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Proceedings Papers

Interfacial Delamination Propagation in Multi-Layered High-Density Wiring Electronic Packaging Structures

Hurang Hu, Weidong Xie, Suresh Sitaraman

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 103-111, November 5–10, 2000

Paper No: IMECE2000-2251

DOI: https://doi.org/10.1115/IMECE2000-2251

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Topics: Delamination, Density, Electrical wires, Electronic packaging, Copper, Materials properties, Temperature, Thermoelasticity, Design, Dielectric materials

Proceedings Papers

Nonuniform Temperature Distribution in Electronic Devices Cooled by Flow in Parallel Microchannels

G. Hetsroni, A. Mosyak, Z. Segal

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 1-9, November 5–10, 2000

Paper No: IMECE2000-2241

DOI: https://doi.org/10.1115/IMECE2000-2241

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Topics: Flow (Dynamics), Microchannels, Temperature distribution

Proceedings Papers

Durability Properties Characterization of Sn62Pb36Ag2 Solder Alloy

Peter Haswell, Abhijit Dasgupta

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 181-187, November 5–10, 2000

Paper No: IMECE2000-2261

DOI: https://doi.org/10.1115/IMECE2000-2261

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Topics: Alloys, Durability, Solders, Damage, Failure, Cycles, Displacement, Shear (Mechanics), Temperature, Tin

Proceedings Papers

Experimentally Validated Vibration Fatigue Life Prediction Model for Ball Grid Array Solder Joint

T. E. Wong, F. W. Palmieri, L. A. Kachatorian

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 113-119, November 5–10, 2000

Paper No: IMECE2000-2252

DOI: https://doi.org/10.1115/IMECE2000-2252

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Topics: Ball-Grid-Array packaging, Fatigue life, Solder joints, Vibration, Random vibration, Solders, Ball-Grid-Array packages, Ceramics, Computation, Computers

Proceedings Papers

Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board

John H. Lau, Stephen H. Pan, Chris Chang

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 79-89, November 5–10, 2000

Paper No: IMECE2000-2249

DOI: https://doi.org/10.1115/IMECE2000-2249

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Topics: Creep, Lead-free solders, Printed circuit boards, Semiconductor wafers, Alloys, Shear (Mechanics), Shear stress, Solder joints, Solders, Constitutive equations

Proceedings Papers

Application of a Novel Flip Chip Solder Joint Inspection System to Chips on an FR-4 Substrate

Dathan S. Erdahl, Sheng Liu, I. Charles Ume

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 189-195, November 5–10, 2000

Paper No: IMECE2000-2262

DOI: https://doi.org/10.1115/IMECE2000-2262

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Topics: Flip-chip devices, Inspection, Solder joints, Solders, Vibration, Ball-Grid-Array packaging, Lasers, Ultrasound, Displacement, Interferometers

Proceedings Papers

Thermomechanical Durability of High I/O BGA Packages

Pavan Davuluri, Abhijit Dasgupta, Steven Young

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 121-127, November 5–10, 2000

Paper No: IMECE2000-2253

DOI: https://doi.org/10.1115/IMECE2000-2253

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Topics: Ball-Grid-Array packages, Durability, Thermomechanics, Ball-Grid-Array packaging, Solder joints, Failure, Solders, Cycles, Damage, Failure data

Proceedings Papers

Wafer Level Underfill Processing

Luu Nguyen, Christopher Quentin, Phuong Nguyen

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 63-68, November 5–10, 2000

Paper No: IMECE2000-2247

DOI: https://doi.org/10.1115/IMECE2000-2247

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Topics: Semiconductor wafers, Flip-chip, Flip-chip devices, Manufacturing, Adhesives, Cycles, Film thickness, Flip-chip packages, Flow (Dynamics), Industrial research

Proceedings Papers

Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface

Timothy P. Ferguson, Jianmin Qu

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 129-133, November 5–10, 2000

Paper No: IMECE2000-2254

DOI: https://doi.org/10.1115/IMECE2000-2254

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Topics: Adhesion, Solder masks, Fracture toughness, Corrosion, Failure mechanisms, Flow (Dynamics), Fracture (Materials), Microelectronic packaging, Packaging, Polymers

Proceedings Papers

Stress Concentration in a Connectorized Optical Fiber

John F. Malluck, Wilton W. King

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 11-24, November 5–10, 2000

Paper No: IMECE2000-2242

DOI: https://doi.org/10.1115/IMECE2000-2242

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Topics: Optical fiber, Stress concentration, Fibers, Epoxy adhesives, Epoxy resins, Stress, Fracture (Materials), Fracture (Process), Cavities, Ceramics

Proceedings Papers

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

John H. Lau, S. W. Ricky Lee, Stephen H. Pan, Chris Chang

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 135-144, November 5–10, 2000

Paper No: IMECE2000-2255

DOI: https://doi.org/10.1115/IMECE2000-2255

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Topics: Flip-chip, Flip-chip devices, Solders, Creep, Solder joints, Cross section (Physics), Design, Printed circuit board assemblies, Printed circuit boards, Reliability

Proceedings Papers

A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints

John H. Lau, Stephen H. Pan, Chris Chang

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 91-101, November 5–10, 2000

Paper No: IMECE2000-2250

DOI: https://doi.org/10.1115/IMECE2000-2250

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Topics: Fatigue, Semiconductor wafers, Solder joints, Fracture (Materials), Corners (Structural elements), Creep, Cycles, Density, Finite element methods, Fracture mechanics

