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Proceedings Papers

Thermal Transport Across Al-(Al x Ga 1-x ) 2 O 3 and Al-Ga 2 O 3 Interfaces

Jingjing Shi, Anusha Krishnan, A. F. M. Anhar Uddin Bhuiyan, Yee Rui Koh, Kenny Huynh, Akhil Mauze, Sai Mu, Brian M. Foley, Habib Ahmad, Takeki Itoh, Yuewei Zhang, Chao Yuan, Samuel Kim, W. Alan Doolittle, Chris Van de Walle, James S. Speck, Mark Goorsky, Patrick Hopkins, Hongping Zhao, Samuel Graham
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 26–28, 2021
Paper No: IPACK2021-74116
https://doi.org/10.1115/IPACK2021-74116
View Paper titled, Thermal Transport Across Al-(Al x Ga 1-x ) 2 O 3 and Al-Ga 2 O 3 Interfaces
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Topics: Alloys, Aluminum, Cathode rays, Chemical reactions, Cooling, Electrical conductance, Electron beams, Electronics, Energy dissipation, Gallium
Proceedings Papers

Piezoresistive Theory for 4H Silicon Carbide Stress Sensors on Four-Degree Off-Axis Wafers

Jun Chen, R. C. Jaeger, J. C. Suhling
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A019, October 7–9, 2019
Paper No: IPACK2019-6461
https://doi.org/10.1115/IPACK2019-6461
View Paper titled, Piezoresistive Theory for 4H Silicon Carbide Stress Sensors on Four-Degree Off-Axis Wafers
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Topics: Semiconductor wafers, Sensors, Silicon, Stress, Calibration, Errors, Approximation, Design, Electronics, High temperature
Proceedings Papers

Reliability Study of High-Temperature-Resistant Mounting Structure Considering Shear Behavior of Joint Layer

Masanori Yamagiwa, Masato Fujita, Qiang Yu, Hiromi Sugihara
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 849-855, July 19–23, 2009
Paper No: InterPACK2009-89284
https://doi.org/10.1115/InterPACK2009-89284
View Paper titled, Reliability Study of High-Temperature-Resistant Mounting Structure Considering Shear Behavior of Joint Layer
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Topics: Reliability, Shear (Mechanics), Temperature, Finite element analysis, Cycles, Displacement, Fatigue, Gallium nitride, Stress, Circuits
Proceedings Papers

High Temperature Lead-Free Attach Reliability

Patrick McCluskey, Pedro O. Quintero
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 93-98, July 8–12, 2007
Paper No: IPACK2007-33457
https://doi.org/10.1115/IPACK2007-33457
View Paper titled, High Temperature Lead-Free Attach Reliability
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Topics: High temperature, Reliability, Packaging, Temperature, Electronic products, Electronics, Failure, Manufacturing, Modeling, Physics
Proceedings Papers

Optimization Study of a Silicon-Carbide Micro-Capillary Pumped Loop

Laura J. Meyer, Leslie M. Phinney
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 355-361, July 6–11, 2003
Paper No: IPACK2003-35138
https://doi.org/10.1115/IPACK2003-35138
View Paper titled, Optimization Study of a Silicon-Carbide Micro-Capillary Pumped Loop
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Topics: Optimization, Silicon, Thermal management, Condensers (steam plant), Cooling, Design, Dimensions, Energy budget (Physics), Gallium nitride, Heat flux