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Keywords: back sputtering
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Proceedings Papers

Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 587-589, January 10–13, 2007
Paper No: MNC2007-21560
... 11 06 2009 Proceedings of MNC2007 MicroNanoChina07 January 10-13, 2007, Sanya, Hainan, China photoresist is introduced in this paper, and high quality metallic pattern could be made. Keywords: back sputtering, dual layer photoresist, lift-off 1. INTRODUCTION Lift-off is a simple...