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Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures
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Proceedings Papers

Study of Nucleation of Diamond on Silicon Substrate by Ab-Initio Molecular Dynamics

Tomoo Kayaba, Akinori Inoue, Masumi Saka, Hiroyuki Abé
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 83-85, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0432
https://doi.org/10.1115/IMECE1998-0432
View Paper titled, Study of Nucleation of Diamond on Silicon Substrate by Ab-Initio Molecular Dynamics
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Topics: Diamonds, Molecular dynamics, Nucleation (Physics), Silicon, Atoms, Carbon, Chemical vapor deposition, Diamond films, Simulation, Aluminum
Proceedings Papers

Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages

Daqing Zou, Xiaoyuan He, Minfu Lu, Sheng Liu, Yifan Guo
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 59-64, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0429
https://doi.org/10.1115/IMECE1998-0429
View Paper titled, Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages
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Topics: Circuits, Control equipment, Corners (Structural elements), Deformation, Density, Displacement, Electronic packages, Flip-chip, Flip-chip packages, Interferometers
Proceedings Papers

Analysis of Electromigration Considering Thomson Effect

Kazuhiko Sasagawa, Manabu Yagi, Masumi Saka, Hiroyuki Abé
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 87-92, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0433
https://doi.org/10.1115/IMECE1998-0433
View Paper titled, Analysis of Electromigration Considering Thomson Effect
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Topics: Electrodiffusion, Thermoelectricity, Temperature distribution, Metals, Corners (Structural elements), Current density, Damage, Temperature
Proceedings Papers

Thermal Deformation Analysis of a Plastic Quad Flat Package by Hybrid Moiré and Finite Element Method

D. S. Liu, S. C. Hsu, Y. C. Tung
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 51-58, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0428
https://doi.org/10.1115/IMECE1998-0428
View Paper titled, Thermal Deformation Analysis of a Plastic Quad Flat Package by Hybrid Moiré and Finite Element Method
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Topics: Finite element methods, Thermal deformation, Finite element model, Testing, Computer simulation, Constitutive equations, Deformation, Design, Dimensions, Interferometry
Proceedings Papers

Warpage Measurement of Microelectronics Devices by Far Infrared Fizeau Interferometry

K. Verma, B. Han
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 93-99, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0434
https://doi.org/10.1115/IMECE1998-0434
View Paper titled, Warpage Measurement of Microelectronics Devices by Far Infrared Fizeau Interferometry
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Topics: Interferometry, Microelectronic devices, Warping, Surface roughness, Computers, Design for Manufacturing, Infrared radiation, Surface topography
Proceedings Papers

Parametric Analysis of Thermally Enhanced BGA Reliability Using a Finite-Volume-Weighted Averaging Technique

Hsien-Chie Cheng, Kuo-Ning Chiang, Chao-Kuang Chen
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 13-20, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0423
https://doi.org/10.1115/IMECE1998-0423
View Paper titled, Parametric Analysis of Thermally Enhanced BGA Reliability Using a Finite-Volume-Weighted Averaging Technique
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Topics: Ball-Grid-Array packaging, Reliability, Solder joints, Ball-Grid-Array packages, Design, Fatigue, Geometry, Corners (Structural elements), Finite element analysis, Manufacturing
Proceedings Papers

Preliminary in Process Stress Analysis of Flip Chip Assemblies During Thermal Cycling

Prema Palaniappan, Daniel F. Baldwin
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 101-106, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0435
https://doi.org/10.1115/IMECE1998-0435
View Paper titled, Preliminary in Process Stress Analysis of Flip Chip Assemblies During Thermal Cycling
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Topics: Flip-chip assemblies, Stress analysis (Engineering), Stress, Reliability, Cycles, Accelerated life testing, Electronic packages, Failure, Manufacturing, Simulation models
Proceedings Papers

On the Life Prediction and Accelerated Testing of Solder Joints

Zhengfang Qian, Sheng Liu
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 1-11, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0422
https://doi.org/10.1115/IMECE1998-0422
View Paper titled, On the Life Prediction and Accelerated Testing of Solder Joints
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Topics: Solder joints, Testing, Fatigue life, Flip-chip packages, Constitutive equations, Finite element analysis, Finite element model, Modeling, Solders, Temperature
Proceedings Papers

Die Stress Measurements Using High Temperature Die-Attachment Materials

Yida Zou, Jeffrey C. Suhling, Richard C. Jaeger, Shun-Tien Lin, Jeffrey T. Benoit, Richard R. Grzybowski
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 107-117, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0436
https://doi.org/10.1115/IMECE1998-0436
View Paper titled, Die Stress Measurements Using High Temperature Die-Attachment Materials
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Topics: High temperature, Stress, Temperature, Adhesives, Sensors, Ceramics, Engineering simulation, Finite element analysis, Glass, Packaging
Proceedings Papers

