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Keywords: thermal management
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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 26–28, 2021
Paper No: IPACK2021-70410
... open-cell copper metal foam WP model effective thermal conductivity thermal management ECU cooling Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2021 October 26-28, 2021, Virtual...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 26–28, 2021
Paper No: IPACK2021-74010
...Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2021 October 26-28, 2021, Virtual, Online IPACK2021-74010 MICROCHANNEL HEAT SINK FOR THERMAL MANAGEMENT OF CONCENTRATED PHOTOVOLTAIC CELLS...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 26–28, 2021
Paper No: IPACK2021-69254
... with lower thermal resistance. To this end, Keywords: Electronics Cooling; Thermal Interface Material; high conductivity thermal paste or similar thermal interface Thermal management; Electronics Packaging, Graphene; materials (TIMs), reinforced with superior thermal conductivity Thermal Conductance...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A009, October 26–28, 2021
Paper No: IPACK2021-73287
... Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2021 October 26-28, 2021, Virtual, Online IPACK2021-73287 CHARACTERIZATION OF HIGH-DENSITY AIRCRAFT ELECTRONIC AND THERMAL MANAGEMENT SYSTEMS...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 26–28, 2021
Paper No: IPACK2021-69321
... are not effective. A PCM Design Tool, Index Parameter, Thermal Management, Pulse composite can be visualize as a thermal valve where, during Electronics. energy peaks, the composite enhances the thermal conduction to V001T04A003-1 Copyright © 2021 by ASME the steady state thermal solution (e.g. heat sink or cold...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 27–29, 2020
Paper No: IPACK2020-2550
... 2National Renewable Energy Laboratory, Golden, CO, USA ABSTRACT One of the key challenges for the electric vehicle industry is to develop high-power-density electric motors. Achieving higher power density requires efficient heat removal from inside the motor. In order to improve thermal management, a multi...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 27–29, 2020
Paper No: IPACK2020-2609
.... The resulting digital twin model provides additional data that cannot be measured offering the EV industry an opportunity to improve its safety record. Keywords: Thermal management, Li-ion battery, Simulation, Digital Twin, Electric vehicle, Reduced order model. NOMENCLATURE A section area 1 dynamic charge...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A010, October 27–29, 2020
Paper No: IPACK2020-2670
... 300 W per GPU in an immersion cooling solution. immersion cooling dielectric fluid single phase thermal management EVALUATION OF SINGLE PHASE IMMERSION COOLING SYSTEM FOR HIGH PERFORMANCE SERVER CHASSIS USING DIELECTRIC COOLANTS Shuai Shao1, Tianyi Gao1, Huawei Yang1, Jie Zhao2, Jiajun...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A023, October 7–9, 2019
Paper No: IPACK2019-6519
...A NUMERICAL INVESTIGATION OF ADDITIVE MANUFACTURED FOAM STRUCTURES FOR SINGLE PHASE HOTSPOT THERMAL MANAGEMENT Justin Broughton and Yogendra Joshi The George W. Woodruff School of Mechanical Engineering Georgia Institute of Technology, Atlanta, GA, USA ABSTRACT Wide band-gap (WBG) power devices...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A014, October 7–9, 2019
Paper No: IPACK2019-6440
... pulse conditions using both thermoreflectance thermal imaging and Raman thermometry with temporal resolutions down to 15 ns. Keywords: Gallium nitride (GaN), high electron mobility transistor (HEMT), power electronics, Raman thermometry, self-heating, thermal dynamics, thermal management...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 7–9, 2019
Paper No: IPACK2019-6594
...THE ROLE OF INTERFACIAL THERMAL RESISTANCE IN LI-ION BATTERY THERMAL MANAGEMENT Chuanbo Yang1, Lei Cao National Renewable Energy Laboratory Golden, CO ABSTRACT Temperature critically affects the performance, life and safety of lithium-ion batteries. Therefore, it is essential to understand heat...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A026, October 7–9, 2019
Paper No: IPACK2019-6559
...Abstract Abstract Thermal management of high-power electronics is often a major obstacle in achieving improved packaging density. Emergence of SiC devices allows higher voltage and temperature limits, but thermal management is still a bottleneck in achieving compact, reliable and high...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 7–9, 2019
Paper No: IPACK2019-6457
... Heat dissipated through target s top surface S Distance between nozzle and target surface 1 Contact author: bidzina.kekelia@nrel.gov Fluid temperature at nozzle inlet Target surface temperature Lower thermocouple temperature Upper thermocouple temperature INTRODUCTION Thermal management of electric...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A004, July 16–18, 2013
Paper No: IPACK2013-73166
.... Compared to other technologies such as System-on-Chip (SoC) or System-in-Package (SiP), interposer-based integration offers several technological advantages. However, the thermal management of an interposer-based system is not well understood. The presence of multiple heat sources in various die...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A002, July 16–18, 2013
Paper No: IPACK2013-73031
... diodes, LEDs, Liquid cooling, thermal management, electronics cooling, design optimization. * Graduate student, Department of Mechanical Engineering ** Associate professor, Department of Mechanical Engineering Presently with Cisco Systems Inc., Technical Leader, 425 E Tasman Dr. San Jose, CA 95134 USA...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 615-618, July 19–23, 2009
Paper No: InterPACK2009-89398
... 07 01 2011 As the microelectronics industry continues to trend towards smaller, lighter, and higher power devices, thermal management is becoming more important than ever. Thermal interface materials (TIMs) play a crucial role in removing heat from both bare die and lidded packages...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 273-282, July 19–23, 2009
Paper No: InterPACK2009-89076
... design was proposed by eliminating the fin material at the center of the heat sink, thereby enhancing its thermal performance. Computational Fluid Dynamics electronics cooling heat sinks heat sink optimization heat sink with fan Impingement flow Impingement heat sink thermal management...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 147-158, July 19–23, 2009
Paper No: InterPACK2009-89289
... hot spots with heat fluxes approaching and at times exceeding 1 kW/cm2. The cost-effective thermal management of such chips requires the introduction and refinement of novel cooling techniques. Mini-contact enhanced, miniaturized thermoelectric coolers (TECs) have been shown to be a viable...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1025-1032, July 19–23, 2009
Paper No: InterPACK2009-89377
...: Lang.Yuan@us.fujitsu.com phone: 845-731-2218 Jignesh Patel Fujitsu Network Communications, Inc Pearl River, NY 10965 e-mail: Jignesh.Patel@us.fujitsu.com phone: 845-731-2260 ABSTRACT The thermal management of next-generation telecommunications equipment is becoming more challenging than ever before, thanks...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 249-258, July 8–12, 2007
Paper No: IPACK2007-33798
... for thermal management of today’s IC technology. This paper describes the novel use of thermoelectric coolers for on-chip hot spot cooling through the use of a copper mini-contact pad, which connects the thermoelectric cooler and the silicon chip thus concentrating the thermoelectric cooling power. A package...