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Proceedings Papers

A Study of the Aperture Filling Process in Solder Paste Stencil Printing

Jianbiao Pan, Gregory L. Tonkay
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 75-82, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0920
https://doi.org/10.1115/IMECE1999-0920
View Paper titled, A Study of the Aperture Filling Process in Solder Paste Stencil Printing
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Topics: Printing, Solders, Ball-Grid-Array packaging, Surface mount assemblies, Flip-chip, Flip-chip devices, Packaging
Proceedings Papers

Artwork Scaling Factor for Inner Layers in Multi-Layer Board Manufacture

Owen Christofferson, Chittaranjan Sahay
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 69-73, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0919
https://doi.org/10.1115/IMECE1999-0919
View Paper titled, Artwork Scaling Factor for Inner Layers in Multi-Layer Board Manufacture
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Topics: Circuits, Density, Manufacturing, Printed circuit boards
Proceedings Papers

Performance of Thermal Enhancements in Chip on Flex

Gary Miller, Chittaranjan Sahay
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 107-110, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0923
https://doi.org/10.1115/IMECE1999-0923
View Paper titled, Performance of Thermal Enhancements in Chip on Flex
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Topics: Blocks (Building materials), Construction, Density, Economics , Engines, Integrated circuits
Proceedings Papers

Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages

V. H. Adams, K. Ramakrishna
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 99-106, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0922
https://doi.org/10.1115/IMECE1999-0922
View Paper titled, Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages
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Topics: Electronic packages, Heating, Performance characterization, Silicon, Heat, Temperature, Thermal characterization, Ball-Grid-Array packaging, Engineering simulation, Junctions
Proceedings Papers

A Performance & Manufacturability Evaluation of Bump Chip Carrier Packages

Lei L. Mercado, Vijay Sarihan, Russell Fiorenzo
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 61-67, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0918
https://doi.org/10.1115/IMECE1999-0918
View Paper titled, A Performance & Manufacturability Evaluation of Bump Chip Carrier Packages
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Topics: Corners (Structural elements), Finite element analysis, Manufacturing, Packaging density (Electronics), Reliability, Solders, Thermomechanics, Warping
Proceedings Papers

Integrated Transient Thermal and Mechanical Analysis of Molded PBGA Packages During Thermal Shock

Lei L. Mercado, Tien-Yu Tom Lee, Jeff Cook
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 111-119, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0924
https://doi.org/10.1115/IMECE1999-0924
View Paper titled, Integrated Transient Thermal and Mechanical Analysis of Molded PBGA Packages During Thermal Shock
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Topics: Thermal shock, Transients (Dynamics), Computational fluid dynamics, Stress, Boundary-value problems, Ball-Grid-Array packaging, Flip-chip, Heat transfer, Heat transfer coefficients, Molded plastics
Proceedings Papers

Thermal Issues That Arise due to Manufacturing Processes: Evaluation and Measurement Techniques

Bahgat Sammakia, Sanjeev Sathe
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 121-138, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0925
https://doi.org/10.1115/IMECE1999-0925
View Paper titled, Thermal Issues That Arise due to Manufacturing Processes: Evaluation and Measurement Techniques
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Topics: Manufacturing, Heat sinks, Adhesives, Delamination, Design, Lamination, Signals, Stress, Accounting, Ball-Grid-Array packaging
Proceedings Papers

In-Situ Warpage Measurement During Thermal Cycling of Dielectric Coated SS Substrate for Large Area MCM-D Packaging

Anh X. H. Dang, I. Charles Ume, Swapan K. Bhattacharya
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 169-179, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0930
https://doi.org/10.1115/IMECE1999-0930
View Paper titled, In-Situ Warpage Measurement During Thermal Cycling of Dielectric Coated SS Substrate for Large Area MCM-D Packaging
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Topics: Packaging, Warping, Dielectric materials, Lasers, Stainless steel, Temperature, Thin films, Vehicles
Proceedings Papers

A Model of Crack Nucleation in Layered Electronic Assemblies Under Thermal Cycling

A. Chandra, Y. Huang, Z. Q. Jiang, K. X. Hu
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 139-147, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0926
https://doi.org/10.1115/IMECE1999-0926
View Paper titled, A Model of Crack Nucleation in Layered Electronic Assemblies Under Thermal Cycling
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Topics: Fracture (Materials), Nucleation (Physics), Damage, Cycles, Crack propagation, Dislocations, Fatigue cracks, Fracture mechanics, Microscale devices, Springs
Proceedings Papers

A Dual-Phase-Lag Diffusion Model for Predicting Thin Film Growth

J. K. Chen, J. E. Beraun, D. Y. Tzou
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 155-161, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0928
https://doi.org/10.1115/IMECE1999-0928
View Paper titled, A Dual-Phase-Lag Diffusion Model for Predicting Thin Film Growth
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Topics: Diffusion (Physics), Thin films, Density, Model validation, Oxidation, Silicon
Proceedings Papers

Effect of Volume on Ceramic Ball-Grid Array Solder Life

Stephen A. McKeown, Chittaranjan Sahay
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 163-167, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0929
https://doi.org/10.1115/IMECE1999-0929
View Paper titled, Effect of Volume on Ceramic Ball-Grid Array Solder Life
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Topics: Ceramics, Solders, Finite element analysis, Solder joints, Cycles, Fatigue life, Modeling, Temperature
Proceedings Papers

