A simple, easy-to-apply and physically meaningful analytical (“mathematical”) stress model is developed for the prediction of the thermally induced stresses in a circular adhesively bonded assembly with identical adherends. The assembly is fabricated at an elevated temperature and is subsequently cooled down to a lower temperature. The developed model can be helpful for stress-strain analyses and physical design of electronic and photonic assemblies of the type in question, and particularly those employed in holographic memory systems.
Predicted Thermal Stresses in a Circular Assembly With Identical Adherends and With Application to a Holographic Memory Package Design
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Suhir, E., Gu, C., and Cao, L. (December 13, 2011). "Predicted Thermal Stresses in a Circular Assembly With Identical Adherends and With Application to a Holographic Memory Package Design." ASME. J. Appl. Mech. January 2012; 79(1): 011011. https://doi.org/10.1115/1.4005192
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