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Proceedings Papers

Performance Analysis of Micro-Raman Spectroscopy Models for Thermal Conductivity Calculation

Taher Meydando, Nazli Donmezer
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 26–28, 2021
Paper No: IPACK2021-73648
DOI: https://doi.org/10.1115/IPACK2021-73648
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Topics: Phonons, Spectroscopy, Thermal conductivity, Thin films
Proceedings Papers

Advanced Cooling of 3D ICs With Nanoparticle Packings

Anil Yuksel, Paul S. Ho, Jayathi Murthy
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A025, August 29–September 1, 2017
Paper No: IPACK2017-74137
DOI: https://doi.org/10.1115/IPACK2017-74137
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Topics: Cooling, Nanoparticles, Packings (Cushioning), Energy dissipation, Heat, Thermal management, Dimensions, High temperature, Phonons, Polaritons
Proceedings Papers

The Prediction of the Thermal Conductivity of Gallium Arsenide: A Molecular Dynamics Study

Fernan Saiz, Cristina H. Amon
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A002, July 6–9, 2015
Paper No: IPACK2015-48114
DOI: https://doi.org/10.1115/IPACK2015-48114
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Topics: Gallium arsenide, Molecular dynamics, Thermal conductivity, Temperature, Acoustics, Density, Design, Electromagnetic scattering, Equilibrium (Physics), Heat
Proceedings Papers

Morphological Impact on Thermal Interface Resistance of Self Catalyzing Fecralloy MWNT TIMs

Timothy J. Longson, James Maddocks, Ali Kashani
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A078, July 6–9, 2015
Paper No: IPACK2015-48735
DOI: https://doi.org/10.1115/IPACK2015-48735
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Topics: Multi-walled nanotubes, Contact resistance, Temperature, Heat conduction, Modeling, Carbon, Catalysts, Deformation, Density, Multi-walled carbon nanotubes
Proceedings Papers

Thermal Conductivity of Phonon Modes in Graphene Nanoribbon at Localized High Heating

Tatiana Zolotoukhina
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A003, July 6–9, 2015
Paper No: IPACK2015-48297
DOI: https://doi.org/10.1115/IPACK2015-48297
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Topics: Graphene, Heating, Phonons, Thermal conductivity, Transients (Dynamics), Equilibrium (Physics), High temperature, Density, Dispersion relations, Dynamics (Mechanics)
Proceedings Papers

Heat Transfer in Nanoelectronics by Quantum Mechanics

Thomas Prevenslik
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A011, July 16–18, 2013
Paper No: IPACK2013-73173
DOI: https://doi.org/10.1115/IPACK2013-73173
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Topics: Heat transfer, Nanoelectronics, Quantum mechanics, Heat, Joules, Quantum electrodynamics, Circuits, Phonons, Radiation (Physics), Temperature
Proceedings Papers

A Hierarchical Framework for Thermal Modelling of Electronic Devices: From Atoms to Chips

David A. Romero, Elham Pakseresht, Daniel Sellan, Aydin Nabovati, Cristina Amon
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A043, July 16–18, 2013
Paper No: IPACK2013-73202
DOI: https://doi.org/10.1115/IPACK2013-73202
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Topics: Atoms, Modeling, Engineering simulation, Simulation, Thermal conductivity, Phonons, Physics, Silicon, Gates (Closures), Lattice Boltzmann methods
Proceedings Papers

Multi-Physics of Nanoscale Thin Films and Interfaces

M. A. Haque
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 375-379, July 6–8, 2011
Paper No: IPACK2011-52038
DOI: https://doi.org/10.1115/IPACK2011-52038
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Topics: Nanoscale phenomena, Physics, Thin films, Electrical conductivity, Thermal conductivity, Deformation, Design, Dimensions, Electron microscopes, Electrons
Proceedings Papers

Spectral Detail of Phonon Conduction and Scattering in Graphene

Dhruv Singh, Jayathi Y. Murthy, Timothy S. Fisher
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 329-343, July 6–8, 2011
Paper No: IPACK2011-52243
DOI: https://doi.org/10.1115/IPACK2011-52243
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Topics: Electromagnetic scattering, Graphene, Heat conduction, Phonons, Radiation scattering, Scattering (Physics), Thermal conductivity, Probability, Algorithms, Approximation
Proceedings Papers

Frequency Resolved Phonon Transport in Si/Ge Nanocomposites

Dhruv Singh, Jayathi Y. Murthy, Timothy S. Fisher
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 757-768, July 6–8, 2011
Paper No: IPACK2011-52244
DOI: https://doi.org/10.1115/IPACK2011-52244
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Topics: Nanocomposites, Phonons, Thermal conductivity, Mean free path, Acoustics, Approximation, Density, Electromagnetic scattering, Engineering simulation, Equilibrium (Physics)
Proceedings Papers

Role of Interface Thermal Boundary Resistance, Straining, and Morphology in Thermal Conductivity of a Set of Si-Ge Superlattices and Biomimetic Si-Ge Nanocomposites

