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Proceedings Papers

Dual Converging Jets for Enhanced Liquid Impingement Cooling

Reece Whitt, Rafael Estrella, David Huitink
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A001, October 25–27, 2022
Paper No: IPACK2022-96635
DOI: https://doi.org/10.1115/IPACK2022-96635
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Topics: Additive manufacturing, Electronics, Impingement cooling, Jets, Heat transfer, Nozzles, Turbulence, Aluminum, Cooling, Fluids
Proceedings Papers

Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow

Rinaldo L. Miorini, Darin J. Sharar, Peter deBock
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 27–29, 2020
Paper No: IPACK2020-2605
DOI: https://doi.org/10.1115/IPACK2020-2605
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Topics: Thermal conductivity, Two-phase flow, Flow (Dynamics), Additive manufacturing, Army, Boundary-value problems, Bubbles, Buoyancy, Capacitance, Collaboration
Proceedings Papers

Silicon Carbide Power Module Co-Designed for Enhanced Thermal and Electrical Performance in Steady State and Transient Conditions

Arun V. Gowda, Rinaldo L. Miorini, Michael Fish, Darin J. Sharar, Peter deBock
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A014, October 27–29, 2020
Paper No: IPACK2020-2608
DOI: https://doi.org/10.1115/IPACK2020-2608
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Topics: Silicon, Steady state, Transients (Dynamics), Additive manufacturing, Flow (Dynamics), Army, Bubbles, Buoyancy, Capacitance, Collaboration
Proceedings Papers

Evaluation of Single Phase Immersion Cooling System for High Performance Server Chassis Using Dielectric Coolants

Shuai Shao, Tianyi Gao, Huawei Yang, Jie Zhao, Jiajun Zhang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A010, October 27–29, 2020
Paper No: IPACK2020-2670
DOI: https://doi.org/10.1115/IPACK2020-2670
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Topics: Coolants, Cooling, Cooling systems, Fluids, Graphics processing units, Power density, Data centers, Temperature, Decision making, Density
Proceedings Papers

Thermal Metamaterials for Heat Flow Control in Electronics

Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, August 29–September 1, 2017
Paper No: IPACK2017-74112
DOI: https://doi.org/10.1115/IPACK2017-74112
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Topics: Electronics, Flow control, Heat, Metamaterials, Flow (Dynamics), Anisotropy, Blocks (Building materials), Circuit design, Composite materials, Design
Proceedings Papers

Estimation of Heat Generation From Power Si MOSFET Using Electro-Thermal Analysis

Risako Kibushi, Tomoyuki Hatakeyama, Masaru Ishizuka
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A049, July 16–18, 2013
Paper No: IPACK2013-73273
DOI: https://doi.org/10.1115/IPACK2013-73273
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Topics: Heat, MOSFET transistors, Electrons, Temperature, Thermal energy, Thermal properties, Crystal lattices, Density, Electric fields, Electronics
Proceedings Papers

Improvement of Heat Transfer Performance of Loop Heat Pipe for Electronic Devices

Tomonao Takamatsu, Katsumi Hisano, Hideo Iwasaki
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 165-172, July 6–8, 2011
Paper No: IPACK2011-52095
DOI: https://doi.org/10.1115/IPACK2011-52095
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Topics: Heat pipes, Heat transfer, Heat, Cooling, Cooling systems, Water, Bubbles, Flow (Dynamics), Stress, Thermal energy
Proceedings Papers

Minimum Energy Design for Manufacturability of Air Cooled Heat Sinks

Madhusudan Iyengar, Avram Bar-Cohen
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 319-326, July 19–23, 2009
Paper No: InterPACK2009-89093
DOI: https://doi.org/10.1115/InterPACK2009-89093
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Topics: Design for Manufacturing, Heat sinks, Aluminum, Cooling, Copper, Magnesium (Metal), Manufacturing, Computers, Cycles, Design
Proceedings Papers

Advanced Integrated Cooling Systems for Thermal Management in Data Centers

Yoshiyuki Abe, Masato Fukagaya, Takashi Kitagawa, Haruhiko Ohta, Yasuhisa Shinmoto, Masahide Sato, Ken-ichi Iimura
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 619-624, July 19–23, 2009
Paper No: InterPACK2009-89009
DOI: https://doi.org/10.1115/InterPACK2009-89009
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Topics: Cooling systems, Data centers, Thermal management, Server racks, Heat pipes, Cables, Fluids, Heat exchangers, Heat sinks, Nanofluids
Proceedings Papers

Numerical Simulations for Digitized Heat Transfer

Eric Baird, Kamran Mohseni
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 923-931, July 19–23, 2009
Paper No: InterPACK2009-89264
DOI: https://doi.org/10.1115/InterPACK2009-89264
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Topics: Computer simulation, Heat transfer, Alloys, Electronics, Fluids, Heat, Heat flux, Heat sinks, Liquid metals, Microelectromechanical systems
Proceedings Papers

Characterization of Die Stress Distributions in Area Array Flip Chip Packaging

Jordan Roberts, M. Kaysar Rahim, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall, Ron Zhang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 977-988, July 19–23, 2009
Paper No: InterPACK2009-89383
DOI: https://doi.org/10.1115/InterPACK2009-89383
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Topics: Flip-chip, Flip-chip devices, Packaging, Stress, Sensors, Ceramics, Adhesives, Cycles, Manufacturing, Silicon
Proceedings Papers

Spatial Frequency Domain Analysis of Heat Transfer in Microelectronic Chips With Applications to Temperature Aware Computing

Keivan Etessam-Yazdani, Hendrik F. Hamann, Mehdi Asheghi
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 1033-1040, July 8–12, 2007
Paper No: IPACK2007-33793
DOI: https://doi.org/10.1115/IPACK2007-33793
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Topics: Cooling, Frequency-domain analysis, Heat, Heat transfer, Packaging, Temperature, Thermal diffusion, Thermal energy, Transfer functions
Proceedings Papers

Thermal Analyses of Composite Copper/ Porous Graphite Spreaders for Immersion Cooling Applications

Mohamed S. El-Genk, Hamed H. Saber, Jack Parker
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 305-314, July 17–22, 2005
Paper No: IPACK2005-73226
DOI: https://doi.org/10.1115/IPACK2005-73226
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Topics: Composite materials, Cooling, Copper, Graphite, Thermal analysis, Energy dissipation, Nucleate boiling, Temperature, Thermal energy, Anisotropy
Proceedings Papers

Numerical Calculation of Heat Transfer Coefficient of Liquid Flow With NPCM in Microchannels

Y. L. Hao, Y.-X. Tao
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 449-459, July 6–11, 2003
Paper No: IPACK2003-35224
DOI: https://doi.org/10.1115/IPACK2003-35224
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Topics: Flow (Dynamics), Heat transfer coefficients, Microchannels, Heat transfer, Laminar flow, Particulate matter, Computational fluid dynamics, Computer simulation, Computers, Ducts