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Keywords: packages
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Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 241-247, July 8–12, 2007
Paper No: IPACK2007-33707
... 12 01 2010 The conjugate thermal performance of microelectronics module incorporating several power packages and additional passive components in a custom environment is evaluated and further optimized using numerical simulation and experimental validation. The automotive industry...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 113-118, July 17–22, 2005
Paper No: IPACK2005-73100
... 03 04 2009 The conjugate thermal performance of a microelectronics module incorporating several power packages and additional passive components in a custom environment is evaluated and further optimized using numerical simulation and experimental validation. The automotive industry...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 363-370, July 6–11, 2003
Paper No: IPACK2003-35167
...3URFHHGLQJV RI ,3QWHUQDWLRQDO (OHFWURQLF 3DFNDJLQJ 7HFKQLFDO &RQIHUHQFH DQGKLELWLRQ Proceedings of IPACK03 International Electronic Packaging Technical Conference and Exhibition July 6-11, 2003, Maui, Hawaii, USA 1 Copyright © 2003 by ASME interfere at all levels, and we need to predict system...