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Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 761-767, July 19–23, 2009
Paper No: InterPACK2009-89110
... -1- Proceedings of IPACK2009 ASME InterPACK 09 July 17 21, 2009, San Francisco, California, USA IPACK2009-89110 System Level Transient Thermal Performance of High-Power Dynamic Microelectronics Victor Chiriac Technology Solutions Organization Freescale Semiconductor Inc. 2100 E. Elliot Road...
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 233-239, July 8–12, 2007
Paper No: IPACK2007-33705
... 1 Copyright ©2007 by ASME Proceedings of IPACK2007 ASME InterPACK '07 July 8-12, 2007, Vancouver, British Columbia, CANADA IPACK2007-33705 THERMAL PERFORMANCE EVALUATION AND ENHANCEMENT FOR AN AUTOMOTIVE WIRELESS APPLICATION INCORPORATING MULTIPLE DYNAMIC HEAT SOURCES Victor Chiriac and Tien-Yu...
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 363-370, July 6–11, 2003
Paper No: IPACK2003-35167
... of transistors are used in circuit and chip design, since dealing with details of transistor physics at the circuit level would lead to intractable problems. Design and manufacturing of electronic components are usually made by papers Sabry [1 Dynamic compact thermal models of devices are also of paramount...