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Keywords: low-k dielectric
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Proceedings Papers

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 135-141, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24717
... Abstract Low conductivity (low-k) dielectric material is used in the sandwich structure of next-generation semiconductor devices in order to reduce the RC time delay. While global flatness of wafer surface becomes critical for deep sub-micro semiconductor fabrication process, chemical...