Search Results | MNC | ASME Digital Collection

1-20 of 416

2 3 4 5

Sort by

Sort Order Select

Proceedings Papers

Fabrication of Al Micro-Coil and Loop by Utilizing Electromigration

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 589-592, June 3–5, 2008

Paper No: MicroNano2008-70073

DOI: https://doi.org/10.1115/MicroNano2008-70073

View Paper

Topics: Electrodiffusion, Manufacturing, Fibers, Aluminum, Anodes, Atoms, Crystallization, Current density, Temperature

Proceedings Papers

Improvement of Printed Circuit Board Assembly Process in 2.4GHz RF Circuit Products

Mu-Chun Wang, Zhen-Ying Hsieh, Ting-Yu Yang, Chia-Hao Tu, Shuang-Yuan Chen

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 737-741, June 3–5, 2008

Paper No: MicroNano2008-70093

DOI: https://doi.org/10.1115/MicroNano2008-70093

View Paper

Topics: Circuits, Printed circuit board assemblies, Electronic components, Copper, Energy dissipation, Shapes, Temperature, Assembly lines, Circuit design, Contact resistance

Proceedings Papers

PFPE Modified Silicon Nano-Textured Surfaces for Adhesion and Friction Reduction

Ying Song, Hengyu Wang, Min Zou

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 65-67, June 3–5, 2008

Paper No: MicroNano2008-70144

DOI: https://doi.org/10.1115/MicroNano2008-70144

View Paper

Topics: Adhesion, Crystallization, Friction, Silicon

Proceedings Papers

Visualization of Micro Vapor Bubble Dynamic Behaviors in Open Capillary Microgrooves

Xuegong Hu, Liyuan Wu, Dawei Tang

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 395-400, June 3–5, 2008

Paper No: MicroNano2008-70244

DOI: https://doi.org/10.1115/MicroNano2008-70244

View Paper

Topics: Bubbles, Vapors, Visualization, Microbubbles, Collapse, Heat transfer, Image processing, Matlab, Nucleate boiling, Theoretical analysis

Proceedings Papers

Total Internal Reflection (TIR) Lens Design for Surface Mount Techonology (SMT) LED Application

JaeYoung Joo, Do Kyun Woo, ChaBum Lee, SunKyu Lee

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 105-106, June 3–5, 2008

Paper No: MicroNano2008-70261

DOI: https://doi.org/10.1115/MicroNano2008-70261

View Paper

Topics: Design, Lenses (Optics), Reflection, Surface mount packaging, Diamond turning, Geometry, Matlab, Simulation results, Surface mount technology

Proceedings Papers

A DSMC Study of the Si/Ge Interface Thermal Resistance

Mei-Jiau Huang, Dong-Jiun Tsai, Liang-Chun Liu

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 455-460, June 3–5, 2008

Paper No: MicroNano2008-70330

DOI: https://doi.org/10.1115/MicroNano2008-70330

View Paper

Topics: Thermal resistance, Phonons, Simulation, Simulation results, Acoustics, Approximation, Dispersion relations, Reflection, Relaxation (Physics), Temperature

Proceedings Papers

Characterizing Metallization Introduced Polysilicon Corrosion of Surface Micromachined Structures With Submicron Capacitive Gap