Analysis of Process Yield in Low Cost Flip Chip on Board Assembly Processes

Ryan Thorpe, Lawrence P. McGovern, Daniel F. Baldwin
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 27-33, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0425
https://doi.org/10.1115/IMECE1998-0425
View Paper titled, Analysis of Process Yield in Low Cost Flip Chip on Board Assembly Processes
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Topics: Flip-chip, Flip-chip devices, Manufacturing, Flow (Dynamics), Solders, Vehicles, Compression, Ovens, Printing
Proceedings Papers

Flow Modeling and Validation of the Encapsulation of Plastic Packages

L. Nguyen, C. Quentin, W. Lee, S. Bayyuk, S. A. Bidstrup-Allen, S.-T. Wang
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 119-134, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0437
https://doi.org/10.1115/IMECE1998-0437
View Paper titled, Flow Modeling and Validation of the Encapsulation of Plastic Packages
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Topics: Flow (Dynamics), Modeling, Simulation, Chemically reactive flow, Computer software, Computer-aided design, Cycles, Deformation, Design, Design for Manufacturing
Proceedings Papers

Automatic Warpage Measurement of Advanced Packages by Optical Method

Xiaoyuan He, Jiabin Dai, Sheng Liu
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 65-70, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0430
https://doi.org/10.1115/IMECE1998-0430
View Paper titled, Automatic Warpage Measurement of Advanced Packages by Optical Method
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Topics: Warping, Deformation, Ball-Grid-Array packaging, Shapes, Computer software, Diffraction gratings, Imaging, Manufacturing, Modeling, Packaging
Proceedings Papers

A Testing Method and Device for Intrinsic Stress Measurement in Wafer Bumping Process

Yifan Guo, Dianne Mitchell, Vijay Sarihan, Dawei Zheng
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 135-140, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0438
https://doi.org/10.1115/IMECE1998-0438
View Paper titled, A Testing Method and Device for Intrinsic Stress Measurement in Wafer Bumping Process
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Topics: Semiconductor wafers, Stress, Testing, Membranes, Sensors, Pressure sensors, Deformation, Residual stresses, Signals
Proceedings Papers

Thermal Characterization of Anisotropic Polymer Films for Electronic Systems

K. Kurabayashi, M. Asheghi, M. N. Touzelbaev, K. E. Goodson
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 71-81, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0431
https://doi.org/10.1115/IMECE1998-0431
View Paper titled, Thermal Characterization of Anisotropic Polymer Films for Electronic Systems
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Topics: Anisotropy, Electronic systems, Polymer films, Thermal characterization, Micromachining, Temperature, Thermal conductivity, Actuators, Heating, Integrated circuits
Proceedings Papers

On Enhancing Eutectic Solder Joint Reliability Using a 2 nd -Reflow-Process Approach

Kuo-Ning Chiang, Hsien-Chie Cheng
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 21-25, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0424
https://doi.org/10.1115/IMECE1998-0424
View Paper titled, On Enhancing Eutectic Solder Joint Reliability Using a 2 nd -Reflow-Process Approach
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Topics: Reliability, Solder joints, Solders, Ball-Grid-Array packaging, Geometry, Fatigue life, Flip-chip, Flip-chip devices, Materials properties
Proceedings Papers

Effect of Manufacturing Induced Defects on the Reliability of Flip-Chip Packages

Jianjun Wang, Daqing Zou, Zhengfang Qian, Wei Ren, Sheng Liu
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 35-42, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0426
https://doi.org/10.1115/IMECE1998-0426
View Paper titled, Effect of Manufacturing Induced Defects on the Reliability of Flip-Chip Packages
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Topics: Flip-chip packages, Manufacturing, Reliability, Solders, Simulation results, Finite element analysis, Finite element model, Interferometry, Warping, Contamination
Proceedings Papers

A Linear Motor Driven Mini Tester and its Application to Thermal/Mechanical Fatigue Testing of Solder Joint Specimen

Minfu Lu, Zhengfang Qian, Sheng Liu, Jianhau Wu
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 43-49, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0427
https://doi.org/10.1115/IMECE1998-0427
View Paper titled, A Linear Motor Driven Mini Tester and its Application to Thermal/Mechanical Fatigue Testing of Solder Joint Specimen
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Topics: Fatigue testing, Linear motors, Solder joints, Fatigue, Damage, Engines, Motors, Solders, Failure, Fracture (Materials)