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Proceedings Papers

Recycling of Campus Solid Wastes Into a Low-Cost Green Instructional Equipment

Ronald M. Galindo, Jun-Jun A. Obiso, Aian Rey A. Caladcad, Edgar U. Tibay

Proc. ASME. IMECE2022, Volume 7: Engineering Education, V007T09A037, October 30–November 3, 2022

Paper No: IMECE2022-94991

DOI: https://doi.org/10.1115/IMECE2022-94991

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Topics: Green technology, Recycling, Solid wastes, Economics , Engineering teachers, Glass, Stress, Stress analysis (Engineering), Teaching, Wheels

Proceedings Papers

Structural Integrity of Optical Fibers in Connectors

Wilton W. King, Bruce G. LeFevre, A. Guy Hardee

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 261-269, November 16–21, 1997

Paper No: IMECE1997-0825

DOI: https://doi.org/10.1115/IMECE1997-0825

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Topics: Epoxy adhesives, Epoxy resins, Fibers, Finite element analysis, Fracture (Materials), Fracture (Process), Optical fiber, Reliability, Stress analysis (Engineering), Structural analysis

Proceedings Papers

Finite Element Study of the Human Cervical Spine

Srirangam Kumaresan, Narayan Yoganandan, Frank A. Pintar

Proc. ASME. IMECE97, Advances in Bioengineering, 207-208, November 16–21, 1997

Paper No: IMECE1997-0301

DOI: https://doi.org/10.1115/IMECE1997-0301

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Topics: Cervical spine, Finite element analysis, Biomechanics, Lumbar spine, Modeling, Stress analysis (Engineering)

Proceedings Papers

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Prema Palaniappan, Daniel F. Baldwin

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997

Paper No: IMECE1997-1221

DOI: https://doi.org/10.1115/IMECE1997-1221

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Topics: Density, Electronics, Flip-chip, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture (Process), Glass transition, Manufacturing, Printed circuit boards

Proceedings Papers

Stress Analysis of High Density Bare Chip Packaging Technologies

Yutaka Tsukada, Shogo Mizumoto, Yasuyuki Kodama, Hideo Nishimura

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 49-50, November 16–21, 1997

Paper No: IMECE1997-0499

DOI: https://doi.org/10.1115/IMECE1997-0499

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Topics: Density, Packaging, Stress analysis (Engineering), Epoxy adhesives, Epoxy resins, Ceramics, Ball-Grid-Array packages, Ball-Grid-Array packaging, Electronic packaging, Flip-chip

Proceedings Papers

Reliability of Underfill-Encapsulated Flip-Chip Packages

Hiroaki Doi, Kenya Kawano, Akio Yasukawa, Toshihiko Sato

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 7-14, November 16–21, 1997

Paper No: IMECE1997-0494

DOI: https://doi.org/10.1115/IMECE1997-0494

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Topics: Flip-chip packages, Reliability, Flat heat pipes, Solder joints, Delamination, Mechanical properties, Shapes, Stress, Stress analysis (Engineering), Finite element methods

Proceedings Papers

The Effect of Underfill Delamination on the Reliability of Flip Chip Modules

Sven Rzepka, Matt A. Korhonen, Ekkehard Meusel, Che-Yu Li

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 73-83, November 16–21, 1997

Paper No: IMECE1997-0502

DOI: https://doi.org/10.1115/IMECE1997-0502

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Topics: Delamination, Flip-chip, Flip-chip devices, Reliability, Solders, Tension, Failure, Solder joints, Adhesion, Compressive stress

Proceedings Papers

Evaluation of Stress Redistribution and Notch Sensitivity in Ceramic Matrix Composites (CMCs)

Mark C. Roberts, Thomas J. Mackin

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 205-211, November 16–21, 1997

Paper No: IMECE1997-0666

DOI: https://doi.org/10.1115/IMECE1997-0666

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Topics: Ceramic matrix composites, Stress, Damage, Composite materials, Coatings, Ductility, Fibers, Infrared imaging, Shear (Mechanics), Stress analysis (Engineering)

Proceedings Papers

Thermal Residual Stress Analyses of Nextel 440/Aluminum Composite

Hamid Nayeb-Hashemi, Yimin Yang

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 319-330, November 16–21, 1997

