The present study explores numerically the transient performance of a heat sink based on a phase change material (PCM), during the process of melting. Heat is transferred to the sink through its horizontal base, to which vertical fins made of aluminum are attached. The phase change material is stored between the fins. Its properties, including the melting temperature, latent and sensible specific heat, thermal conductivity and density in solid and liquid states, are based on a commercially available paraffin wax. A parametric investigation is performed for melting in a relatively small system, 10mm high, where the fin thickness is 1.2mm, and the distance between the fins varies from 2mm to 8mm. The temperature of the base varies from 12°C to 24°C above the mean melting temperature of the PCM. Transient numerical simulations are performed, yielding temperature evolution in the fins and the PCM. The computational results show how the transient phase-change process, expressed in terms of the volume melt fraction of the PCM, depends on the thermal and geometrical parameters of the system, which relate to the temperature difference between the base and the mean melting temperature, and to the thickness of the PCM layer. This paper was also originally published as part of the Proceedings of the ASME 2005 Heat Transfer Summer Conference.
Skip Nav Destination
ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
Transient Performance of a Finned PCM Heat Sink
V. Shatikian,
V. Shatikian
Ben-Gurion University of the Negev, Beer-Sheva, Israel
Search for other works by this author on:
G. Ziskind,
G. Ziskind
Ben-Gurion University of the Negev, Beer-Sheva, Israel
Search for other works by this author on:
R. Letan
R. Letan
Ben-Gurion University of the Negev, Beer-Sheva, Israel
Search for other works by this author on:
V. Shatikian
Ben-Gurion University of the Negev, Beer-Sheva, Israel
G. Ziskind
Ben-Gurion University of the Negev, Beer-Sheva, Israel
R. Letan
Ben-Gurion University of the Negev, Beer-Sheva, Israel
Paper No:
IPACK2005-73113, pp. 137-142; 6 pages
Published Online:
March 4, 2009
Citation
Shatikian, V, Ziskind, G, & Letan, R. "Transient Performance of a Finned PCM Heat Sink." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 137-142. ASME. https://doi.org/10.1115/IPACK2005-73113
Download citation file:
10
Views
Related Proceedings Papers
Related Articles
Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications
J. Electron. Packag (June,2008)
Studies on Optimum Distribution of Fins in Heat Sinks Filled With Phase Change Materials
J. Heat Transfer (March,2008)
Analysis and Design of a Paraffin/Graphite Composite PCM Integrated in a Thermal Storage Unit
J. Sol. Energy Eng (November,2010)
Related Chapters
Simultaneous Thermal Conductivity and Specific Heat Measurements of Thin Samples by Transient Joule Self-Heating
Inaugural US-EU-China Thermophysics Conference-Renewable Energy 2009 (UECTC 2009 Proceedings)
When Is a Heat Sink Not a Heat Sink?
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong
Studies Performed
Closed-Cycle Gas Turbines: Operating Experience and Future Potential