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Proceedings Papers

A Statistical Study to Evaluate the Performance of Liquid Cooling Garments Considering Thermal Comfort

Weicheng Shu, Jiawen Wang, Xinfeng Zhang, Xiaobing Luo
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 7–9, 2019
Paper No: IPACK2019-6325
https://doi.org/10.1115/IPACK2019-6325
View Paper titled, A Statistical Study to Evaluate the Performance of Liquid Cooling Garments Considering Thermal Comfort
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Topics: Cooling, Experimental design
Proceedings Papers

Modeling and Analysis of a Shape Memory Alloy-Based Adaptive Regulator for Thermal Management

Gary Liang, Ashkan Sadeghifard, Anirudh Krishna, Jaeho Lee, Edwin A. Peraza Hernandez
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 7–9, 2019
Paper No: IPACK2019-6402
https://doi.org/10.1115/IPACK2019-6402
View Paper titled, Modeling and Analysis of a Shape Memory Alloy-Based Adaptive Regulator for Thermal Management
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Topics: Alloys, Modeling, Shapes, Thermal management, Springs, Temperature, Solar energy, Deformation, Irradiation (Radiation exposure), Actuators
Proceedings Papers

Application of Electronics Packaging Fundamentals to Photovoltaic Interconnects and Packaging

Laura Spinella, Nick Bosco
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 7–9, 2019
Paper No: IPACK2019-6520
https://doi.org/10.1115/IPACK2019-6520
View Paper titled, Application of Electronics Packaging Fundamentals to Photovoltaic Interconnects and Packaging
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Topics: Electronic packaging, Fatigue, Packaging, Simulation, Solders, Thermomechanics, Reliability, Climate, Architecture, Electronics
Proceedings Papers

The Role of Interfacial Thermal Resistance in Li-Ion Battery Thermal Management

Chuanbo Yang, Lei Cao
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 7–9, 2019
Paper No: IPACK2019-6594
https://doi.org/10.1115/IPACK2019-6594
View Paper titled, The Role of Interfacial Thermal Resistance in Li-Ion Battery Thermal Management
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Topics: Interfacial thermal resistance, Lithium-ion batteries, Modeling, Thermal management
Proceedings Papers

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermo-Mechanical Simulation

Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, August 29–September 1, 2017
Paper No: IPACK2017-74138
https://doi.org/10.1115/IPACK2017-74138
View Paper titled, Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermo-Mechanical Simulation
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Topics: Cracking (Materials), Fracture (Process), High temperature, Simulation, Thermomechanics, Transients (Dynamics), Tension-leg platforms, Stress, Fracture (Materials), Tin
Proceedings Papers

Electrothermal Analysis of the Field-Plated AlGaN/GaN HEMTs With SiO 2 Passivation

Dogacan Kara, F. Nazli Donmezer Akgun
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A011, August 29–September 1, 2017
Paper No: IPACK2017-74125
https://doi.org/10.1115/IPACK2017-74125
View Paper titled, Electrothermal Analysis of the Field-Plated AlGaN/GaN HEMTs With SiO 2 Passivation
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Topics: Gallium nitride, Plates (structures), Collapse, Electrons, Heating, Reliability, Electric fields, Electron mobility, Engineering simulation, Joules
Proceedings Papers

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, August 29–September 1, 2017
Paper No: IPACK2017-74169
https://doi.org/10.1115/IPACK2017-74169
View Paper titled, Lead-Free Alternatives for Interconnects in High-Temperature Electronics
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Topics: Electronics, High temperature, Alloys, Fracture (Materials), Deformation, Shear strength, Solders, Tension, Thermal conductivity, Brittleness
Proceedings Papers

Power Packaging Thermal and Stress Model for Quick Parametric Analyses

L. M. Boteler, S. M. Miner
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A012, August 29–September 1, 2017
Paper No: IPACK2017-74130
https://doi.org/10.1115/IPACK2017-74130
View Paper titled, Power Packaging Thermal and Stress Model for Quick Parametric Analyses
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Topics: Packaging, Stress, Finite element analysis, Design, Matlab, Temperature, Thermal stresses, Computer-aided design, Resistors, Computer-aided engineering
Proceedings Papers

Transient and Steady State Thermal Response of a System With Thermoelectric Coolers

Kayvan Abbasi, Sukhvinder Kang
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, August 29–September 1, 2017
Paper No: IPACK2017-74015
https://doi.org/10.1115/IPACK2017-74015
View Paper titled, Transient and Steady State Thermal Response of a System With Thermoelectric Coolers
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Topics: Steady state, Thermoelectric coolers, Transients (Dynamics), Thermal resistance, Eigenfunctions, Eigenvalues, Insulation, Thermal systems
Proceedings Papers

Integrated Vapor Chamber Heat Spreader for Power Module Applications

Clayton L. Hose, Dimeji Ibitayo, Lauren M. Boteler, Jens Weyant, Bradley Richard
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A013, August 29–September 1, 2017
Paper No: IPACK2017-74132
https://doi.org/10.1115/IPACK2017-74132
View Paper titled, Integrated Vapor Chamber Heat Spreader for Power Module Applications
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Topics: Flat heat pipes, Vapors, Heat, Heat flux, Copper, Electronics, Flux (Metallurgy), Thermal resistance, Flow (Dynamics), Modeling
Proceedings Papers