Paper No: IMECE1997-0678

DOI: https://doi.org/10.1115/IMECE1997-0678

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Topics: Aluminum, Composite materials, Stress analysis (Engineering), Fibers, Residual stresses, Compressive stress, Geometry, Stress, Tension, Boundary-value problems

Proceedings Papers

Damage Initiation and Progression in Multidirectional Laminates With a Hole

J. R. Schaff, R. Y. Kim

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 261, November 15–20, 1998

Paper No: IMECE1998-1197

DOI: https://doi.org/10.1115/IMECE1998-1197

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Topics: Damage, Laminates, Composite materials, Acoustic emissions, Aerospace industry, Bearings, Databases, Electrical wires, Fasteners, Graphite fibers

Proceedings Papers

A Three-Dimensional Stress Analysis of Woven Fabric Composites Based on a Mixed Variational Model and Spline Approximation

A. K. Roy

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 219-221, November 15–20, 1998

Paper No: IMECE1998-1180

DOI: https://doi.org/10.1115/IMECE1998-1180

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Topics: Approximation, Composite materials, Splines, Stress analysis (Engineering), Textiles, Yarns, Stress, Finite element analysis, Damage, Displacement

Proceedings Papers

Non-Invasive Estimation of Wall Stress Distribution in Abdominal Aortic Aneurysm

Madhavan Lakshmi Raghavan, Michel P. Federle, Marshall W. Webster, David Alan Vorp

Proc. ASME. IMECE98, Advances in Bioengineering, 413-414, November 15–20, 1998

Paper No: IMECE1998-0200

DOI: https://doi.org/10.1115/IMECE1998-0200

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Topics: Aneurysms, Stress concentration, Rupture, Risk, Stress, Surgery, Diseases, Failure, Stress analysis (Engineering)

Proceedings Papers

Stress Analysis of Soft Tissues as Nonhomogeneous Composites: Application to Disc Anulus, Knee Meniscus, and Articular Cartilage

A. Shirazi-Adl, M. D. Buschmann

Proc. ASME. IMECE98, Advances in Bioengineering, 235-236, November 15–20, 1998

Paper No: IMECE1998-0117

DOI: https://doi.org/10.1115/IMECE1998-0117

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Topics: Cartilage, Composite materials, Disks, Knee, Soft tissues, Stress analysis (Engineering), Biological tissues, Fibers, Compression, Stress

Proceedings Papers

Elasto-Plastic Finite Element Analysis of Indentations in Free Abrasive Machining

Milind Bhagavat, Fuqian Yang, Imin Kao

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 819-824, November 15–20, 1998

Paper No: IMECE1998-1097

DOI: https://doi.org/10.1115/IMECE1998-1097

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Topics: Abrasive machining, Finite element analysis, Abrasives, Finite element methods, Fracture (Process), Sawing, Semiconductor wafers, Shapes, Slurries, Stress analysis (Engineering)

Proceedings Papers

Stress Analysis of Bolted Circular Flanged Joints With Tap Bolts

Takashi Kobayashi, Tsuneshi Morohoshi, Toshiyuki Sawa

Proc. ASME. IMECE98, Reliability, Stress Analysis, and Failure Prevention Aspects of Adhesive and Bolted Joints, Rubber Components, Composite Springs, 113-123, November 15–20, 1998

Paper No: IMECE1998-1122

DOI: https://doi.org/10.1115/IMECE1998-1122

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Topics: Contact mechanics, Elasticity, Screw threads, Stress, Stress analysis (Engineering), Stress concentration

Proceedings Papers

Stress Analysis of Bolted Joints With Plain Washers

Toshiyuki Sawa, Hajime Yasui

Proc. ASME. IMECE98, Reliability, Stress Analysis, and Failure Prevention Aspects of Adhesive and Bolted Joints, Rubber Components, Composite Springs, 125-130, November 15–20, 1998

Paper No: IMECE1998-1123

DOI: https://doi.org/10.1115/IMECE1998-1123

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Topics: Bolted joints, Stress analysis (Engineering), Stress, Bearings, Cylinders, Design, Contact mechanics, Elasticity, Mechanical behavior, Stiffness

Proceedings Papers

Elastoplastic FEM Stress Analysis and Strength Evaluation of Adhesive Tapered Lap Joints of Hollow Shafts Subjected to Tensile Loads