Vikas Samvedi, Vikas Tomar
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 361-367, July 6–8, 2011
Paper No: IPACK2011-52284
DOI: https://doi.org/10.1115/IPACK2011-52284
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Topics: Biomimetics, Interfacial thermal resistance, Nanocomposites, Superlattices, Thermal conductivity, Nanoscale phenomena, Nanostructures , Temperature, Engineering simulation, Equilibrium (Physics)
Proceedings Papers

Thermal Conductivity Reduction in Few-Layer Graphene

Dhruv Singh, Jayathi Y. Murthy, Timothy S. Fisher
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 769-778, July 6–8, 2011
Paper No: IPACK2011-52245
DOI: https://doi.org/10.1115/IPACK2011-52245
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Topics: Graphene, Thermal conductivity, Phonons, Acoustics, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Accounting, Graphite, Harmonics (Music)
Proceedings Papers

Quantum Simulation of Nanocrystalline Composite Thermoelectric Properties

T. D. Musho, D. G. Walker
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 171-175, July 19–23, 2009
Paper No: InterPACK2009-89332
DOI: https://doi.org/10.1115/InterPACK2009-89332
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Topics: Composite materials, Simulation, Alloys, Bulk solids, Density, Design, Electromagnetic scattering, Nanoscale phenomena, Phonons, Radiation scattering
Proceedings Papers

Molecular Dynamics Simulation of the Thermal Resistance of Carbon Nanotube – Substrate Interfaces

Daniel J. Rogers, Jianmin Qu, Matthew Yao
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 55-61, July 19–23, 2009
Paper No: InterPACK2009-89096
DOI: https://doi.org/10.1115/InterPACK2009-89096
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Topics: Carbon nanotubes, Interfacial thermal resistance, Molecular dynamics simulation, Phonons, Thermal resistance
Proceedings Papers

Thermal Characterization of a Single MOSFET Transistor at Cryogenic Temperatures

Xi Wang, Ali Shakouri
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 293-296, July 19–23, 2009
Paper No: InterPACK2009-89084
DOI: https://doi.org/10.1115/InterPACK2009-89084
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Topics: MOSFET transistors, Temperature, Thermal characterization, Temperature distribution, Gates (Closures), Design, Electrons, Flow (Dynamics), Heat, Phonons
Proceedings Papers

Improved Phonon Transport Modeling Using Boltzmann Transport Equation With Anisotropic Relaxation Times

Chunjian Ni, Jayathi Y. Murthy
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 99-109, July 19–23, 2009
Paper No: InterPACK2009-89181
DOI: https://doi.org/10.1115/InterPACK2009-89181
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Topics: Anisotropy, Modeling, Phonons, Relaxation (Physics), Electromagnetic scattering, Radiation scattering, Scattering (Physics), Silicon, Accounting, Equilibrium (Physics)
Proceedings Papers

A Molecular Dynamics Study of Thermal Conductivity in Nanocomposites via the Phonon Wave Packet Method

Zhiting Tian, Sang Kim, Ying Sun, Bruce White
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 607-615, July 19–23, 2009
Paper No: InterPACK2009-89272
DOI: https://doi.org/10.1115/InterPACK2009-89272
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Topics: Molecular dynamics, Nanocomposites, Phonons, Thermal conductivity, Wave packets, Molecular dynamics simulation, Electromagnetic scattering, Equilibrium (Physics), Flow (Dynamics), Heat
Proceedings Papers

Multiscale Modeling of Hot Spots in GaN High Electron Mobility Transistors

Adam Christensen, Samuel Graham
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 535-541, July 19–23, 2009
Paper No: InterPACK2009-89073
DOI: https://doi.org/10.1115/InterPACK2009-89073
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Topics: Electron mobility, Gallium nitride, Multiscale modeling, Transistors, Phonons, Heat, Diffusion (Physics), Dimensions, Electromagnetic scattering, Lattice Boltzmann methods
Proceedings Papers

Numerical Calculation for Phonon Properties of a Nano-Porous Si

Koji Miyazaki, Daisuke Nagai, Yohei Kido, Hiroshi Tsukamoto
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 557-561, July 19–23, 2009
Paper No: InterPACK2009-89118
DOI: https://doi.org/10.1115/InterPACK2009-89118
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Topics: Phonons, Fourier transforms, Thermal conductivity, Boundary-value problems, Crystals, Density, Heat conduction, Mean free path, Molecular dynamics simulation, Nanostructures
Proceedings Papers

Coupled Electro-Thermal Simulation of MOSFETs

Chunjian Ni, Zlatan Aksamija, Jayathi Y. Murthy, Umberto Ravaioli
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 161-173, July 19–23, 2009
Paper No: InterPACK2009-89182
DOI: https://doi.org/10.1115/InterPACK2009-89182
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Topics: Simulation, Phonons, Electrons, Heat, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Acoustics, Anisotropy, Heat conduction