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Keywords: analytical model
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Proceedings Papers

Proc. ASME. IMECE2021, Volume 5: Biomedical and Biotechnology, V005T05A060, November 1–5, 2021
Paper No: IMECE2021-73590
... and research studies of the various head models, but very limited analytical models to date for parametric studies. Analytical models of head impact play a vital role in predicting relative displacement between skull and brain, transmitted forces, post-impact velocity, and acceleration of the head system...
Topics: Brain
Proceedings Papers

Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 443-449, November 11–15, 2007
Paper No: IMECE2007-43736
... of a typical package consisting of a non-uniformly powered die, heat spreader, TIM I &II and the base of the heat sink. In this paper, an analytical approach to temperature distribution of a first level package with a non-uniformly powered die is carried out for the first time. The analytical model for two...
Proceedings Papers

Proc. ASME. IMECE2002, Adaptive Structures and Materials Systems, 177-183, November 17–22, 2002
Paper No: IMECE2002-33977
... temperature field. An analytical model was used, based on Euler-Bernoulli’s beam theory with the introduction of the proper boundary conditions. Temperature effects are included in terms of an axial force that shows up when the beam tends to thermally expand, but this expansion is restrained by the clamping...
Proceedings Papers

Proc. ASME. IMECE2005, Manufacturing Engineering and Materials Handling, Parts A and B, 1237-1245, November 5–11, 2005
Paper No: IMECE2005-79180
... with the experimental results. This model is found to be more accurate in predicting the surface roughness when compared to the existing model. Analytical model Surface roughness Ceramic grinding Chip thickness Bandyoupadhyay B. P. , 1995 , “ The effects of grinding parameters on the strength...
Proceedings Papers

Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 43-49, November 5–10, 2006
Paper No: IMECE2006-13436
..., initially (Part I) temperature distribution of a typical package consisting of a uniformly powered die, heat spreader, TIM 1 & 2 and the base of the heat sink is calculated using an approximate analytical model. The results are then compared with a detailed numerical model and the agreement is within 5...