Design and Implementation of a Flexible Intelligent Electronics Remanufacturing System

Ismail Fidan, Russell P. Kraft, Stephen J. Derby
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 83-90, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0921
https://doi.org/10.1115/IMECE1999-0921
View Paper titled, Design and Implementation of a Flexible Intelligent Electronics Remanufacturing System
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Topics: Circuits, Density, Design, Electronics, End effectors, Lasers, Lumber, Manufacturing, Printed circuit boards, Robotics
Proceedings Papers

Constitutive and Cyclic Damage Model of 63Sn-37Pb Solder

V. Stolkarts, L. M. Keer, M. E. Fine
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 149-154, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0927
https://doi.org/10.1115/IMECE1999-0927
View Paper titled, Constitutive and Cyclic Damage Model of 63Sn-37Pb Solder
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Topics: Damage, Solders, Fatigue, Thermomechanics
Proceedings Papers

Transient Thermal Analysis of an Anisotropic Conductive Film Package Assembly Process

Victor Adrian Chiriac, Tien-Yu Tom Lee
Proc. ASME. IMECE2000, Manufacturing Engineering, 453-459, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1840
https://doi.org/10.1115/IMECE2000-1840
View Paper titled, Transient Thermal Analysis of an Anisotropic Conductive Film Package Assembly Process
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Topics: Anisotropy, Manufacturing, Thermal analysis, Transients (Dynamics), Temperature, Computational fluid dynamics, Hardening (Curing), Convection, Cooling, Heat conduction
Proceedings Papers

Formulae to Size Axisymmetric Heat Spreaders Above Dielectric Layers

Marc Hodes
Proc. ASME. IMECE2000, Manufacturing Engineering, 443-451, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1839
https://doi.org/10.1115/IMECE2000-1839
View Paper titled, Formulae to Size Axisymmetric Heat Spreaders Above Dielectric Layers
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Topics: Flat heat pipes, Thermal resistance, Heat sinks
Proceedings Papers

Mechanical Characterization of Gold Bonding Wires With Different Doping at Extreme Temperatures

Dave S. Mahadevan, Vern Hause, Tien-Yu Tom Lee
Proc. ASME. IMECE2000, Manufacturing Engineering, 467-471, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1842
https://doi.org/10.1115/IMECE2000-1842
View Paper titled, Mechanical Characterization of Gold Bonding Wires With Different Doping at Extreme Temperatures
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Topics: Bonding, Temperature, Wire, Stress, Elongation, Extruding, Strength (Materials)
Proceedings Papers

Thermal Contact Resistance of Phase Change and Grease Type Polymeric Materials

Ravi S. Prasher, Craig Simmons, Gary Solbrekken
Proc. ASME. IMECE2000, Manufacturing Engineering, 461-466, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1841
https://doi.org/10.1115/IMECE2000-1841
View Paper titled, Thermal Contact Resistance of Phase Change and Grease Type Polymeric Materials
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Topics: Contact resistance, Thermal conductivity, Phase change materials, Polymers, Flat heat pipes, Computer cooling, Electronic packages, Fluids, Heat sinks, Particulate matter
Proceedings Papers

Thermal Assessment and Enhancement of Molded Array (MAP) PBGA Packages for Handheld Telecommunication Applications

V. H. Adams, V. A. Chiriac, T.-Y. Tom Lee
Proc. ASME. IMECE2000, Manufacturing Engineering, 433-442, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1838
https://doi.org/10.1115/IMECE2000-1838
View Paper titled, Thermal Assessment and Enhancement of Molded Array (MAP) PBGA Packages for Handheld Telecommunication Applications
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Topics: Ball-Grid-Array packaging, Computational fluid dynamics, Cooling, Copper, Design, Energy dissipation, Engineering simulation, Flat heat pipes, Heat, Heat conduction
Proceedings Papers

Parametric Studies of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

Sandeep S. Tonapi, Sanjeev B. Sathe, K. Srihari, Bahgat B. Sammakia
Proc. ASME. IMECE2000, Manufacturing Engineering, 425-431, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1837
https://doi.org/10.1115/IMECE2000-1837
View Paper titled, Parametric Studies of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package
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Topics: Ball-Grid-Array packaging, Heat transfer, Accounting, Convection, Energy dissipation, Forced convection, Heat, Heat conduction, Junctions, Temperature
Proceedings Papers

Thermal Evaluation of GaAs-Based RF Power Amplifier Packages for Handheld Portable Applications

V. H. Adams, T. Y. Tom Lee, J. V. Hause
Proc. ASME. IMECE2000, Manufacturing Engineering, 413-423, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1836
https://doi.org/10.1115/IMECE2000-1836
View Paper titled, Thermal Evaluation of GaAs-Based RF Power Amplifier Packages for Handheld Portable Applications
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Topics: Gallium arsenide, Printed circuit boards, Thermal conductivity, Approximation, Cooling, Energy dissipation, Heat, Heat conduction, Heat flux, Heat transfer