Masataka Kawawaki, Yuichi Nakano, Toshiyuki Sawa

Proc. ASME. IMECE98, Reliability, Stress Analysis, and Failure Prevention Aspects of Adhesive and Bolted Joints, Rubber Components, Composite Springs, 77-84, November 15–20, 1998

Paper No: IMECE1998-1119

DOI: https://doi.org/10.1115/IMECE1998-1119

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Topics: Adhesives, Finite element methods, Stress, Stress analysis (Engineering), Tensile strength

Proceedings Papers

Stress Analysis and Strength of Bonded Shrink Fitted Joint of Hollow Shafts Subjected to Torsional Load (The Effect of Bonded Shrink Fitted Position)

Masahiro Yoneno, Toshiyuki Sawa, Takeshi Nakamura

Proc. ASME. IMECE98, Reliability, Stress Analysis, and Failure Prevention Aspects of Adhesive and Bolted Joints, Rubber Components, Composite Springs, 57-65, November 15–20, 1998

Paper No: IMECE1998-1117

DOI: https://doi.org/10.1115/IMECE1998-1117

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Topics: Stress, Stress analysis (Engineering), Adhesives, Elasticity, Rupture, Stiffness

Proceedings Papers

Non-Linear Finite Element Analysis Support Testing for Gaskets and Seals

Abraham Pannikottu, Joseph A. Seiler, Jerry J. Leyden

Proc. ASME. IMECE98, Reliability, Stress Analysis, and Failure Prevention Aspects of Adhesive and Bolted Joints, Rubber Components, Composite Springs, 1-8, November 15–20, 1998

Paper No: IMECE1998-1112

DOI: https://doi.org/10.1115/IMECE1998-1112

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Topics: Finite element analysis, Gaskets, Testing, Design, Elastomers, Computer-aided engineering, Computers, Engineers, Aerospace industry, Computer simulation

Proceedings Papers

Stress Analysis and Strength Evaluation of Single-Lap Band Adhesive Joints Subjected to External Bending Moments

Jiemin Liu, Toshiyuki Sawa

Proc. ASME. IMECE98, Reliability, Stress Analysis, and Failure Prevention Aspects of Adhesive and Bolted Joints, Rubber Components, Composite Springs, 67-75, November 15–20, 1998

Paper No: IMECE1998-1118

DOI: https://doi.org/10.1115/IMECE1998-1118

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Topics: Adhesive joints, Bonding, Contact mechanics, Elasticity, Stress analysis (Engineering)

2 3 4 5

NARROW

Recycling of Campus Solid Wastes Into a Low-Cost Green Instructional Equipment

Structural Integrity of Optical Fibers in Connectors

Finite Element Study of the Human Cervical Spine

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Stress Analysis of High Density Bare Chip Packaging Technologies

Reliability of Underfill-Encapsulated Flip-Chip Packages

The Effect of Underfill Delamination on the Reliability of Flip Chip Modules

Evaluation of Stress Redistribution and Notch Sensitivity in Ceramic Matrix Composites (CMCs)

Thermal Residual Stress Analyses of Nextel 440/Aluminum Composite

Damage Initiation and Progression in Multidirectional Laminates With a Hole

A Three-Dimensional Stress Analysis of Woven Fabric Composites Based on a Mixed Variational Model and Spline Approximation

Non-Invasive Estimation of Wall Stress Distribution in Abdominal Aortic Aneurysm

Stress Analysis of Soft Tissues as Nonhomogeneous Composites: Application to Disc Anulus, Knee Meniscus, and Articular Cartilage

Elasto-Plastic Finite Element Analysis of Indentations in Free Abrasive Machining

Stress Analysis of Bolted Circular Flanged Joints With Tap Bolts

Stress Analysis of Bolted Joints With Plain Washers

Elastoplastic FEM Stress Analysis and Strength Evaluation of Adhesive Tapered Lap Joints of Hollow Shafts Subjected to Tensile Loads

Stress Analysis and Strength of Bonded Shrink Fitted Joint of Hollow Shafts Subjected to Torsional Load (The Effect of Bonded Shrink Fitted Position)

Non-Linear Finite Element Analysis Support Testing for Gaskets and Seals

Stress Analysis and Strength Evaluation of Single-Lap Band Adhesive Joints Subjected to External Bending Moments

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