Yunda Wang, Ming Cai, Ying Wang, Jing Chen

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 51-54, June 3–5, 2008

Paper No: MicroNano2008-70116

DOI: https://doi.org/10.1115/MicroNano2008-70116

View Paper

Topics: Corrosion, Micromachining, Polysilicon

Proceedings Papers

Study of Package Technologies for Implantable Microdevices

Weihong Li, Zhenjiang Shi, Hang Guo, Shiqing Chen, Xiuhan Li, Haixia Zhang

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 167-170, June 3–5, 2008

Paper No: MicroNano2008-70194

DOI: https://doi.org/10.1115/MicroNano2008-70194

View Paper

Topics: Circuits, Packaging, Resonance, Silicones, Thin films

Proceedings Papers

Study on the Shockwave Pressure Testing Method for Detonating Cords

Ying-Wei Bai, Zhuang-De Jiang, Yu-Long Zhao, En-Yi Chu, Kexuan Wang

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 303-307, June 3–5, 2008

Paper No: MicroNano2008-70078

DOI: https://doi.org/10.1115/MicroNano2008-70078

View Paper

Topics: Cordage, Pressure testing, Shock waves

Proceedings Papers

Relationship Between Distance of Photonic Crystal Rods Array and Wavelength of Light Propagating in Right-Angular, Cross, and Y-Shapes Waveguide

Meng-Ju Lin

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 225-230, June 3–5, 2008

Paper No: MicroNano2008-70307

DOI: https://doi.org/10.1115/MicroNano2008-70307

View Paper

Topics: Crystals, Rods, Shapes, Waveguides, Wavelength, Bifurcation, Artificial neural networks, Columns (Structural), Computer software, Finite element methods

Proceedings Papers

Numerical Analysis of Dry Gas Face Seals With Spiral Groove and Inner Annular Groove

Xu-Dong Peng, Li-Li Tan, Ji-Yun Li, Song-En Sheng, Shao-Xian Bai

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 73-77, June 3–5, 2008

Paper No: MicroNano2008-70185

DOI: https://doi.org/10.1115/MicroNano2008-70185

View Paper

Topics: Finite element methods, Leakage, Numerical analysis, Optimization, Sealing (Process), Stiffness

Proceedings Papers

Fabrication of a Novel Resonant Pressure Sensor Based on SOI Wafer

Zhibo Ma, Sen Ren, Dayong Qiao, Weizheng Yuan

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 593-596, June 3–5, 2008

Paper No: MicroNano2008-70079

DOI: https://doi.org/10.1115/MicroNano2008-70079

View Paper

Topics: Manufacturing, Pressure sensors, Resonance, Semiconductor wafers, Silicon-on-insulator, Diaphragms (Mechanical devices), Diaphragms (Structural), Pressure, Silicon, Chemical etching

Proceedings Papers

A NEMD Study of the Thermal Conductivity and Surface Roughness of Silicon Thin Films

Tai-Ming Chang, Chien-Chou Weng, Mei-Jiau Huang

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 461-466, June 3–5, 2008

Paper No: MicroNano2008-70331

DOI: https://doi.org/10.1115/MicroNano2008-70331

View Paper

Topics: Silicon, Surface roughness, Thermal conductivity, Thin films, Temperature, Atoms, Simulation, Boundary-value problems, Computation, Evaporation

Proceedings Papers

Leakage Current Influence on Microdevice Performance and Reliability

Oren Lahav, Its’hak Yomtovian, Lior Kogut

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 39-42, June 3–5, 2008

Paper No: MicroNano2008-70097

DOI: https://doi.org/10.1115/MicroNano2008-70097

View Paper

Topics: Leakage, Reliability, Currents, Failure

Proceedings Papers

Hermetic Packaging Technique Featuring Through-Wafer Interconnects and Low Temperature Direct Bond

James Lee, Tony Rogers

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 107-112, June 3–5, 2008

Paper No: MicroNano2008-70288

DOI: https://doi.org/10.1115/MicroNano2008-70288

View Paper

Topics: Low temperature, Packaging, Semiconductor wafers, Bonding, Silicon, Vacuum, Complementary metal oxide semiconductors, Damage, Electrodes, Integrated systems

Proceedings Papers

Preparation and Characterization of Pt/WO 3 Nano-Film and Its Hydrogen-Sensing Properties

Changjun Hou, Jiale Dong, Yan Xu, Danqun Huo, Yike Tang, Jun Yang

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 231-236, June 3–5, 2008

Paper No: MicroNano2008-70010

DOI: https://doi.org/10.1115/MicroNano2008-70010

View Paper

Topics: Hydrogen, Ions, Tungsten, Crystals, Atomic force microscopy, Catalysts, Electric potential, Membranes, Metal oxide semiconductors, Platinum

