-224, November 16–21, 1997

Paper No: IMECE1997-0912

DOI: https://doi.org/10.1115/IMECE1997-0912

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Topics: Temperature measurement, Transients (Dynamics), Temperature, Buoyancy, Density, Semiconductor wafers, Uncertainty, Chemical vapor deposition, Flow (Dynamics), Flow visualization

Proceedings Papers

Microgasketing and Room Temperature Wafer Joining for Liquid-Filled MEMS Devices

Jonathan Simon, Long-Sun Huang, Balaji Sridharan, Chang-Jin Kim

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 29-34, November 16–21, 1997

Paper No: IMECE1997-0935

DOI: https://doi.org/10.1115/IMECE1997-0935

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Topics: Joining, Microelectromechanical systems, Semiconductor wafers, Temperature, Adhesives, Low temperature, Reservoirs, Sealing (Process), Epoxy adhesives, Hardening (Curing)

Proceedings Papers

Single Actuator and Multi-Mode Acceleration Feedback Control

Maxime P. Bayon de Noyer, Sathya V. Hanagud

Proc. ASME. IMECE97, Adaptive Structures and Material Systems, 227-235, November 16–21, 1997

Paper No: IMECE1997-0196

DOI: https://doi.org/10.1115/IMECE1997-0196

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Topics: Actuators, Feedback, Design, Control equipment, Accelerometers, Piezoelectric ceramics, Semiconductor wafers, Sensors, Simulation, Vibration

Proceedings Papers

Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

Ji Li, Imin Kao, Vish Prasad

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 439-446, November 16–21, 1997

Paper No: IMECE1997-1121

DOI: https://doi.org/10.1115/IMECE1997-1121

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Topics: Modeling, Semiconductor wafers, Stress, Particulate matter, Wire, Cutting, Silicon, Abrasives, Fracture (Materials), Slurries

Proceedings Papers

Wafer Surface Measurements Using Shadow Moiré With Talbot Effect

S. Wu, S. Wei, I. Kao, F. P. Chiang

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 369-376, November 16–21, 1997

Paper No: IMECE1997-1112

DOI: https://doi.org/10.1115/IMECE1997-1112

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Topics: Semiconductor wafers, Shades and shadows

Proceedings Papers

Ultrasonic Time-Frequency Characterization of Silicon Wafers at Elevated Temperatures

C. Steve Suh, G. Andrew Rabroker, Christian P. Burger, Ravinder Chona

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 37-43, November 16–21, 1997

Paper No: IMECE1997-1225

DOI: https://doi.org/10.1115/IMECE1997-1225

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Topics: Semiconductor wafers, Temperature, Waves, Acoustics, Fibers, Interferometers, Mechanical properties, Nondestructive evaluation, Splines, Thermomechanics

Proceedings Papers

Hydrostatic Response of Piezoresistive Stress Sensors

Y. Kang, A. K. M. Mian, J. C. Suhling, R. C. Jaeger

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 29-36, November 16–21, 1997

Paper No: IMECE1997-1224

DOI: https://doi.org/10.1115/IMECE1997-1224

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Topics: Hydrostatics, Sensors, Stress, Hydrostatic testing, Resistors, Calibration, Manufacturing, Pressure, Pressure vessels, Semiconductor wafers

Proceedings Papers

Analytical Feasibility of Laser Induced Stress Wave Thermometry Applied to Silicon Wafers

G. Andrew Rabroker, C. Steve Suh, Christian P. Burger, Ravinder Chona

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 45-50, November 16–21, 1997

Paper No: IMECE1997-1226

DOI: https://doi.org/10.1115/IMECE1997-1226

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Topics: Lasers, Semiconductor wafers, Stress, Temperature measurement, Waves, Temperature, Anisotropy, Dispersion relations, Elastic constants, Rapid thermal processing

Proceedings Papers

Evaluation of Die Stress Using van der Pauw Sensors

A. K. M. Mian, J. C. Suhling, R. C. Jaeger, B. M. Wilamowski

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 59-67, November 16–21, 1997

Paper No: IMECE1997-1228

DOI: https://doi.org/10.1115/IMECE1997-1228

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Topics: Sensors, Stress, Resistors, Silicon, Anisotropy, Electronic packaging, Heat conduction, Semiconductor wafers, Simulation results, Temperature

Proceedings Papers

A High Performance Hand-Held Gas Chromatograph

Conrad M. Yu, Matthew Lucas, Jackson C. Koo, Paul Stratton, Terri DeLima, Elaine Behymer

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 481-486, November 15–20, 1998

Paper No: IMECE1998-1288

DOI: https://doi.org/10.1115/IMECE1998-1288

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Topics: Gas chromatography, Microelectromechanical systems, Sensors, Ejectors, Separation (Technology), Batteries, Bridges (Structures), Computer software, Electrical measurement, Electricity (Physics)

Proceedings Papers

Design and Fabrication of Piezoresistive Cantilever Microaccelerometer Arrays With a Symmetrically Bonded Proof-Mass

Jong Soo Ko, Young-Ho Cho, Byung Man Kwak, Kwanhum Park

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 353-356, November 15–20, 1998

Paper No: IMECE1998-1267

DOI: https://doi.org/10.1115/IMECE1998-1267

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Topics: Cantilevers, Design, Manufacturing, Accelerometers, Microfabrication, Cantilever beams, Mass production, Resonance, Sawing, Semiconductor wafers

