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Proceedings Papers

A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply

Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, August 29–September 1, 2017

Paper No: IPACK2017-74278

DOI: https://doi.org/10.1115/IPACK2017-74278

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Topics: Manufacturing, Testing, Reliability, Stress, Lumber, Temperature, Failure, Finite element analysis, Young's modulus, Computation

Proceedings Papers

Thermomechanical Reliability Challenges and Goals and Design for Reliability Methodologies for Electric Vehicle Systems

David Huitink

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, August 29–September 1, 2017

Paper No: IPACK2017-74245

DOI: https://doi.org/10.1115/IPACK2017-74245

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Topics: Design, Electric vehicles, Reliability, Thermomechanics, Stress, Vehicles, Electronics, Failure, Physics, Batteries

Proceedings Papers

Hot Spot Elimination by Thin and Smart Heat Spreader

Mohammad Shahed Ahamed, Yuji Saito, Masataka Mochizuki, Koichi Mashiko

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A049, July 6–9, 2015

Paper No: IPACK2015-48019

DOI: https://doi.org/10.1115/IPACK2015-48019

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Topics: Flat heat pipes, Heat pipes, Heat, Clocks, Computer cooling, Metals, Aerospace industry, Cooling, Data centers, Experimental analysis

Proceedings Papers

On the Thermal Management Challenges in Next Generation Handheld Devices

Guy R. Wagner, William Maltz

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A046, July 16–18, 2013

Paper No: IPACK2013-73237

DOI: https://doi.org/10.1115/IPACK2013-73237

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Topics: Thermal management, Cooling, Energy dissipation, Computers, Flat heat pipes, Laptop computers, Shells, Temperature

Proceedings Papers

Thinner Thermal Solution Module by Combination of Thin Heat Pipe and Piezo Fan

Ahmad Jalilvand, Masataka Mochizuki, Yuji Saito, Yoji Kawahara, Vijit Wuttijumnong, Thang Nguyen

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 367-375, July 6–8, 2011

Paper No: IPACK2011-52267

DOI: https://doi.org/10.1115/IPACK2011-52267

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Topics: Diluents, Heat pipes, Cooling, Laptop computers, Packaging, Acoustics, Condensers (steam plant), Density, Flat heat pipes, Heat

Proceedings Papers

Exergy Analysis and Entropy Generation Minimization of Thermoelectric Waste Heat Recovery for Electronics

Kazuaki Yazawa, Ali Shakouri

Paper No: IPACK2011-52191

DOI: https://doi.org/10.1115/IPACK2011-52191

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Topics: Electronics, Entropy, Exergy analysis, Heat recovery, Heat, Electronic systems, Brayton cycle, Design, Energy / power systems, Energy conversion

Proceedings Papers

Improvement of Heat Transfer Performance of Loop Heat Pipe for Electronic Devices

Tomonao Takamatsu, Katsumi Hisano, Hideo Iwasaki

Paper No: IPACK2011-52095

DOI: https://doi.org/10.1115/IPACK2011-52095

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Topics: Heat pipes, Heat transfer, Heat, Cooling, Cooling systems, Water, Bubbles, Flow (Dynamics), Stress, Thermal energy

Proceedings Papers

Multi-Objective Optimization of Graphite Heat Spreader for Portable Systems Applications

Nikhil Lakhkar, Arijit Banerjee, Gamal Refai-Ahmed, Dereje Agonafer

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 571-578, July 19–23, 2009

Paper No: InterPACK2009-89341

DOI: https://doi.org/10.1115/InterPACK2009-89341

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Topics: Flat heat pipes, Graphite, Pareto optimization, Cooling, Copper, Laptop computers, Temperature, Thermal conductivity, Weight (Mass), Density

Proceedings Papers

Challenges and Advances of Heat Pipes in Cooling Notebook Systems

Sridhar V. Machiroutu, Himanshu Pokharna, Masahiro Kuroda

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 677-687, July 8–12, 2007

Paper No: IPACK2007-33249

DOI: https://doi.org/10.1115/IPACK2007-33249

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Topics: Cooling, Heat pipes, Laptop computers, Design, Computers, Condensers (steam plant), Experimental design, Heat, Heat exchangers, Manufacturing

Proceedings Papers

Thermal Performance of Natural Graphite Heat Spreaders

Martin Smalc, Gary Shives, Gary Chen, Shrishail Guggari, Julian Norley, R. Andy Reynolds, III

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 79-89, July 17–22, 2005

Paper No: IPACK2005-73073

DOI: https://doi.org/10.1115/IPACK2005-73073

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Topics: Anisotropy, Flat heat pipes, Graphite, Laptop computers

Proceedings Papers

DDRII Memory Packages Electrical Performance Comparison of COSBGA, TFBGA, and Standard TSOPII

Bryan Hsieh, Kevin Chiang, Y. P. Wang, C. S. Hsiao

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1063-1068, July 17–22, 2005

Paper No: IPACK2005-73200

DOI: https://doi.org/10.1115/IPACK2005-73200

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Topics: Ball-Grid-Array packages, Ball-Grid-Array packaging, Clocks, Density, Electronics, Laptop computers, Manufacturing, Noise (Sound), Packaging, Signals

