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Proceedings Papers

Investigating the Effects of Solvents and Nanocomposites on Tailoring the Elastic Modulus of Piezoelectric Thin Film PVDF-TrFE

Deepak Kunwar, Md Mehadi Hassan, Nathan Jackson
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T13A001, October 30–November 3, 2022
Paper No: IMECE2022-95576
DOI: https://doi.org/10.1115/IMECE2022-95576
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Topics: Elastic moduli, Nanocomposites, Thin films
Proceedings Papers

Stochastic Analysis of the Carbon Nanotube Network Interphase in Dry and Pre-Infused Buckypaper

Masoud Yekani Fard, Samuel Perrino, Conor Hedman
Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A044, October 30–November 3, 2022
Paper No: IMECE2022-95523
DOI: https://doi.org/10.1115/IMECE2022-95523
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Topics: Carbon nanotubes, Polymers, Deformation, Nanoscale phenomena, Atomic force microscopy, Deflection, Fundamental forces (Physics), Materials properties, Microscopy, Nanocomposites
Proceedings Papers

Experimental Study of the Nano-Fin Effect (nFE) During Thin Film Evaporation From Nanopores in Anodic Aluminum Oxide (AAO) Membrane Substrates Integrated With Nano-Thermocouple / Thin Film Thermocouple (TFT) Array

Julie Shafer, Jonghyun Lee, Ashok Thyagarajan, Debjyoti Banerjee
Proc. ASME. IMECE2022, Volume 8: Fluids Engineering; Heat Transfer and Thermal Engineering, V008T11A017, October 30–November 3, 2022
Paper No: IMECE2022-96168
DOI: https://doi.org/10.1115/IMECE2022-96168
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Topics: Aluminum, Evaporation, Membranes, Nanopores, Thermocouples, Thin film transistors, Thin films
Proceedings Papers

Matrix Pattern Micromarkers for Tracking Local Contractile Movements of Myotubes Cultured on Thin-Film Scaffold

Shigehiro Hashimoto, Shusei Sakai
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T13A010, October 30–November 3, 2022
Paper No: IMECE2022-94760
DOI: https://doi.org/10.1115/IMECE2022-94760
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Topics: Photolithography, Thin films, Biomedical engineering, Electrodes, Optical microscopes, Titanium, Wire
Proceedings Papers

Flexible Energy Harvesters for Harsh Environments: A Review

Andrew Haskell, Seyed Soltani
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T13A015, October 30–November 3, 2022
Paper No: IMECE2022-95437
DOI: https://doi.org/10.1115/IMECE2022-95437
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Topics: Energy harvesting, Fatigue, Finite element analysis, Fracture (Materials), Microelectromechanical systems, Thin films
Proceedings Papers

Wearable and Stretchable Piezoelectric Energy Harvesting Device Based on Thin Film of ZnO

Ioana Voiculescu, Shuo Fang, Fang Li
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T13A003, October 30–November 3, 2022
Paper No: IMECE2022-94353
DOI: https://doi.org/10.1115/IMECE2022-94353
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Topics: Energy harvesting, Generators, Thin films, Wearable sensors
Proceedings Papers

Scanning Laser Thermoelectric Microscope for Thin Film Thermophysical Property Measurement

Theodorian Borca Tasciuc, Gang Chen
Proc. ASME. IMECE97, Heat Transfer: Volume 1, 297-303, November 16–21, 1997
Paper No: IMECE1997-0855
DOI: https://doi.org/10.1115/IMECE1997-0855
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Topics: Lasers, Microscopes, Thin films, Laser beams, Thermal diffusivity, Thermocouples, Waves, Bulk solids, Fittings, Glass
Proceedings Papers

Experimental Investigation of Heat Transfer and Pressure Drop Through Deep Microchannels in a (110) Silicon Substrate

Todd M. Harms, Michael Kazmierczak, Frank M. Gerner, A. Hölke, H. T. Henderson, J. Pilchowski, Karl Baker
Proc. ASME. IMECE97, Heat Transfer: Volume 1, 347-357, November 16–21, 1997
Paper No: IMECE1997-0860
DOI: https://doi.org/10.1115/IMECE1997-0860
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Topics: Heat transfer, Microchannels, Pressure drop, Silicon, Flow (Dynamics), Theoretical analysis, Chemical etching, Fluids, Forced convection, Reynolds number
Proceedings Papers

On the Thermal Runaway in Solid Foams

Igor Goldfarb, Vladimir Goldshtein, Grigory Kuzmenko
Proc. ASME. IMECE97, Heat Transfer: Volume 2, 169-177, November 16–21, 1997
Paper No: IMECE1997-0879
DOI: https://doi.org/10.1115/IMECE1997-0879
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Topics: Delays, Dynamics (Mechanics), Explosions, Fire, Fluids, Foams (Chemistry), Insulation, Manifolds, System dynamics, Thin films
Proceedings Papers

Acoustic-Wave Liquid Mixer

Xu Zhu, Eun Sok Kim
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 35-38, November 16–21, 1997
Paper No: IMECE1997-0936
DOI: https://doi.org/10.1115/IMECE1997-0936
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Topics: Acoustics, Waves, Temperature, Convection, Flow (Dynamics), Fluids, Resonance, Thin films
Proceedings Papers