Proceedings Papers

Fabrication and Testing of a Multilayer Silicon Fluidic Laminar Proportional Amplifier

Brett H. Piekarski, Robert J. Zeto, Steve M. Tenney, Matthew H. Ervin

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 97-101, November 15–20, 1998

Paper No: IMECE1998-1228

DOI: https://doi.org/10.1115/IMECE1998-1228

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Topics: Manufacturing, Silicon, Testing, Design, Stainless steel, Etching, Flow (Dynamics), Laminates, Milling, Photolithography

Proceedings Papers

Fabrication of 109.5° Micro V-Grooves Using a Two-Step Anisotropic Etching Technique

Wen-Tien Chang Chien, Liwei Lin, Yi-Chung Lo, Chia-Ou Chang

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 361-364, November 15–20, 1998

Paper No: IMECE1998-1269

DOI: https://doi.org/10.1115/IMECE1998-1269

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Topics: Anisotropy, Etching, Manufacturing, Shapes, Design, Microelectromechanical systems, Semiconductor wafers

Proceedings Papers

Design and Strength Evaluation of an Anodically Bonded Pressurized Cavity Array for Wafer-Level MEMS Packaging

Jeung Sang Go, Young-Ho Cho

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 357-360, November 15–20, 1998

Paper No: IMECE1998-1268

DOI: https://doi.org/10.1115/IMECE1998-1268

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Topics: Cavities, Design, MEMS packaging, Semiconductor wafers, Bonding, Plates (structures), Pressure, Design methodology, Failure, Finite element analysis

Proceedings Papers

Silicon-Micromachined Vortex-Controlled Thrusters

Changho Cho, Jongpal Kim, Byung-gwi Choi, Dongjoo Kim, Haecheon Choi, Dong-il Dan Cho

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 125-132, November 15–20, 1998

Paper No: IMECE1998-1232

DOI: https://doi.org/10.1115/IMECE1998-1232

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Topics: Micromachining, Silicon, Vortices, Nozzles, Pressure, Signals, Flow (Dynamics), Fluidic devices, Gates (Closures), Manganese (Metal)

Proceedings Papers

Numerical Simulation of Radiant Thermal Processing of Bilayer Microcantilevers

Haruna Tada, Ioannis N. Miaoulis, Peter Y. Wong

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 37-44, November 15–20, 1998

Paper No: IMECE1998-1221

DOI: https://doi.org/10.1115/IMECE1998-1221

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Topics: Computer simulation, Microcantilevers, Semiconductor wafers, Etching, Temperature gradient, Emissivity, Separation (Technology), Temperature, Thin films, Design

Proceedings Papers

Thin Film Microresonator for Vacuum Sensing

F. Yuan, C. L. Tom, C. H. Mastrangelo, J. Martin, R. Pfenninger

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 241-246, November 15–20, 1998

Paper No: IMECE1998-1248

DOI: https://doi.org/10.1115/IMECE1998-1248

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Topics: Micromechanical resonators, Thin films, Vacuum, Semiconductor wafers, Silicon, Borosilicate glasses, Glass, Manufacturing, Micromachining, Pressure

Proceedings Papers

Self-Assembled Microslider for Microjoinery

L.-S. Huang, B. Sridharan, C.-J. Kim, S. D. Collins, C. González, R. L. Smith

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 499-504, November 15–20, 1998

Paper No: IMECE1998-1291

DOI: https://doi.org/10.1115/IMECE1998-1291

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Topics: Self-assembly, Manufacturing, Semiconductor wafers, Bonding, Etching, Anisotropy, Clearances (Engineering), Friction, Micromachining, Polishing

2 3 4 5

NARROW

Multichannel Electromechanical Impedance Structural Diagnostics in Plate Specimens

Effect of SF 6 and C 4 F 8 Flow Rate on Etched Surface Profile and Grass Formation in Deep Reactive Ion Etching Process

Transient Temperature Measurements in a Simulated RTCVD Reactor

Microgasketing and Room Temperature Wafer Joining for Liquid-Filled MEMS Devices

Single Actuator and Multi-Mode Acceleration Feedback Control

Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

Wafer Surface Measurements Using Shadow Moiré With Talbot Effect

Ultrasonic Time-Frequency Characterization of Silicon Wafers at Elevated Temperatures

Hydrostatic Response of Piezoresistive Stress Sensors

Analytical Feasibility of Laser Induced Stress Wave Thermometry Applied to Silicon Wafers

Evaluation of Die Stress Using van der Pauw Sensors

A High Performance Hand-Held Gas Chromatograph

Design and Fabrication of Piezoresistive Cantilever Microaccelerometer Arrays With a Symmetrically Bonded Proof-Mass

Fabrication and Testing of a Multilayer Silicon Fluidic Laminar Proportional Amplifier

Fabrication of 109.5° Micro V-Grooves Using a Two-Step Anisotropic Etching Technique

Design and Strength Evaluation of an Anodically Bonded Pressurized Cavity Array for Wafer-Level MEMS Packaging

Silicon-Micromachined Vortex-Controlled Thrusters

Numerical Simulation of Radiant Thermal Processing of Bilayer Microcantilevers

Thin Film Microresonator for Vacuum Sensing

Self-Assembled Microslider for Microjoinery

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