Skip Nav Destination
1-14 of 14
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 283-288, November 11–16, 2001
Paper No: IMECE2001/EPP-24737
...Abstract Abstract Reliability issues are discussed for a plastic laminate-based package with partially exposed die active area. Thermal-mechanical stresses are calculated with finite element analysis to examine the effect of encapsulant in comparison with a similar package with die fully...
Proc. ASME. IMECE2000, Aerospace, 43-49, November 5–10, 2000
Paper No: IMECE2000-2153
... agent on stress and strain values of the composites were examined at the same volume fraction ratio. tensile properties stress strain textile composites glass epoxy AD-Vol. 63, Proceedings of the ASME Aerospace Division 2000 ASME 2000 EFFECTS OF PRODUCTION VARIABLES ON STRESS-STRAIN...
Proc. ASME. IMECE2013, Volume 9: Mechanics of Solids, Structures and Fluids, V009T10A078, November 15–21, 2013
Paper No: IMECE2013-65060
... behavior (i.e., displacements, strains and stress distributions) when it is subjected to externally applied uniform axial and radial loads. In this work, both the nanotube and its filler material are considered to be generally cylindrical orthotopic. For the derivation of exact solutions for radial loading...
Proc. ASME. IMECE2013, Volume 14: Vibration, Acoustics and Wave Propagation, V014T15A011, November 15–21, 2013
Paper No: IMECE2013-62612
... to identify modal shapes, natural frequencies, vibratory stress and the structural deformations. Based on the interface exchange of information between the fluid and structural domains, interactions between fluid and structure are calculated in a coupled manner. The numerical simulation is proceeded under...
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 405-412, November 9–15, 2012
Paper No: IMECE2012-89742
... interposer increases, TSV electrical parasitics increase. Moreover, the coefficient of thermal expansion (CTE) mismatch between the copper TSV and silicon causes reliability issues. To reduce TSV capacitance as well as to reduce TSV stresses, polymer-clad electrical TSVs were fabricated. Using the same...
Proc. ASME. IMECE2011, Volume 2: Biomedical and Biotechnology Engineering; Nanoengineering for Medicine and Biology, 895-900, November 11–17, 2011
Paper No: IMECE2011-63741
... it statically and dynamically. In this paper, a Fullerene is simulated by a spherical super element whose stress, deformation and natural frequency are calculated. The Fullerene is considered to be the C60 which is properly similar with a 66 surface-node spherical super element. In this study the mechanical...
Proc. ASME. IMECE2010, Volume 9: Mechanics of Solids, Structures and Fluids, 111-122, November 12–18, 2010
Paper No: IMECE2010-37803
... the severity of the mechanical damage related to the pipe geometry and material properties, the defect geometry and boundary conditions, and the pipe state of strain and stress. Moreover, multiple damaged areas may exist and interact like in the case of a hit by a multiple-tooth excavator. The main objective...
Proc. ASME. IMECE2010, Volume 9: Mechanics of Solids, Structures and Fluids, 195-201, November 12–18, 2010
Paper No: IMECE2010-39762
... 01 05 2012 A low-cost, light-weight, high-performance, composite turbomachinery impeller with uniquely designed blade patterns is analyzed. Such impellers can economically enable refrigeration plants to use water as a refrigerant (R718). A stress and vibration analyses procedure...
Proc. ASME. IMECE2010, Volume 9: Mechanics of Solids, Structures and Fluids, 383-392, November 12–18, 2010
Paper No: IMECE2010-39687
... arise, resulting in localised stresses. When these strands are assembled to form a wire rope, the complexity of the interfacial contact arrangement generally lead to simplified assumptions for predicting the rope response. An attempt is made in this paper to model a wire rope strand and deduce its...
Proc. ASME. IMECE2009, Volume 12: Micro and Nano Systems, Parts A and B, 873-882, November 13–19, 2009
Paper No: IMECE2009-12597
...., displacements, strains and stress distributions) when it is subjected to externally applied uniform radial pressure. In this work, both the nanotube and its filler material are considered to be generally cylindrical orthotropic. For no loss of generality, no plain strain condition is used and axial strain...
Proc. ASME. IMECE2007, Volume 4: Design, Analysis, Control and Diagnosis of Fluid Power Systems, 37-43, November 11–15, 2007
Paper No: IMECE2007-41371
... 26 05 2009 The stress of a mixed flow pump with open type blades was measured and predicted by a one-way coupled simulation to evaluate the reliability of pump strength. The mechanism generating a large stress was investigated by numerical results. The stress became maximum at 70%Q...
Proc. ASME. IMECE2004, Design Engineering, 233-238, November 13–19, 2004
Paper No: IMECE2004-60042
... is suitable to thin-wall elements and tive-thermal material. However, adhesive s are rarely used as principal loading elements use of the lower modulus, lower strength s with high scatter. Bolted joints can fer high stress and are used to join the sizable ng elements. However, the bolted joints...
Proc. ASME. IMECE2005, Tribology, 181-190, November 5–11, 2005
Paper No: IMECE2005-80670
... stress and strain rate for a granular layer over a range of deformation rates within the transition/mixed regime. Our objective is to understand the relationship between granular flow and tribological-related issues, such as friction and stress behaviors, in terms of dependences on packing density, shear...
Proc. ASME. IMECE2006, Innovations in Engineering Education: Mechanical Engineering Education, Mechanical Engineering Technology Department Heads, 127-131, November 5–10, 2006
Paper No: IMECE2006-15091
... instrumentation, programming and to provide data to support theoretical engineering concepts. Virtual Instrumentation Cantilever beam Labview Deflection Stress LVDT Joseph E. Shigley, 2004, Mechanical Engineering Design, Seventh Edition, McGraw Hill Inc. William T. Thomson, Theory...