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Keywords: polishing pressureClose
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 135-141, November 11–16, 2001
Paper No: IMECE2001/EPP-24717
... and conducted to investigate the effects of the thickness of the low-k layer under different polishing pressures and velocities. Material removal rate (RR) and non-uniformity (NU) are used as indices of the CMP process performance. The results show that the RR and NU of wafers with low-k layer, either blanket...
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 221-226, November 5–10, 2000
Paper No: IMECE2000-2267
... for modern products, in planarization and polishing for semiconducter particular computer, communication and consumer wafer with multilevel interconnections. This paper (3C) products. The IC industry is one of the fast investigates the effects of polishing pressure and growing and most important high...