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Keywords: chemical-mechanical polishing (CMP)
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Proceedings Papers

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 135-141, November 11–16, 2001
Paper No: IMECE2001/EPP-24717
... or with circuit pattern, become better when the pressure or velocity increases. The thickness of the low-k layer, however, has only tiny effect on the RR and NU. chemical-mechanical polishing (CMP) low-k dielectric polishing pressure polishing velocity removal rate non-uniformity Proceedings...
Proceedings Papers

Proc. ASME. IMECE2002, Microelectromechanical Systems, 321-326, November 17–22, 2002
Paper No: IMECE2002-33463
... though RR is lower slurry with abrasives. s: chemical-mechanical polishing (CMP), oxide, removal rate, non-uniformity TION circuit (IC) is the basic component for all kinds electronic products. The technologies for CMP machine. Figure 1 is an illustration of a typical orbital CMP process where the wafer...
Proceedings Papers

Proc. ASME. IMECE2004, Manufacturing Engineering and Materials Handling Engineering, 537-540, November 13–19, 2004
Paper No: IMECE2004-61072
... corrosion and mechanical he strong interaction and the combined reaction of rrosion and mechanical polishing need further . rds: chemical-mechanical polishing (CMP), chemical corrosion, mechanical polishing, removal UCTION d circuit (IC) is the basic component for modern oducts. The technologies...