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Modeling and Characterization of Electronic and Photonic Systems
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Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1365-1370, July 17–22, 2005
Paper No: IPACK2005-73021
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1371-1374, July 17–22, 2005
Paper No: IPACK2005-73035
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1575-1581, July 17–22, 2005
Paper No: IPACK2005-73437
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1379-1387, July 17–22, 2005
Paper No: IPACK2005-73051
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1433-1440, July 17–22, 2005
Paper No: IPACK2005-73213
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1455-1458, July 17–22, 2005
Paper No: IPACK2005-73237