Proceedings Papers

Effect of Moisture on Durability of Flip-Chip-on-Board (FCOB) Interconnects

J. H. Okura, A. Dasgupta, J. F. J. M. Caers

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 145-151, November 5–10, 2000

Paper No: IMECE2000-2256

DOI: https://doi.org/10.1115/IMECE2000-2256

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Topics: Durability, Failure mechanisms, Absorption, Cracking (Materials), Diffusion (Physics), Engineering simulation, Finite element analysis, Fracture (Process), Intermetallic compounds, Life testing

Proceedings Papers

Nonlinear Thermal and Mechanical Analysis in the Vibration of a Printed Wiring Board

Xiaoling He, Robert Fulton

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 25-34, November 5–10, 2000

Paper No: IMECE2000-2243

DOI: https://doi.org/10.1115/IMECE2000-2243

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Topics: Printed circuit boards, Vibration, Stress, Laminates, Temperature, Deflection, Dynamic analysis, Equations of motion, Failure, Modal analysis

Proceedings Papers

Interfacial Versus Cohesive Failure on Underfill-Aluminum Interface: Effects of Interface Roughness

Qizhou Yao, Jianmin Qu

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 153-160, November 5–10, 2000

Paper No: IMECE2000-2257

DOI: https://doi.org/10.1115/IMECE2000-2257

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Topics: Aluminum, Failure, Interface roughness, Polymers, Adhesion, Metals, Fracture mechanics, Surface roughness, Epoxy adhesives, Epoxy resins

Proceedings Papers

Key Parameters Affecting Solder Joint Life of Chip Resistors and Chip Capacitors Mounted on Insulated Metal Substrate

Nicoletta Sangalli, Donald B. Barker

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 35-41, November 5–10, 2000

Paper No: IMECE2000-2244

DOI: https://doi.org/10.1115/IMECE2000-2244

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Topics: Capacitors, Metals, Resistors, Solder joints, Finite element analysis, Aluminum, Ceramics, Energy dissipation, Heat, Temperature

Proceedings Papers

Parametric Design and Reliability Analysis of WIT Wafer Level Packaging

Y. T. Lin, P. J. Tang, K. N. Chiang

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 69-78, November 5–10, 2000

Paper No: IMECE2000-2248

DOI: https://doi.org/10.1115/IMECE2000-2248

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Topics: Event history analysis, Packaging, Parametric design, Semiconductor wafers, Density, Reliability, Solders, Copper, Electronic packages, Finite element methods

Proceedings Papers

Thermal Aging Effect on the Ball Shear Strength of Pb-Free Solders on a Ceramic Substrate With Pd/Ag Surface Metallization

Xing Jia Huang, Shi-Wei Ricky Lee, Wan Sze Tse

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 167-171, November 5–10, 2000

Paper No: IMECE2000-2259

DOI: https://doi.org/10.1115/IMECE2000-2259

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Topics: Ceramics, Lead-free solders, Shear strength

Proceedings Papers

Thermal Cycling Guidelines for Automotive, Computer, Portable, and Implantable Medical Device Applications

Rajiv Raghunathan, Raghuram V. Pucha, Suresh K. Sitaraman

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 51-62, November 5–10, 2000

Paper No: IMECE2000-2246

DOI: https://doi.org/10.1115/IMECE2000-2246

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Topics: Computers, Medical devices, Flip-chip, Manufacturing, Automotive industry, Cycles, Damage, Density, Fatigue damage, Solders

Proceedings Papers

Micro-Mechanics of Creep-Fatigue Damage in Pb-Sn Solder Due to Thermal Cycling

Pradeep Sharma, Abhijit Dasgupta

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 173-179, November 5–10, 2000

Paper No: IMECE2000-2260

DOI: https://doi.org/10.1115/IMECE2000-2260

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Topics: Creep, Damage, Fatigue, Micromechanics (Engineering), Solders, Tin, Stress, Aeroelasticity, Damage mechanics, Fatigue damage

NARROW

Interfacial Delamination Propagation in Multi-Layered High-Density Wiring Electronic Packaging Structures

Nonuniform Temperature Distribution in Electronic Devices Cooled by Flow in Parallel Microchannels

Durability Properties Characterization of Sn62Pb36Ag2 Solder Alloy

Experimentally Validated Vibration Fatigue Life Prediction Model for Ball Grid Array Solder Joint

Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board

Application of a Novel Flip Chip Solder Joint Inspection System to Chips on an FR-4 Substrate

Thermomechanical Durability of High I/O BGA Packages

Wafer Level Underfill Processing

Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface

Stress Concentration in a Connectorized Optical Fiber

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints

Effect of Moisture on Durability of Flip-Chip-on-Board (FCOB) Interconnects

Nonlinear Thermal and Mechanical Analysis in the Vibration of a Printed Wiring Board

Interfacial Versus Cohesive Failure on Underfill-Aluminum Interface: Effects of Interface Roughness

Key Parameters Affecting Solder Joint Life of Chip Resistors and Chip Capacitors Mounted on Insulated Metal Substrate

Parametric Design and Reliability Analysis of WIT Wafer Level Packaging

Thermal Aging Effect on the Ball Shear Strength of Pb-Free Solders on a Ceramic Substrate With Pd/Ag Surface Metallization

Thermal Cycling Guidelines for Automotive, Computer, Portable, and Implantable Medical Device Applications

Micro-Mechanics of Creep-Fatigue Damage in Pb-Sn Solder Due to Thermal Cycling

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