Thin Film Resistance Heaters for High Heat Flux Jet-Array Cooling Experiments

Hesham F. Younis, Rudy S. Dahbura, John H. Lienhard, V
Proc. ASME. IMECE97, Heat Transfer: Volume 3, 127-134, November 16–21, 1997
Paper No: IMECE1997-0901
DOI: https://doi.org/10.1115/IMECE1997-0901
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Topics: Cooling, Heat flux, Thin films, Flux (Metallurgy), Heat, Ceramics, Metals, Plasmas (Ionized gases), Bulk solids, Design
Proceedings Papers

Periodic Heat Flux-Temperature Phase Difference for Thin Metal Films

Kathy J. Hays-Stang, A. Haji-Sheikh
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 205-212, November 16–21, 1997
Paper No: IMECE1997-0959
DOI: https://doi.org/10.1115/IMECE1997-0959
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Topics: Heat, Metals, Temperature, Electrons, Heat transfer, Phonons, Thin films, Heat capacity, Heat flux, Microscale heat transfer
Proceedings Papers

Characterization of Thin-Film Impact Microactuators

Roger L. Hipwell, Richard S. Muller, Albert P. Pisano
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 87-91, November 16–21, 1997
Paper No: IMECE1997-0944
DOI: https://doi.org/10.1115/IMECE1997-0944
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Topics: Microactuators, Thin films, Actuators, Design, Displacement, Impulse (Physics), Micromachining, Microscale devices, Momentum
Proceedings Papers

Strength and Fracture of Micromachined Silicon Structures

Wan Suwito, Martin L. Dunn, Shawn J. Cunningham
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 99-104, November 16–21, 1997
Paper No: IMECE1997-0946
DOI: https://doi.org/10.1115/IMECE1997-0946
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Topics: Fracture (Materials), Fracture (Process), Micromachining, Silicon, Corners (Structural elements), Design, Anisotropy, Chemical etching, Crystals, Manufacturing
Proceedings Papers

Mechanisms of Heat Transfer Enhancement in a Turbulent Boundary Layer Downstream of a Cylinder-Wall Junction

Donald E. Wroblewski, Qi Xie
Proc. ASME. IMECE97, Heat Transfer: Volume 3, 21-28, November 16–21, 1997
Paper No: IMECE1997-0890
DOI: https://doi.org/10.1115/IMECE1997-0890
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Topics: Boundary layer turbulence, Cylinders, Heat transfer, Junctions, Heat transfer coefficients, Sensors, Boundary layers, Eddies (Fluid dynamics), Flow (Dynamics), Fluids
Proceedings Papers

Impact of Phonon Dispersion Upon the Size Effect on Thermal Conduction Along Thin Semiconductor Films

Y. Sungtaek Ju, Kenneth E. Goodson
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 181-190, November 16–21, 1997
Paper No: IMECE1997-0956
DOI: https://doi.org/10.1115/IMECE1997-0956
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Topics: Heat conduction, Phonons, Semiconductor films, Size effect, Thermal conductivity, Semiconductors (Materials), Silicon, Electromagnetic scattering, Radiation scattering, Scattering (Physics)
Proceedings Papers

Genetic Algorithm Simulation for Deposited Structure of Atoms

Koji Miyazaki, Kunio Hijikata, Takayoshi Inoue
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 199-204, November 16–21, 1997
Paper No: IMECE1997-0958
DOI: https://doi.org/10.1115/IMECE1997-0958
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Topics: Atoms, Genetic algorithms, Simulation, Molecular dynamics simulation, Potential energy, Temperature, Temperature effects, Thin films
Proceedings Papers

Thermophotovoltaic Energy Conversion Technology Development at NASA Lewis Research Center

David M. Wilt, Donald L. Chubb
Proc. ASME. IMECE97, Advanced Energy Systems, 47-52, November 16–21, 1997
Paper No: IMECE1997-0972
DOI: https://doi.org/10.1115/IMECE1997-0972
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Topics: Energy conversion, NASA, Technology development, Emissions, Design, Photovoltaic cells, Power density, Silicon, Temperature, Aluminum
Proceedings Papers

Advances in Tensile Testing of Polysilicon Thin Films

William N. Sharpe, Jr., Bin Yuan, Richard L. Edwards
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 113-116, November 16–21, 1997
Paper No: IMECE1997-1235
DOI: https://doi.org/10.1115/IMECE1997-1235
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Topics: Polysilicon, Tensile testing, Thin films, Testing, ASTM International, Mechanical properties, Displacement, Fracture (Materials), Fracture toughness, Mechanical testing
Proceedings Papers

Theoretical and Experimental Considerations of Electrorheology With DC and AC Fields

C. W. Wu, H. Conrad
Proc. ASME. IMECE97, Rheology and Fluid Mechanics of Nonlinear Materials, 185-196, November 16–21, 1997
Paper No: IMECE1997-0486
DOI: https://doi.org/10.1115/IMECE1997-0486
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Topics: Electrorheological fluids, Particulate matter, Current density, Design, Electrical conductivity, Fluids, Shear (Mechanics), Thermal conductivity, Thin films, Yield strength