Thermal Metamaterials for Heat Flow Control in Electronics

Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, August 29–September 1, 2017
Paper No: IPACK2017-74112
https://doi.org/10.1115/IPACK2017-74112
View Paper titled, Thermal Metamaterials for Heat Flow Control in Electronics
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Topics: Electronics, Flow control, Heat, Metamaterials, Flow (Dynamics), Anisotropy, Blocks (Building materials), Circuit design, Composite materials, Design
Proceedings Papers

Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond for Use in Electronics Thermal Management

Luke Yates, Ramez Cheaito, Aditya Sood, Zhe Cheng, Thomas Bougher, Mehdi Asheghi, Kenneth Goodson, Mark Goorsky, Firooz Faili, Dan Twitchen, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A014, August 29–September 1, 2017
Paper No: IPACK2017-74163
https://doi.org/10.1115/IPACK2017-74163
View Paper titled, Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond for Use in Electronics Thermal Management
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Topics: Electronics, Synthetic diamonds, Thermal conductivity, Thermal management, Diamonds, Chemical vapor deposition, Electron backscatter diffraction, Lasers, Boron, Heat flux
Proceedings Papers

High-Performance Microchannels Development Using Magnetic Stabilization

Seth Newport, Geoffrey Ormston, Michael Benedict, Ayyoub Mehdizadeh Momen
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A007, August 29–September 1, 2017
Paper No: IPACK2017-74147
https://doi.org/10.1115/IPACK2017-74147
View Paper titled, High-Performance Microchannels Development Using Magnetic Stabilization
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Topics: Microchannels, Particulate matter, Pressure drop, Heat transfer, Ferrites (Magnetic materials), Flow (Dynamics), Heat, Manufacturing, Mass transfer, Packing (Shipments)
Proceedings Papers

3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging

Sayan Seal, Andrea K. Wallace, John E. Zumbro, H. Alan Mantooth
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A015, August 29–September 1, 2017
Paper No: IPACK2017-74213
https://doi.org/10.1115/IPACK2017-74213
View Paper titled, 3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging
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Topics: Packaging, Silicon, Wire, MOSFET transistors, Bonding, Electromagnetic interference, Electronics, Energy gap, Flip-chip, High temperature
Proceedings Papers

Meshed Photonic Crystals for Manipulating Near-Field Thermal Radiation Across Variable Nano/Micro Gap

Mahmoud Elzouka, Sidy Ndao
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A008, August 29–September 1, 2017
Paper No: IPACK2017-74212
https://doi.org/10.1115/IPACK2017-74212
View Paper titled, Meshed Photonic Crystals for Manipulating Near-Field Thermal Radiation Across Variable Nano/Micro Gap
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Topics: Crystals, Thermal radiation, Heat transfer, Heat, Flow (Dynamics), Radiative heat transfer, Vacuum, Electronics, Engineering prototypes, Numerical analysis
Proceedings Papers

Development of Packaging and Modular Control of Thermoelectric Clothes Dryer, With Performance Evaluation

Viral K. Patel, Kyle R. Gluesenkamp
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A009, August 29–September 1, 2017
Paper No: IPACK2017-74243
https://doi.org/10.1115/IPACK2017-74243
View Paper titled, Development of Packaging and Modular Control of Thermoelectric Clothes Dryer, With Performance Evaluation
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Topics: Design, Drying, Electrical resistance, Energy consumption, Energy efficiency, Engineering prototypes, Heat pumps, Heating, Modeling, Optimization
Proceedings Papers

Voiding Effects on the Thermal Response of Metallic Phase Change Materials Under Pulsed Power Loading

David Gonzalez-Nino, Lauren M. Boteler, Nicholas R. Jankowski, Dimeji Ibitayo, Pedro O. Quintero
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, August 29–September 1, 2017
Paper No: IPACK2017-74118
https://doi.org/10.1115/IPACK2017-74118
View Paper titled, Voiding Effects on the Thermal Response of Metallic Phase Change Materials Under Pulsed Power Loading
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Topics: Phase change materials, Heat, Silicon nitride ceramics, Temperature, Cooling, Cooling systems, Cycles, Inspection, Optical quality control, Temperature profiles
Proceedings Papers

The Performance Enhancement of a Heat Pipe for Power Electronics Cooling With a Partially Applied Hybrid Wick

Joon Hong Boo, Hyun Gon Kim, Chang Woo Han
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A010, August 29–September 1, 2017
Paper No: IPACK2017-74095
https://doi.org/10.1115/IPACK2017-74095
View Paper titled, The Performance Enhancement of a Heat Pipe for Power Electronics Cooling With a Partially Applied Hybrid Wick
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Topics: Computer cooling, Heat pipes, Stress, Thermal resistance, Fluids, Wire screens, Containers, Cooling, Copper, Density
Proceedings Papers

Optimization of Graphite Composite Latent Heat Storage Systems

Anne Mallow, Kyle Gluesenkamp, Omar Abdelaziz, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, August 29–September 1, 2017
Paper No: IPACK2017-74244
https://doi.org/10.1115/IPACK2017-74244
View Paper titled, Optimization of Graphite Composite Latent Heat Storage Systems
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Topics: Composite materials, Graphite, Latent heat, Optimization, Storage, Density, Temperature, Heat, Power density, Thermal conductivity