Proceedings Papers

Dynamics Evolution of Shock Waves in Laser-Material Interaction

Sobieslaw Gacek, Xinwei Wang

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 667-675, June 3–5, 2008

Paper No: MicroNano2008-70181

DOI: https://doi.org/10.1115/MicroNano2008-70181

View Paper

Topics: Dynamics (Mechanics), Laser materials, Shock waves, Absorption, Density, Engineering simulation, Lasers, Molecular dynamics, Plumes (Fluid dynamics), Pressure

Proceedings Papers

Analysis of Electrostatically Actuated Narrow Microcantilevers Using Rayleigh-Ritz Energy Technique

Manish M. Joglekar, Kedar Y. Hardikar, Dnyanesh N. Pawaskar

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 309-319, June 3–5, 2008

Paper No: MicroNano2008-70130

DOI: https://doi.org/10.1115/MicroNano2008-70130

View Paper

Topics: Microcantilevers, Accounting, Algebra, Algorithms, Boundary-value problems, Capacitance, Deflection, Design, Displacement, Microelectromechanical systems

Proceedings Papers

Design and Fabrication of a Micro-Knife for Minimally Invasive Surgery

Hang Guo, Hui Yang, Liming Zou

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 171-173, June 3–5, 2008

Paper No: MicroNano2008-70195

DOI: https://doi.org/10.1115/MicroNano2008-70195

View Paper

Topics: Design, Manufacturing, Surgery, Displacement, Finite element methods, Microfabrication, Oscillating frequencies, Shapes, Silicon, Vibration

Proceedings Papers

Thermal Control for Droplet-Based Microfluidics

Nam-Trung Nguyen

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 523-528, June 3–5, 2008

Paper No: MicroNano2008-70277

DOI: https://doi.org/10.1115/MicroNano2008-70277

View Paper

Topics: Drops, Microfluidics

2 3 4 5

NARROW

Fabrication of Al Micro-Coil and Loop by Utilizing Electromigration

Improvement of Printed Circuit Board Assembly Process in 2.4GHz RF Circuit Products

PFPE Modified Silicon Nano-Textured Surfaces for Adhesion and Friction Reduction

Visualization of Micro Vapor Bubble Dynamic Behaviors in Open Capillary Microgrooves

Total Internal Reflection (TIR) Lens Design for Surface Mount Techonology (SMT) LED Application

A DSMC Study of the Si/Ge Interface Thermal Resistance

Characterizing Metallization Introduced Polysilicon Corrosion of Surface Micromachined Structures With Submicron Capacitive Gap

Study of Package Technologies for Implantable Microdevices

Study on the Shockwave Pressure Testing Method for Detonating Cords

Relationship Between Distance of Photonic Crystal Rods Array and Wavelength of Light Propagating in Right-Angular, Cross, and Y-Shapes Waveguide

Numerical Analysis of Dry Gas Face Seals With Spiral Groove and Inner Annular Groove

Fabrication of a Novel Resonant Pressure Sensor Based on SOI Wafer

A NEMD Study of the Thermal Conductivity and Surface Roughness of Silicon Thin Films

Leakage Current Influence on Microdevice Performance and Reliability

Hermetic Packaging Technique Featuring Through-Wafer Interconnects and Low Temperature Direct Bond

Preparation and Characterization of Pt/WO 3 Nano-Film and Its Hydrogen-Sensing Properties

Dynamics Evolution of Shock Waves in Laser-Material Interaction

Analysis of Electrostatically Actuated Narrow Microcantilevers Using Rayleigh-Ritz Energy Technique

Design and Fabrication of a Micro-Knife for Minimally Invasive Surgery

Thermal Control for Droplet-Based Microfluidics

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only