The safety of high pressure and high temperature components is paramount, and therefore, developing effective and reliable methodologies to improve the prediction of crack propagation is an important task. The present paper describes and demonstrates a multi-physics numerical analysis approach for assessing crack propagation using a sensor device. This method employs a coupled structural-thermal-electric analysis in conjunction with a thermal-fluid-structure interaction analysis to study the structural health of a high pressure and high temperature component.
Monitoring Crack Propagation of High Pressure and High Temperature Components by Multi-Physics Numerical Analysis Approach
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Ahmadi Moghaddam, HR, & Mertiny, P. "Monitoring Crack Propagation of High Pressure and High Temperature Components by Multi-Physics Numerical Analysis Approach." Proceedings of the ASME 2017 Pressure Vessels and Piping Conference. Volume 4: Fluid-Structure Interaction. Waikoloa, Hawaii, USA. July 16–20, 2017. V004T04A010. ASME. https://doi.org/10.1115/PVP2017-66153
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