... A numerical solution of heat transfer by combined natural convection and surface radiation in a square enclosure with thick adiabatic top and bottom walls and isothermal vertical walls is presented. The present model was used to obtain new results with the addition of thermal conduction...

... Proceedings of IMECE2003: 2003 ASME International Mechanical Engineering Congress and RD&D Expo Washington, D.C., USA, November 15-21, 2003. enclosure industrial temperat Rayleigh are unste overall f deviation streams o low Ra n the impin the enclo enclosure transfer r two halv transfer b Key...

... for automotive applications. CFD free convection PQFN simulation enclosure conduction m n e o A 3 .c signific isotherm leads to transien superio packag Keyw enclos NOM H IC K P Q R RF Proceedings of IMECE04 2004 ASME International Mechanical Engineering Congress and Exposition November 13-20, 2004...

... to the epoxy die attach in the 54 lead SOIC package. Several cases are evaluated in the paper, with an emphasis on the superior thermal performance of new packages for automotive applications. CFD free convection PQFN QFN packages simulation enclosure conduction “Overall Roadmpap Technology...