Proceedings Papers

Revolution in Fan Heat Sink Cooling Technology to Extend and Maximize Air Cooling for High Performance Processors in Laptop / Desktop / Server Application

Masataka Mochizuki, Yuji Saito, Thang Nguyen, Vijit Wuttijumnong, Xiaoping Wu, Tien Nguyen

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 431-437, July 17–22, 2005

Paper No: IPACK2005-73286

DOI: https://doi.org/10.1115/IPACK2005-73286

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Topics: Cooling, Heat pipes, Heat sinks, Laptop computers, Vapors, Energy dissipation, Heat, Clocks, Design, Heat flux

Proceedings Papers

Cooling of Notebook PCs by Flexible Oscillating Heat Pipes

Yoshiro Miyazaki

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 65-69, July 17–22, 2005

Paper No: IPACK2005-73055

DOI: https://doi.org/10.1115/IPACK2005-73055

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Topics: Cooling, Dynamic light scattering, Heat pipes, Laptop computers, Heat, Computers, Cooling systems, Copper, Heating, Hinges

Proceedings Papers

Mathematical Optimization of Electronic Enclosures

D. J. De Kock, M. Nagulapally, J. A. Visser, R. Nair, J. Nigen

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 253-258, July 17–22, 2005

Paper No: IPACK2005-73185

DOI: https://doi.org/10.1115/IPACK2005-73185

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Topics: Optimization, Design, Computational fluid dynamics, Flow (Dynamics), Lumber, Temperature, Filters, Design methodology, Electronic components, Fans

Proceedings Papers

Indirect Cooling of IC Chips Using a Two Phase Closed Thermosyphon Loop

Satoru Gima, Takashi Nagata, Xing Zhang, Motoo Fujii

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 337-342, July 6–11, 2003

Paper No: IPACK2003-35148

DOI: https://doi.org/10.1115/IPACK2003-35148

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Topics: Cooling, Laptop computers, Condensers (steam plant), Temperature, Boiling, Heat, Computer cooling, Cooling systems, Dimensions, Fluids

Proceedings Papers

Thermofluid Design of Energy Efficient and Compact Heat Sinks

Kazuaki Yazawa, Gary L. Solbrekken, Avram Bar-Cohen

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 509-516, July 6–11, 2003

Paper No: IPACK2003-35242

DOI: https://doi.org/10.1115/IPACK2003-35242

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Topics: Design, Heat sinks, Thermofluids, Fins, Convection, Cooling, Cooling systems, Design methodology, Electronic products, Energy efficiency

Proceedings Papers

Experimental and Numerical Studies of the Thermal Hinge in a Notebook Computer

Tarek Jamal-Eddine, Lawrence Mok

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 389-394, July 6–11, 2003

Paper No: IPACK2003-35186

DOI: https://doi.org/10.1115/IPACK2003-35186

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Topics: Hinges, Laptop computers, Heat, Computer simulation, Flat heat pipes, Computers, Heat pipes, Springs, Acoustics, Aluminum

Proceedings Papers

Numerical Simulation of a Heat Pipe Embedded Cooling System for a Notebook PC

Yi Jia, Pablo D. Quinones

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 349-354, July 6–11, 2003

Paper No: IPACK2003-35135

DOI: https://doi.org/10.1115/IPACK2003-35135

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Topics: Computer simulation, Cooling systems, Heat pipes, Laptop computers, Heat, Computer software, Dynamic light scattering, Energy dissipation, Finite element model, Geometry

NARROW

A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply

Thermomechanical Reliability Challenges and Goals and Design for Reliability Methodologies for Electric Vehicle Systems

Hot Spot Elimination by Thin and Smart Heat Spreader

On the Thermal Management Challenges in Next Generation Handheld Devices

Thinner Thermal Solution Module by Combination of Thin Heat Pipe and Piezo Fan

Exergy Analysis and Entropy Generation Minimization of Thermoelectric Waste Heat Recovery for Electronics

Improvement of Heat Transfer Performance of Loop Heat Pipe for Electronic Devices

Multi-Objective Optimization of Graphite Heat Spreader for Portable Systems Applications

Challenges and Advances of Heat Pipes in Cooling Notebook Systems

Thermal Performance of Natural Graphite Heat Spreaders

DDRII Memory Packages Electrical Performance Comparison of COSBGA, TFBGA, and Standard TSOPII

Revolution in Fan Heat Sink Cooling Technology to Extend and Maximize Air Cooling for High Performance Processors in Laptop / Desktop / Server Application

Cooling of Notebook PCs by Flexible Oscillating Heat Pipes

Mathematical Optimization of Electronic Enclosures

Indirect Cooling of IC Chips Using a Two Phase Closed Thermosyphon Loop

Thermofluid Design of Energy Efficient and Compact Heat Sinks

Experimental and Numerical Studies of the Thermal Hinge in a Notebook Computer

Numerical Simulation of a Heat Pipe Embedded Cooling System for a Notebook PC

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